XR2682

XR2682 ______________________________________ ____________________________________________________ _______________________________ 3.3V~5V Input 12W Output Step-up DC/DC Converter GENERAL DESCRIPTION FEATURES    The XR2682 is a high frequency, high efficiency DC to DC converter with an integrated 6A, 40mΩ power switch capable of providing an output voltage up to 24V. The fixed 600KHz allows the use of small external inductions and capacitors and provides fast transient response. It integrates Soft start, Comp,. only need few components outside. It can output 6V 2A、9V 1.3A for single battery input. If Vbat=3.6V, it can output 6V 2.5A、9V 1.5A at good heat dissipation condition.       2.7V to 5.5V input voltage Range Efficiency up to 96% 24V Boost converter with 6A switch current Limit 600KHz fixed Switching Frequency Integrated soft-start Thermal Shutdown Under voltage Lockout Upward pin-to-pin compatible XR2981 8-Pin SOP-PP Package APPLICATIONS Portable Audio Amplifier Power Supply Power Bank QC 2.0/Type C Wireless Charger POS Printer Power Supply Small Motor Power Supply L 2.2uH 6A D 20V 3A Vin 3.3V~4.2V 3,4 Cby 1uF 16V Cin 220uF 6.3V 5 22uF 10V 7,8 VDD SW EN FB Vout 6V 2A 1,2 R1 38K Cout R2 10K 22uF 10V 6 GND/EPAD 220uF 16V Figure 1. Typical Application Circuit1 （for Single cell Li-Battery) Suzhou XySemi Electronic Technology Co., Limited. -1- www.xysemi.com.cn Rev 0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ Figure 2. Typical Application Circuit2 （for Dual cell Li-Battery) ORDERING INFORMATION PART NUMBER TEMP RANGE SWICHING FREQUENCY OUTPUT VOLTAGE (V) ILIM (A) PACKAGE PINS XR2682 -40°C to 85°C 600KHZ ADJ 6 SOP-PP 8 Suzhou XySemi Electronic Technology Co., Limited. -2- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ PIN CONFIGURATION Figure 3. PIN Configuration PIN DESCRIPTION PIN NUMBER PIN NAME 1,2 SW 3 PVDD Input power supply pin, please connect with Cin close asp 4 AVDD Boost IC Logic power supply pin，if far from Cin, please add one 1uF MLCC close asp 5 EN Shutdown control input., Connect this pin to logic high level to enable the device 6 FB Feedback pin 7 AGND Analog ground 8 PGND Power ground EPAD PGND Please connect with PGND & AGND by mass metal for Low Rdson 、High efficiency & Good heat dissipation PIN DESCRIPTION Switch pin Suzhou XySemi Electronic Technology Co., Limited. -3- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ ABSOLUTE MAXIMUM RATINGS (Note: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability.) PARAMETER VALUE UNIT Supply Voltage VIN -0.3 to 6.5 V FB, EN Voltage -0.3 to 6.5 V SW Voltage Operating Ambient Temperature -0.3 to 26V V -40 to 85 °C 150 °C -55 to 150 °C 300 °C Maximum Junction Temperature Storage Temperature Lead Temperature (Soldering, 10 sec) ELECTRICAL CHARACTERISTICS (VIN = 3.6V, TA= 25C unless otherwise specified) PARAMETER Input Voltage Range Boost output voltage range SYMBOL TEST CONDITIONS MIN VIN 2.7 Vout 24 TYP MAX UNIT 5.5 V V UVLO Low Threshold VUVLOL 2.6 V UVLO High Threshold VUVLOH 3.2 V Operating Supply Current 100 VFB =1.5V，EN=Vin, ILoad =0 ISUPPLY Shutdown Supply Current µA VEN =0V, VIN =3.6V Regulated Feedback Voltage VFB Peak Inductor Current IPEAK Oscillator Frequency FOSC 1.21 1.24 1.27 6 400 Rds(ON) of N-channel FET ISW =1A Enable Threshold VIN = 2.7V to 5.5V 0.3 -0.1 VEN = 0V, VSW = 0V or 5V, VIN = 5V Suzhou XySemi Electronic Technology Co., Limited. 600 -4- 1 V A 800 40 Enable Leakage Current SW Leakage Current 1 KHz mΩ 1.5 V 0.1 µA 1 uA www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ Figure 4. Functional Block Diagram FUNCTIONAL DESCRIPTION amplifier. The control loop, determined by the error amplifier, only has to handle small signal errors. The input for it is the feedback voltage on the FB pin, the voltage on the internal resistor divider. It is compared with the internal reference voltage to generate an accurate and stable output voltage. NORMAL OPERATION The boost converter is designed for output voltage up to 24V with a 6A/24V power MOSFET. The low Rdson of the internal power switches enables better power efficiency. The chip, which operates in a current mode scheme with constant frequency 600KHz. It operates with Pulse With Modulation(PWM). To avoid the inrush current during power up, soft start circuit is integrated in the chip. CYCLE BY CYCLE CURRENT LIMIT The peak current of the NMOS switch is also sensed to limit the maximum current flowing through the switch and the inductor. The typical peak current limit is set to exceed 6A. The controller circuit of the device is based on a fixed frequency multiple feedback controller topology. Input voltage, output voltage, and voltage drop on the NMOS switch are monitored and feedback to the regulator. So changes in the operating conditions of the converter directly affect the duty cycle and must not take the indirect and slow way through the control loop and the error Suzhou XySemi Electronic Technology Co., Limited. UNDERVOLTAGE LOCKOUT (UVLO) Under voltage lockout prevents operation of the device at input voltages below typical 2.6V when the input voltage is falling. When the input voltage is below the under voltage threshold, the device is -5- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ shut down and the internal switch FETs are turned off. If the input voltage rises by under voltage lockout hysteresis(3.2V), the IC restarts. damages due to excessive heat and power dissipation. Typically the thermal shutdown THERMAL SHUTDOWN temperature falls below typically 136 ℃ .Then the device starts switching again. threshold is 150℃ .When the thermal shutdown is triggered the device stops switching until the A thermal shutdown is implemented to prevent APPLICATION INFORMATION INDUCTOR SELECTION In normal operation, the inductor maintains continuous current to the output. The inductor current has a ripple that is dependent on the inductance value. The high inductance reduces the ripple current. Selected inductor by actual application: Manufa Part Number Inductance cturer (uH) TDK WURT H DRC max (Ohms) Dimensions L*W*H(mm3) SPM6530T 2.2 0.017 7.1*6.5*3 CLF10040T 2.2 0.0097 10*9.7*3.8 2.2 0.012 2.2 0.012 74437349022 744311220 7.3*6.6*4.8 7.0*6.9*3.8 Table 1. Recommend Surface Mount Inductors Notes：Please select inductor according to I in. The IL need to be 1.5~2*I in. For getting higher efficiency, need to use low DRC inductors. INPUT CAPACITOR SELECTION The input capacitor reduces input voltage ripple to the converter, low ESR ceramic capacitor is highly recommended. For audio amplifier applications, A 22uF ceramic capacitor & 220uF E-cap is needed. low ESR tantalum capacitor is recommended for good ripple performance & dynamic response , The input capacitor should be placed as close as possible to VIN and GND. OUTPUT CAPACITOR SELECTION A low ESR output capacitor is required in order to maintain low output voltage ripple. In the case of ceramic output capacitors, capacitor ESR is very small and does not contribute to the ripple, so a lower capacitance value is acceptable when ceramic capacitors are used. For audio amplifier applications, A 22uF ceramic capacitor & 220uF E-cap is needed. low ESR tantalum capacitor is recommended for good ripple performance & dynamic response . Suzhou XySemi Electronic Technology Co., Limited. -6- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ OUTPUT VOLTAGE PROGRAMMING In the adjustable version, the output voltage is set by a resistive divider according to the following equation: Typically choose R2=10K and determine R1 from the following equation: DIODE SELECTION According to max Iout and max Vout, you can select suitable diode. Normally we select diode If=(1.5~2)*Ioutmax and VR=(1.5~2)*Voutmax. For high efficiency，suggest that you select low Vf Schottky diode. For example, 3.3V~4.2Vin 6V 2Aout, you can select SS54 or MBRS410. MBRS410 for high efficiency. LDO SELECTION For Typical Application Circuit2, you need to select higher) .Iout>=100mA.Output voltage is preferred to set 4.2V~4.5V. LDO--Input voltage range 4V~15V(or LDO need enough input & output capacity ,please select suitable external parts and layout them according to LDO‘s datasheet. Suzhou XySemi Electronic Technology Co., Limited. -7- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ LAYOUT CONSIDERATIONS 1：The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. to keep resistance very low and the switching loop very small for EMI performance 2：The FB pin connection should be made as close to the load as possible so that the voltage at the load is the expected regulated value. and place FB network far from Switching node. 3：Please make sure that the big current circuits are board and short to reduce the circuit Rdson , All ground connection must be tied together. Use a broad ground plane to establish the lowest resistance possible between all connections to achieve the best thermal and noise performance. 4: The switch node connection should be low resistance to reduce power losses. 5:The heavy copper board in big current output is recommended for high efficiency & good heat dissipation. L 2.2uH 6A D 20V 3A Vin 3.3V~4.2V 3,4 Cby 1uF 16V Cin 220uF 6.3V 5 VDD SW Switching Loop1 22uF 10V 7,8 EN FB GND/EPAD Vout 6V 2A 1,2 6 Switching Loop2 R1 38K Cout R2 10K 22uF 10V 220uF 16V PCB LAYOUT GUIDE TOP LAYER Suzhou XySemi Electronic Technology Co., Limited. BOTTOM LAYER -8- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ TYPICAL PERFORMANCE CHARACTERISTICS (L=2.2uH-Wurth 74437349022, Cin or Cout=22uF MLCC+220uF Ecap; D=MBRS410 ,if not mentioned) Note: Efficiency data is based on demo test at 20℃. If work at big current for long time, maybe thermal shutdown. its load capacity is related with heat dissipation conditions. 3.6Vin9Vout 50mA Switching Suzhou XySemi Electronic Technology Co., Limited. 3.6Vin9Vout 1A Switching -9- www.xysemi.com.cn Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ 3.6Vin12Vout 50mA Switching 3.6Vin12Vout 200mA Switching 3.6Vin12Vout 1A Switching 9Vout Startup from Vin Suzhou XySemi Electronic Technology Co., Limited. www.xysemi.com.cn 9Vout Startup from EN - 10 Rev0.4 XR2682 ______________________________________ ____________________________________________________ _______________________________ PACKAGE OUTLINE SOP8-PP PACKAGE OUTLINE AND DIMENSIONS SYMBOL A A1 A2 B C D E E1 e L  F G Dimension in Dimension in Millimeters Inches MIN MAX MIN MAX 1.35 1.75 0.053 0.069 0.100 0.250 0.004 0.010 1.350 1.550 0.053 0.061 0.330 0.510 0.013 0.020 0.190 0.250 0.007 0.010 4.700 5.100 0.185 0.201 3.800 4.000 0.150 0.157 5.800 6.300 0.228 0.248 1.27 TYP 0.050 TYP 0.400 1.270 0.016 0.050 0o 8o 0o 8o 2.26 2.56 0.089 0.101 3.15 3.45 0.124 0.136 In order to increase the driver current capability of XR2682 and improve the temperature of package, Please ensure Epad and enough ground PCB to release energy. Suzhou XySemi Electronic Technology Co., Limited. www.xysemi.com.cn - 11 Rev0.4