X3S024000DC1H-X

SPECIFICATIONS FOR APPROVAL GP Customer Part No. HELE. Part No: Application For: Products: Accepted Model: Type & Freq.: HSX321S / 24.000MHz Sample Order No: EOS-890160-7 X3S024000DC1H-X CRYSTAL Date: 2008/09/12 Approved By : HARMONY ELECTRONICS CORP. HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. TAIPEI OFFICE: 公司:(114) 台北市內湖區堤頂大道 2 段 409 號 2 樓 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN (R.O.C.) TEL:886-2-26588883 FAX:886-2-26588683 TAIWAN FACTORY: 工廠:(831) 高雄縣大寮鄉大發工業區華東路 39 號 NO. 39, HWA DONG RD., TA FA IND. DIST., TA LIAO KAOHSIUNG HSIEN 831, TAIWAN, R.O.C. TEL: (07)787-1555-6 FAX: (07)787-1557 Tittle HSX321S Date THAILAND FACTORY: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 70110, THAILAND TEL: (032)221994-6, 200740-1 FAX: (032)200742 Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. SHENZHEN FACTORY: 深圳市福永鎮塘尾村塘橋路聚源工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: 0755-7309272 / 7309262 FAX: 0755-7309755 TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 1 HSX321S SPECIFICATION INDEX ITEM PAGE 1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．． 3 2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．． 4 3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．． 5 4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．． 6 a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．． 6 b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．． 6-7 c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．． 7 d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．．．．．． 7 e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．． 7 f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．． 7 g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．． 8 h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．． 8 i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．． 8 5. MECHANICAL PERFORMANOE．．．．．．．．．．．．．．．．． 9 6. ENVIRONMENTAL PERFORMANOE．．．．．．．．．．．．．．． 9-10 7. SUPPLRMENT．．．．．．．．．．．．．．．．．．．．．．．． 10-11 8. FLOW CHARD．．．．．．．．．．．．．．．．．．．．．．．．． 12 9. Environmental Workload Chemical Substance Components List． 13 10. TEST DATA．．．．．．．．．．．．．．．．．．．．．．．．．． Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 2 1. QUARTZ CRYSTAL UNIT SPECIFICATION 1. Frequency: 24.000000MHz 2. Holder type : HSX321S 3. Frequency tolerance: +/-20ppm at 25deg.C +/-3deg.C 4. Equivalent resistance: 40ohms Max. / SERIES 5. Storage temperature range: -40 deg.C To +85 deg.C 6. Operable temperature range: -10 deg.C To +60 deg.C 7. Temperature drift: +/-20ppm 8. Loading capacitance (CL) : 12.0pF 9. Drive level: 10 μW (100μW Max) 10. Shunt Capacitance: 2.0pF Max 11. Insulation resistance : More than 500M ohms at DC 100V Fundamental 12. Mode of oscillation: Measured in S&A 250B , H P / E 5 1 0 0 A 13. Circuit: Dropping from 50 cm height 3 times on firm wood 14. Shocking : Frequency less than +/-5 ppm -10 deg.C To +60 deg.C Resistance less than +/- 15 ﹪or 2ohms max. Variation : Less than +/- 5 ppm/Year 15. Aging: HSX321S Seam type 16. Holder Refer to page.4 17.Dimensions and marking Refer to page.6 and page.7 18.Emboss carrier tape & reel 19.Note: Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 3 2. HSX321S MARKING & DIMENSIONS *Marking should be printed as following: Logo, Nominal Frequency, Manufactured year & month *Nominal frequency = integer only ( ex. 14.31818 MHz Æ 14 ) *Manufacturing Lot No. (Y: year) ex. 2000 shall be marked as ‘ 0 ’ (The last digit of the year) (M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-1). Marking : Laser marking. (Table-1) Jan. A Feb. B Mar. C Apr. D May. E Jun. F Tittle HSX321S Date Jul. G Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. Aug. H Sep. J Oct. K Nov. L TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Dec. M Page 4 3. INSIDE STRUCTURE ※Reference drawing (1) Base: Alumina Ceramic (Al2O3) Metallized Pad: W Ni Plating Au Plating (2) Cap: Fe-Ni (3) Crystal Enclosure Seal: Seal Seam (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) Adhesive Silver Conductive Silicon Resin Adhesive bonding: upper & lower bonding/lower bonding only (6) Electrode Ag (7) PAD Alumina Ceramic (W. Ni. Au) Tittle HSX321S Date The use prohibition chemistry substance of Table 1 of DHE-0204-1 (QA-QM-08) is not included in this item. Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 5 4. HSX321S EMBOSS CARRIER TAPE & REEL a.) Dimensions of Carrier Tape b.) Dimensions of Reel Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 6 (Table-2) (UNIT: mm) MARK DIMENSIONS‧ANGLE Diameter A ψ178+1/-1 Inner Width W1 8.0+/-1.5 Outer Width W2 Out Line diameter B 11.5+/-0.2 ψ60+1.0/-0.0 F1 3.0+0.5/-0 F2 4.0+0.5/-0 F3 5.0+0.5/-0 q C 120deg ψ13+/-0.5 E 2.5+/-0.5/-0 ITEM FLANCE HUB Center Core slit Width Position Spindle diameter Key Ditch Width c.) Storage condition Temperature: +40deg.C Max. Relative Humidity: 80% Max. d.) Standard packing quantity 3,000PCS / REEL e.) Material of the tape Tape Carrier tape Top tape Material A – PET Polyester f.) Label contents .The type of product .Our specification No. .Your Part No. .Lot No. .Nominal Frequency .Quantity .Our Company Name Sticks label for every reel. Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 7 g.) Taping dimension Cover-tape Leader Carrier-tape Cover-tape Terminal Carrier-tape Terminal The length of cover-tape in the leader is more than 400 mm including empty embossed area. After all products were packaged, must remain more than twenty pieces or 400 mm empty area, which should be sealed by cover-tape. The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round. The empty embossed area which are sealed by top cover-tape must remain more the 40 mm. Components Leader Emptv compartments Emptv compartments Top cover-tape Embossed Carrier-tape h.) Joint of tape The carrier-tape and top cover-tape should not be jointed. i.) Release strength of cover tape It has to between 0.1N to 0.7N under following condition. Pulling direction 165° to 180° Speed 300mm/min. Otherwise unless specified. 165°~ 180° Pulling direction Other standards shall be based on JIS C 0806-1990. Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 8 5. Mechanical Performance 5.1.Natural Drop Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board The component shall satisfy requirement of the electrical characteristics. 5.2.Vibration Frequency 10-55Hz, Sine Wave full amplitude of 1.5mm to X,Y and Z 3 axes, Duration of 2 hours to each axis. The component shall satisfy requirement of the electrical characteristics. 5.3.Sealing Tightness 3 Leak Rate 1.0x10-8 Pa-m /sec. Max. measured by Helium leak detector. 5.4.Solderability After applying ROSIN Flux, dipping in solder bath at 230℃+/-5℃ for 5 sec. Over 90% of terminal shall be covered by solder. 6. Environment Performance 6.1.Humidity Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours Back to room temperature first, then in 1~2 hours, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage 6.2.Storage in Low Temperature -30℃+/-2℃,Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage 6.3.Storage in High Temperature +85℃+/-2℃,Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 9 6.4.Temperature cycles -30℃+/-2℃(30min)↔+85℃+/-2℃(30min) 20 cycles Back to the room temperature first, then in 1~2 hours, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage 6.5.VPS FC-70(the boiling point:+215℃)Vapor for 30 sec Back to the room temperature first, then in 1~2 hours, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage 7. Supplement 7.1.Soldering 7.2.Please stay with our proposed reflow condition and do then soldering 2 times max. Available for Lead Free Soldering Temperature 260 deg.C 220 deg.C (3) 160~180deg.C (2) (1) Time (1) Preheat 160~180 deg.C 120sec. (2) Primary heat 220 deg.C 60sec. (3) Peak 260 deg.C 10sec. Max. Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 10 7.3.Land pattern layout(Example) 7.4.Solder iron (Example) Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max. 7.5.Mounting This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering Process. 7.6.Cleaning Cleaning liquid which corrodes Nickel shall not be used It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 7.7.Storage Please keep away from high temperature and high humidity ,which may cause put solderbility. No direct Sunlight, No dew as well. Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 11 8. Flow Chard BASE 2 CAP BLANK INCOMING A 1 3 INCOMING 4 CLEAN BEFORE ETCHING 5 ETCHING 6 SORTING OF FREQ. 7 CLEANING OF BLANK 8 FLASH ETCHING 9 BASE PLATING 19 MARKING 10 BLANK ASS’Y 20 LEAK CHECK Ⅰ (AIR LEAK) 11 ADHESIVE CURING 21 LEAK CHECK Ⅱ (He LEAK) 12 BONDING CHECK 22 FINAL CHECK ($) + TAPING 13 PARTIAL PLATING 23 APPEARANCE CHECK 14 MIDDLE CHECK ($) 15 ANNEALING IN HIGH 24 25 OUTGOING INSPECTION OUTGOING PACKING 16 INCOMING SEAM 17 REFLOW 18 AGING SHIPPING A Tittle HSX321S Date ($)：SPECIAL CHARACTERISTICS Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 12 9. Environmental Workload Chemical Substance Components List Environmental Workload Chemical Substance Components List TYPE H(D)SX321S PERCENTAGE Chemical Substance Components 19(mg) ppm Si 0.0437 2,300 Au 0.1463 7,700 Co & Co Compound 1.1286 59,400 Mo & Mo Compound 0.0380 2,000 Ag 0.3952 20,800 Cu 0.1102 5,800 Cr & Cr Compound 0.0380 2,000 Al 4.7234 248,600 Mn & Mn Compound 0.0228 1,200 W & W Compound 0.1843 9,700 Ni & Ni Compound 2.8424 149,600 Fe 3.8437 202,300 Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 13 REV. DATE REASON No. 0 2008/09/12 New CONTENTS Tittle HSX321S Date Remark QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2008/09/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY THAILAND FACTORY Rev. X3S024000DC1H-X ELECTRONICS CORP. 0 Page 14