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SK9822 SPECIFICATION INTEGRATED LIGHT SOURCE INTELLIGENT CONTROL (Double line transmission) OF CHIP-ON-TOP SMD TYPE LED Document No.: SPC/ SK9822 Model No.: SK9822 Description: 5.5x5.0x1.6mm Top SMD Type 0.2Watt Power Double line transmission tegrated light source Intelligent control LED Rev. No.: 01 Date: 2016-03-18 ELECTROSTATIC SENSITIVE DEVICES INTEGRATED LIGHT SOURCE INTELLIGENT CONTROL (Double line transmission) OF CHIP-ON-TOP SMD TYPE LED Model: SK9822 1. Product Overview : SK9822 is a two-wire transmission channel three (RGB) driving intelligent control circuit and the light emitting circuit in one of the LED light source control. Products containing a signal decoding module, data buffer, a built-in constant current circuit and RC oscillator; CMOS, low voltage, low power consumption; 256 level grayscale PWM adjustment and 32 brightness adjustment; use the double output, Data and synchronization of the CLK signal, connected in series each wafer output action synchronization. 2. Main Application Field: ● Full color LED string light, LED full color module, LED super hard and soft lights, LED guardrail tube, LED appearance / scene lighting ● LED point light, LED pixel screen, LED shaped screen, a variety of electronic products, electrical equipment etc.. 3. Description: ● Top SMD internal integrated high quality external control line serial cascade constant current IC; 5V application; default on electric lights; ● Control circuit and the RGB chip in SMD 5050 components, to form a complete control of pixel, color mixing uniformity and consistency; ● The two-wire synchronous control. ●The three RGB output control, 8Bit (256) color; 5Bit (32) to adjust the brightness; ● The three constant current drive, self detection function specific signal ● The maximum frequency of 30MHZ serial data input ● The double data transmission, built-in support uninterrupted oscillation PWM output, can maintain a static image. 4. Mechanical Dimensions: Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.1mm unless otherwise noted 2 / 12 5. PIN configuration Item Symbol Pin Name Function description 1 SDI Data Input control signal Input data 2 CKI CLK Input control signal Input Clock data 3 GND Ground The signal and power supply and grounding 4 VCC Power power supply pin 5 CKO CLK Output control signal output Clock data 6 SDO Data Input control signal output data 6. General Information SK9822 SK9822: The default is RGB chips with IC integration 3 / 12 7. Absolute Maximum Ratings（Ta=25℃,VSS=0V） : Parameter Symbol Range Unit Power supply voltage VDD -0.5～+5.5 V Logic input voltage VIN -0.3～VDD+0.3 V Working temperature Topt -20~+80 ℃ Storage temperature Tstg -50~+120 ℃ ESD pressure VESD 4K V 8. The electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~ 5.5V, VSS=0V): Parmeter Symbol Min Typical Max Unit Test conditions The chip supply voltage VDD --- 5.0 5.3 V --- R/G/B port pressure VDS,MAX --- --- 17 V --- The biggest LED output current Imax --- --- 20 mA --- The clock high level width TCLKH --- --- >30 ns --- The clock low level width TCLKL --- --- >30 ns --- Data set up time TSETUP --- --- >10 ns --- The frequency of PWM FPWM --- 1.2 --- KHZ --- Static power consumption IDD --- 1 --- mA --- 9. Feature Descriptions: (1) Series data structure 4 / 12 (2) 256 level gray level: Data Duty Cycle MSB……..LSB 0000 0000 0/256 0000 0001 1/256 0000 0010 2/256 - - 1111 1101 253/256 1111 1110 254/256 1111 1111 255/256 (3) PWM input / output signal relationship: (4) 5-Bit (level 32) brightness adjustment (simultaneous control of OUTR\OUTG\OUTB three port current): Data Driving Current MSB……..LSB 5 / 12 00000 0/31 00001 1/31 00010 2/31 - - 11101 29/31 11110 30/31 11111 31/31 (5) Refresh Rate : Frame rate (=1/ (64+ (32* points)) *CKI (cycle) unit: frames per second ) Such as: 1024 points, CKI frequency is 1MHZ, is =30 frames per second frame rate. 10. The typical application circuit: 6 / 12 11. Standard LED Performance Graph: Forward Voltage vs. Forward Current Typical Relative Luminous Flux vs. Forward Current 150% 150 RED 120% Forward Current(mA) 100% BLUE/GREEN 80% 60% 40% RED 20 BLUE/GREEN 10 20% 0.00 1 15 10 0 20 150 50 1.0 0.0 Forward Current(mA) Forward Voltage(V) Tj=25 °C Wavelength Characteristics Thermal Pad Temperature vs. Relative Light Output 100% BLUE/GREEN Relative Emission Distribution Normalized Luminous Flux 120% 100% 80% RED 60% 40% 20% 0.00 0 20 40 60 5.0 4.0 3.0 2.0 80 100 120 GREEN BLUE RED 80% 60% 40% 20% 0.00 400 450 500 550 600 650 700 750 800 Wavelength (nm) Thermal Pad Temperature (T=25°C) Thermal Pad Temperature vs. Forward Current Typical Radiation Pattern 120° Forward Current (mA) 100 0 80 30° BLUE/GREEN 60 60° 40 RED 20 0 90 75 0 20 40 60 80 Thermal Pad Temperature (°C) 7 / 12 100 120 60 45 30 15 0 90° 0.2 0.4 0.6 0.8 1.0 Radiation Angle 12. Packaging Standard: SK9822 C A T H O D E ID E N T IF IC A T IO N T A P E F E E D D IR E C T IO N C A R R IE R T A P E CO VER TAPE R E E L (1 7 8 x 1 2 m m ) (IN N E R 1 0 0 0 p c s L E D M A X ) S M D P R O D U C T N O .: S K 9 8 2 2 ESD PO LYETH YLENE BAG Q U A N T IT Y .: 1 0 0 0 P C S L o t N o .: L W 2 0 1 6 0 3 0 9 0 2 -1 0 D A T E :2 0 1 6 -0 3 -1 2 L A B E L S K E T C H IN G C A R D B O A R D (IN N E R 4 0 B A G M A X .) The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or antielectrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The boxes are not water resistant and therefore must be kept away from water and moisture. 8 / 12 TOP SMD LED Application Notes 1. Features The Purposes of making OPSCO’s customers and users to have a clear understanding on the ways how to use the LED. 2. Description Generally. The LED can be used the same way as other general purposed semiconductors. When using OPSCO’s TOP SMD LED, the following precautions must be taken to protect the LED. 3. Cautions 3.1. Dust & Cleaning This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps should be taken to keep the emitter free of dust. These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in an enclosed area after installing the emitters. Surface condition of this device may change when organic solvents such as trichloroethylene or acetone were applied. Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin of not. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. 3.2. Moisture Proof Package In order to avoid the absorption of moisture during transportation and storage, LED are packed in the aluminum envelop, A desiccant is included in the aluminum envelop as it absorbs moisture. When moisture is absorbed into the AMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. 3.3. Storage In order to avoid the absorption of moisture, It is recommended to store SMD LED (in bulk or taped) in the dry box (or the desiccator ) with a desiccant, Otherwise to store them in the following environment as recommended. a. Temperature: 5℃~30℃ b. Humidity: 60% RH Max It is recommended to solder the LED as soon as possible after unpacking the aluminum envelop, But in case that the LED have to be left unused after unpacking envelop again is requested. The LED should be soldering within 1 hours after opening the package. If baking is required, A baking treatment should be performed as follows: 70℃±5℃ for more than 24 hours. 9 / 12 3.4. Reflow Soldering Characteristics In testing, OPSCO has found S50 LEDs to be compatible with JEDEC J-STD-020C,using the parameters listed below. As a general guideline OPSCO recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and Configurations of reflow soldering equipment. C ritical Zone T L to T P amp-up L Temperature (°C) L s max MIN Ramp down ts (Preheat) T 25°C to Peak Times Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Ts max to Tp ) 3℃/second max. 3℃/second max. Preheat: Temperature Min (Ts min) 100℃ 150℃ Preheat: Temperature Min (Ts max) 150℃ 200℃ Preheat: Time ( ts min to ts max ) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 ℃ 217 ℃ Time Maintained Above: Time (t L) 60-150 seconds 60-150 seconds Peak/Classification Temperature (T P) 215 ℃ 240 ℃ Time Within 5℃ of Actual Peak Temperature ( tp)