SMD1206-075C-16V

Version: 1.1 Document code：HB-WI7.3-367-2018 Effective date ：2018-12-27 Page: 1 of 3 Surface-Mount Device SMD1206-075C-16V RoHS Feature  Resettable over current and over temperature protection ● Low resistance  Small size of 1206 ● Fast time-to-trip  Small footprint ● RoHS complaint Application Part Numbering Product Dimensions in Millimeter D E Min A Max Min Max Min Max Min Min 3.00 3.60 1.50 1.90 0.50 1.00 0.15 0.10 Part Number SMD1206-075C-16V B C Electrical Characteristics Part Number SMD1206-075C-16V Polymer PTC Thermistor I(A) Vmax I max Pdtyp 25℃ -- -- -- Ttrip Rmin 25℃ Hold Trip (V) (A) (W) Current(A) 0.75 1.50 16 100 0.6 8.00 Specifications are subject to change without notice R1max 25℃ Time(S) (Ω) (Ω) 0.20 0.09 0.50 www.bnstar.net Version: 1.1 Document code：HB-WI7.3-367-2018 Effective date ：2018-12-27 Page: 2 of 3 Surface-Mount Device SMD1206-075C-16V RoHS IH=Hold current: maximum current at which the device will not trip at 25℃ still air reflow soldering of 260℃ for 20 sec. IT=Trip current: minimum current at which the device will always trip at 25℃ still air reflow soldering of 260℃ for 20 sec. Vmax=Maximum continuous voltage device can withstand without damage at rated current Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current reflow soldering of 260℃ for 20 sec. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin= Minimum resistance of device in initial (un-soldered) state. R1max=Maximum resistance of device at 25℃ measured one hour after reflow soldering of 260℃ for 20 sec. ＂ Value specified is determined by using the PWB with 0.030 *1.5oz copper traces. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Environmental Specifications Test Test Conditions Accept /Reject Criteria Recommended storage conditions 40°C max, 70% R.H. max No change Passive aging: 85°C, 1000 hours ≤ R1max Moisture Resistance 85% RH,85℃,1000hrs ≤ R1max MIL-STD-202 Method 107G +85ºC /-40ºC 20 times MIL-STD-883C, Method 2007.1, Condition A ≤ R1max Thermal Shock Vibration No change Solvent Resistance MIL-STD-202, Method 215 No change Moisture Level Sensitivity Level 1, J-STD-020C No change Solder Reflow Recommendation Recommended reflow methods:IR,hot air oven ,nitrogen oven Devices can be cleaned using standard industry methods and solvents. NOTE: If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame Polymer PTC Thermistor Specifications are subject to change without notice www.bnstar.net Version: 1.1 Document code：HB-WI7.3-367-2018 Effective date ：2018-12-27 Page: 3 of 3 Surface-Mount Device SMD1206-075C-16V RoHS Packaging Quantity and Marking Device Marking Standard Quantity (pcs) SMD1206-075C-16V BG 3500 NOTE: BNstar Co.,Ltd. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of BNstar’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. BNstar Co.,Ltd., reserves the right to discontinue or make changes to its products at any time without notice. Website: http://www.bnstar.net For additional information, please contact your local Sales Representative. ©Copyright 2006, BNstar Co.,Ltd. Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. The devices are intended for protection against occasional over-current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. Contact information Rev. letter Date BNSTAR NEW MATERIALS CO., LTD. 130Meilong Road Shanghai, P.R.China Tel:86-021-64251576 Design Check Audit Approve Fax: 86-021-64250020 EMAIL：info@bnstar.net Polymer PTC Thermistor Specifications are subject to change without notice www.bnstar.net