1PS74SB23,115

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Thank you for your cooperation and understanding, Kind regards, Team Nexperia DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D302 1PS74SB23 Schottky barrier diode Product specification Supersedes data of 2001 Aug 27 2003 Aug 04 Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 FEATURES PINNING • Ultra fast switching speed PIN DESCRIPTION • Low forward voltage 1 anode • Fast recovery time 2 cathode • Guard ring protected 3 anode • Small plastic SMD package 4 anode • Capability of absorbing very high surge current. 5 cathode 6 anode APPLICATIONS • Rectification • Circuit protection handbook, halfpage 6 • Polarity protection 5 4 • Switched-mode power supplies. 1, 3, 4, 6 2, 5 DESCRIPTION 1 Planar Schottky barrier diode encapsulated in an SC-74 (SOT457) small plastic SMD package. 2 Top view 3 MAM421 Marking code: P1. Fig.1 Simplified outline SC-74 (SOT457) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT − 25 V − 1 A − 25 A − 0.5 A storage temperature −65 +150 °C junction temperature − 125 °C VR continuous reverse voltage IF continuous forward current IFSM non-repetitive peak forward current tp = 8.3 ms; half sinewave; JEDEC method; note 1 IRSM non-repetitive peak reverse current tp = 100 µs Tstg Tj Note 1. Pins 1, 3, 4 and 6 are connected in parallel; pins 2 and 5 are connected in parallel. 2003 Aug 04 2 Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL VF PARAMETER forward voltage IR reverse current Cd diode capacitance CONDITIONS TYP. MAX. UNIT IF = 100 mA 260 300 mV IF = 1 A 400 450 mV VR = 20 V; note 1; see Fig.3 80 500 µA VR = 25 V; note 1; see Fig.3 − 1 mA f = 1 MHz; VR = 4 V; see Fig.4 100 − pF Note 1. Pulse test: tp = 300 µs; δ = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 Note 1. Refer to SC-74 (SOT457) standard mounting conditions. 2003 Aug 04 3 VALUE UNIT 250 K/W Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 GRAPHICAL DATA MBL886 handbook, 4 10halfpage MHB970 105 handbook, halfpage IR IF (mA) (1) (µA) (2) 104 103 (3) 103 (1) (2) 102 (3) (4) 10 10 1 1 0 200 400 600 800 VF (mV) (1) Tamb = 125 °C. (2) Tamb = 100 °C. (3) Tamb = 75 °C. (4) Tamb = 25 °C. Fig.2 Fig.3 MBK571 Cd (pF) 102 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Aug 04 0 10 20 VR (V) 30 (1) Tamb = 125 °C. (2) Tamb = 100 °C. (3) Tamb = 75 °C. (4) Tamb = 25 °C. Forward current as a function of forward voltage; typical values. 103 handbook, halfpage 10 (4) 102 4 Reverse current as a function of reverse voltage; typical values. Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT457 D E B y A HE 6 5 X v M A 4 Q pin 1 index A A1 c 1 2 3 Lp bp e w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.1 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION SOT457 2003 Aug 04 REFERENCES IEC JEDEC EIAJ SC-74 5 EUROPEAN PROJECTION ISSUE DATE 97-02-28 01-05-04 Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Aug 04 6 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/03/pp7 Date of release: 2003 Aug 04 Document order number: 9397 750 11055