HSO321S 12MHZ 3.3V -40~+85℃ 数据手册
Serial No.: AL180507044‐00
H.ELE.
Specifications for Approval
CUSTOMER
宇 珈
PRODUCT TYPE
Crystal Oscillator HSO321S
NOMINAL FREQUENCY
12.000000MHz
H.ELE. SAMPLE O/N
EOS‐I50057‐12
H.ELE. P/N
SSW012000I3CHE‐T
RELEASE DATE
2018/05/07
VERSION
00
MSL
GREEN PRODUCT
Level 1
Pb free RoHS Compliant
HF‐Halogen free REACH Compliant
CUSTOMER P/N
APPLICATION & MODEL
APPROVED BY CUSTOMER
(DATE)
Harmony Electronics Corp.
Country of Origin: Taiwan Factory
Thailand Factory
China Factory
F. S. TSAI C. H. WENG U. F. CHEN
(APPROVE) (CHECK) (PREPARE)
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
REV. No.
DATE
REASON
REVISE CONTENTS
0
2018/05/07
New
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
1
Contents
ITEM
PAGE
1. CRYSTAL OSCILLATOR SPECIFICATION
3‐4
2. DIMENSIONS
4
3. MARKING
5
4. INSIDE STRUCTURE
5
5. HANDLING SUGGESTIONS
5‐6
6. EMBOSS CARRIER TAPE&REEL
7‐8
7. PACKAGE
8
8. MECHANICAL PERFORMANCE
9
9. ENVIRONMENTAL PERFORMANCE
9
10. APPENDIX
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
2
1. CRYSTAL OSCILLATOR SPECIFICATION
Electrical Specifications
Items
Electrical Spec.
Symbol
Min
Type
1. Output Frequency
(FL)
Frequency Stability
Δf/F
‐50
‐
Operating temp. range
Topr
‐40
Supply voltage
Vdd
3.0
Unit
Max
12.000000
Condition
MHz
+50
ppm
@3.3±0.3V/‐40~85℃
25
+85
℃
3.3
3.6
V
Pin #1 options
YES
Output load
Current consumption 1
(#1 pin: open or "H")
Current consumption 2
(#1 pin: "L" level)
C‐MOS CL =15pF (Idd1, Idd2 test at No Load)
Idd1
‐
‐
7
mA
Idd2
‐
‐
0.01
mA
Low level output voltage
Vol
‐
‐
0.1xVdd
V
High level output voltage
Voh
0.9xVdd
‐
‐
V
Symmetry
Duty
40
50
60
%
Tr & Tf
‐
‐
10
ns
Low level input current
Iil
‐
‐
10
uA
High Level input current
Iih
‐
‐
10
uA
Low level input voltage
Vil
‐
‐
Vddx0.3
V
High level input voltage
Vih
Vddx0.7
‐
‐
V
Output disable time
Tplz
‐
‐
150
nsec
Output enable time
Tpzl
‐
‐
10
msec
Aging
‐
‐3
‐
3
ppm/year
Start‐up time
‐
‐
10
ms
Jitter, Phase
RMS(1‐σ)
‐
‐
1
ps
Rise & Fall time
@3.3V/ 25±3℃
12KHz~20MHz Frequency Band
Note:
Absolute Maximum Ratings
Item
Symbol
Value
Unit
Vdd terminal voltage
Vdd
‐0.5 ~ 4.0
V
Input terminal voltage
Vcont
‐0.5 ~ Vdd+0.5
V
Output terminal voltage
Vout
‐0.5 ~ Vdd+0.5
V
Output terminal current
Iout
15
mA
Storage temp. range
Tstr
‐55 ~ 125
deg.C
HARMONY ELECTRONICS CORPRATION
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TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
3
TEST Circuit
CL = Include jig & probe capacitance
(Refer to 4)
Switch
H
Open
L
Out term.
Oscillation out
Oscillation out
High Z
Output Wave Form
Tf
Input and Output Condition
Tr
VOH
Vdd*0.9
Vdd*0.5
Vdd*0.1
VOL
TH
TL
TH
x 100%
TH+TL
Duty=
2. DIMENSION
TOP VIEW
3.2±0.2
3
2.5±0.2
1.0 Max.
4
2
1
(Index)
TOP VIEW
Land Pattern Layout
BOTTOM VIEW
0.9
1.2
1.2
1
2
0.95
1.75
1.0 0.65
3
4
3
4
Pin Connections
#1 OE(Output Enable)
GND
#2
Output
#3
Vdd
#4
2
1
2.2
Tolerance: ±0.1
Unit: mm
* Note: The Index mark was defined by the BASE suppliers.
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
4
3. MARKING
Note:
1. Laser marking.
2. Date Code:
Y= Year
Code
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
2027
2028
2029
0
1
2
3
4
5
6
7
8
9
M= Month Jan.
Code
A
Feb.
Mar.
Apr.
May.
Jun.
Jul.
Aug.
Sep.
Oct.
Nov.
Dec.
B
C
D
E
F
G
H
J
K
L
M
4. INSIDE STRUCTURE
Reference drawing
No. Component
1
Base‐Ceramic
2
Lid
3
Kovar
Material
Ceramic
Fe‐ Ni ‐Co
Fe‐Ni‐Co
4
Crystal Blank
Metal
5
7
8
Electrode
Connective
Adhesive
Bonding Wire
IC
Metal
Silver
Powder
Metal
Silicon
9
Pad
Metal
6
Note
Al2O3
Fe‐ Ni ‐Co
Fe‐Ni‐Co
SiO2
Rectangular At‐Cut
‐
Ag
Au
Si, Al
W
Ni‐Plating
Au‐Plating
※The use prohibition chemistry substance of Table 1 of DHE‐0204‐1 (HE‐QA‐24) is not included in
this item.
5. HANDLING SUGGESTION
Reflow Condition
Please stay with our proposed reflow condition
and do soldering within 2 times.
(1) Preheat
160~180deg.C 120 sec.
(2) Primary heat >=220 deg.C 60~120 sec.
(3) Peak
260 deg.C 10 sec. Max.
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
5
Manual Solder iron (Example)
Bit temp.: 350℃ max., Time: 3sec max. ,
Each terminal Each only should be soldered once.
Mounting Conditions
Our products are suitable for most automated SMT processes. However, we strongly advise all
our customers to conduct SMT sampling prior to mass production in order to make sure
production processes will not affect the properties and specifications of our product.
Seal welding and mounting procedures involving the use of ultra‐sonic processes are not
recommended and will affect and/or damage the internal properties of our product.
Excessive shock during the mounting process will also affect the product and we strongly
recommend setting SMT conditions to minimize such conditions.
If a possibility of the PCB being warped exists we strongly advise to ensure the degree of
warping will not affect the product.
Please also ensure the operating characteristics and or soldering conditions are all within the
specifications of use for our product.
Ultimately the worst case scenario of all the above will lead to cases of non‐oscillation but
other negative effects are also likely should our products be used in an inappropriate way.
Please note such cases of misuse and its related quality issues are not included in our product
warranty.
Cleansing Conditions
General cleaning solutions may be used to clean our products but we always recommend
testing to be performed prior to mass production processes. Ultrasonic cleaning procedures are
not recommended and we strongly advise other forms of cleansing to be evaluated first.
Unsuitable cleansing may lead to a number of negative effects such as damage to the product
surface, discoloration of the product, corrosion of the package, package contamination,
illegible marking, etc. Please note cases of unadvised treatment and its related quality issues
are not included in our product warranty.
Storage Conditions
Please ensure our products are preserved appropriately in their original packaging.
Irregular environmental instances of moisture will affect our product’s stability and may cause
problems such as frequency instability, soldering ability and conditions, package defects, and
other problems. It is essential to keep our products in a clean dust‐free environment out of
direct sunlight.
Our products’ storage conditions should at least meet the following condition:
Environmental Temperature: + 125 degrees Celsius Maximum
Relative Humidity: 80% Maximum
Please note storage instances which do not conform to our guidelines and the related quality
issues produced as an outcome are not included in our product warranty.
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
6
6. EMBOSS CARRIER TAPE AND REEL
Carrier Tape
2.0±0.05
1.55±0.05
8.0±0.2
3.5±0.05
0.25±0.05
1.75±0.1
3.4±0.1
4.0±0.1
1.4±0.1
2.7±0.1
4.0±0.1
User Direction of feed
Empty Sealed
Terminal
Empty Sealed
Components
Ledder
80mm(Min)
400mm(Min)
40mm(min)
Top Cover tape
Embossed Carrier tape
Reel
180+0/-3
13.2±0.5
60.5±0.5
12
0°
3.0±0.2
9.3±0.3
Standard Packing Quantity: 3,000PCS / REEL
11.3±1.0
Material of The Tape
Tape
Carrier tape
Top tape
Material
PS Conductive
PET
Joint of tape
The carrier‐tape and top cover‐tape should not be jointed.
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
7
Release strength of cover tape
The force should be controlled
between 0.1N to 0.7N under following
condition.
Pulling direction: 165° to 180°
Speed: 300mm/min.
Otherwise unless specified.
Other standards shall be based on JIS C 0806‐1990.
7. PACKAGE
Label
Up side(Produce)
Under side(Fixing Hole)
One reel quantity: [1000pcs]&[3000pcs]
use 4 trigon pilla
Green Product
ROHS Compliant
Carton Type
A
B
Reel
Green
Produc
t
ROHS
Comp
liant
D
C
630/531/ 321/221
Produce Type 840/751 421
211/111
OTHER
15
15
200
200
200
195
200
200
200
195
230/260 230
230
150
15
1~7
1 Top and bottom with 2.3cm thickness
foam-rubber cushion for protection
2 Carton's Q'TY:1~15 pcs.
3 Carton Type=A,B,C use 4 trigon pillar to fasten the Reel.
4 Need to add 3 pages dry agent in each outer box.
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
8
8. MECHANICAL PERFORMANCE
Item
Test Methods
Specifications
Code
1
Shock
Dropping from 50 cm height 3 times on 30mm hard wooden board.
Refer to: JIS C 60068‐2‐32
A
2
Vibration
Frequency 10‐55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z
3 axes, Duration of 2 hours to each axis.
Refer to: JIS C 60068‐2‐6
A
3
Leakage Test
Leak Rate 1.0x10‐9 Pa‐m3/sec. Max. Measured by Helium leak
detector.
‐‐‐
4
Solder ability
After applying ROSIN Flux, dipping in solder bath at 245deg.C +/‐
5deg.C for 3+/‐0.5 sec.
Refer to: JIS C 60068‐2‐20
B
9. ENVIRONMENT PERFORMANCE
Item
1
Specifications
Code
Test Methods
Resistance of
Soldering Heat
Performing as the following reflow:
A
2
3
4
5
Humidity
Temperature 60℃+/‐2℃, RH 90~95%, Duration of 240 hours.
Back to the room temperature first, then check the component after
1~2 hours.
Refer to: JIS C 60068‐2‐3
A
Storage in Low
Temperature
‐55deg.C +/‐2deg.C, Duration of 240 hours.
Back to the room temperature first, then check the component after
1~2 hours.
Refer to: JIS C 60068‐2‐1
A
Storage in High
Temperature
+125deg.C +/‐2deg.C, Duration of 240 hours.
Back to the room temperature first, then check the component after
1~2 hours.
Refer to: JIS C 60068‐2‐2
A
Temperature cycles ‐55deg.C+/‐2deg.C (30min) +125deg.C+/‐2deg.C (30min) 25 cycles.
And Temperature Increasing/reducing time<3mins.
Back to the room temperature first, then check the component after
1~2 hours.
Refer to: JIS C 0025
Specifications code
A
Specifications
A
Frequency variation shall be within +/‐5ppm
B
More than 90% of lead shall be covered by new solder.
HARMONY ELECTRONICS CORPRATION
KAOHSIUNG
TAIPEI
THAILAND
SHENZHEN
TEL: 886‐2‐26588883 Email: contactus@hele.com.tw
9
FACTORY LOCATION
HEAD OFFICE/TAIWAN FACTORY
SERVICE CENTER
TAIPEI OFFICE
NO.39, HUADONG RD., DALIAO DIST., DAFA INDUSTRIAL
PARK, KAOHSIUNG CITY 831, TAIWAN.
2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT,
TAIPEI CITY 114, TAIWAN
TEL: 886‐2‐26588883
FAX: 886‐2‐26588683
CHINA FACTORY
CONTACT INFORMATION
JU YUAN INDUSTRIAL PARK, QIAO TANG ROAD, TANG
WEI COMMUNITY, FUYONG, BAOAN DISTRICT, SHEN
ZHEN CITY, CHINA (Post Code:518103).
E‐MAIL: contactus@hele.com.tw
THAILAND FACTORY
66MOO 5, KAONGU‐BEOKPRAI RD., T.BEOKPRAI, A.
BANPONG, RATCHABURI PROVINCE 70110, THAILAND.