TCS34903FN

TCS3490 Color Light-to-Digital Converter General Description The TCS3490 device provides color and IR (red, green, blue, clear and IR) light sensing. The color sensing provides for improved accuracy lux and color temperature measurements typically used to adjust the backlight intensity and correct the display color gamut. Additionally it can be used for light source type detection as it reports the IR content of the light. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TCS3490, Color Light-to-Digital Converter are listed below: Figure 1: Added Value of Using TCS3490 Benefits Features Single Device Integrated Optical Solution • RGBC and ALS Support • Power Management Features Color Temperature and Ambient Light Sensing • Programmable Gain & Integration Time • 1,000,000:1 Dynamic Range Equal Response to 360 degree Incident Light • Circular Segmented RGBC Photodiode Ideal for Operation Behind Dark Glass • Very High Sensitivity Light Source Detection • RGBC + IR sensor Applications The TCS3490 applications include: • Ambient Light Sensing • Color Temperature Sensing • Industrial Process Control • Medical Diagnostics ams Datasheet [v1-08] 2015-Apr-30 Page 1 Document Feedback TCS3490 − General Description Block Diagram The functional blocks of this device for reference are shown below: Figure 2: TCS3490 Block Diagram VDD INT Interrupt IR passband filter UV & IR stopband filter RGBC Control Clear Clear Data Red ADC Red Data Green ADC Green Data Blue ADC Blue Data Lower Limit Red Green Blue Page 2 Document Feedback Clear ADC Upper Limit I²C Interface SCL SDA ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Pin Assignment The TCS3490 pin assignments are described below. Pin Assignment Figure 3: Pin Diagram Pin Diagram (Top View): Package FN Dual Flat No-Lead. Package Drawing is not to scale. VDD 1 6 SDA SCL 2 5 INT GND 3 4 I/C Figure 4: Pin Description Pin Number Pin Name 1 VDD Supply voltage 2 SCL I²C serial clock input terminal 3 GND Power supply ground. All voltages are referenced to GND. 4 I/C Internal connection, connect to ground or leave floating. 5 INT Interrupt — open drain output (active low) 6 SDA I²C serial data I/O terminal – open drain ams Datasheet [v1-08] 2015-Apr-30 Description Page 3 Document Feedback TCS3490 − Absolute Maximum Ratings Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Parameter Min Max Units Comments 3.8 V All voltages are with respect to GND Supply voltage, VDD Input terminal voltage -0.5 3.8 V Output terminal voltage -0.5 3.8 V Output terminal current (SDA, INT) -1 20 mA Storage temperature range, TSTRG -40 85 ºC Electrostatic discharge voltage Page 4 Document Feedback ±2000 V JEDEC specification JESD22-A11 Class 1C ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Electrical Characteristics Figure 6: Recommended Operating Conditions Symbol VDD TA Parameter Min Typ Max Units Supply voltage 2.7 3 3.6 V Operating free-air temperature (1) -40 70 °C Note(s) and/or Footnote(s): 1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated at 25°C unless otherwise noted. Figure 7: Operating Characteristics, V DD=3V, TA=25ºC (unless otherwise noted) Symbol IDD VOL ILEAK VIH VIL Parameter Supply current INT, SDA output low voltage Conditions Typ Max Active 235 330 Wait state 60 Sleep state - no I²C activity 1.0 SCL, SDA input low voltage ams Datasheet [v1-08] 2015-Apr-30 Units μA 10 3 mA sink current 0 0.4 6 mA sink current 0 0.6 -5 5 V Leakage current, SDA, SCL, INT pins SCL, SDA input high voltage Min TCS34901, TCS34905 0.7 VDD TCS34903, TCS34907 1.26 μA V TCS34901, TCS34905 0.3 VDD TCS34903, TCS34907 0.54 V Page 5 Document Feedback TCS3490 − Electrical Characteristics Figure 8: Optical Characteristics (Clear Channel), V DD = 3V, TA = 25°C, AGAIN = 16x, ATIME = 0xDC (100ms) Parameter Test Conditions Min Typ Max White LED, CCT = 4000K, Ee = 45.6 μW/cm2 (1) 38.9 48.6 58.3 28.6 35.7 42.8 Blue LED, λD = 465 nm, Re Irradiance Responsivity (Clear Channel) Ee = 53.8 μW/cm2 (2) Green LED, λD = 525 nm, Ee = 43.9 μW/cm2 (3) Red LED, λD = 615 nm, Ee = 37.5 μW/cm2 (4) Unit Counts/ (μW/cm2) 33.6 42.0 50.4 49.0 61.3 73.6 Figure 9: Optical Characteristics, V DD = 3V, TA = 25°C Red/Clear Parameter Color ADC count value ratio: Color / Clear Green/Clear Blue/Clear Test Conditions Min Max Min Max Min Max Blue LED, λD = 465 nm (2) 0% 13% 10% 38% 70% 91% Green LED, λD = 525 nm (3) 3% 22% 59% 86% 10% 40% Red LED, λD = 615 nm (4) 80% 110% 0% 15% 3% 26% Note(s) and/or Footnote(s): 1. The white LED irradiance is supplied by a neutral white light-emitting diode with a nominal color temperature of 4000K. 2. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following typical characteristics: dominant wavelength λ D = 465 nm, spectral halfwidth Δλ½ = 22 nm. 3. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following typical characteristics: dominant wavelength λ D = 525 nm, spectral halfwidth Δλ½ = 35 nm. 4. The 615 nm input irradiance is supplied by an AlInGaP light-emitting diode with the following typical characteristics: dominant wavelength λ D = 615 nm, spectral halfwidth Δλ½ = 15 nm. Page 6 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Electrical Characteristics Figure 10: RGBC Characteristics, VDD = 3V, TA = 25ºC, AGAIN = 16x, AEN = 1 (unless otherwise noted) Parameter Conditions Min Typ Max Units 0 1 4 counts 2 counts (1) 6 counts 4 counts (1) 2.93 ms 1 256 steps ATIME = 0xFF (2.78ms) to 0xC1 (175ms) (1 to 63 steps) 0 1024 counts/ step ATIME = 0xC0 (178ms) to 0x00 (712ms) (64 to 256 steps) 0 65535 counts Dark ADC count value (Clear and RGB Channels) Ee = 0, AGAIN = 128x, ATIME = 0xB8 (200ms) Dark ADC count value (IR Channel) 0 0 1 0 Integration time step size 2.65 Number of integration steps 2.78 ADC count value Gain scaling, relative to 16× gain setting 1x: AGAIN = 00 0.936 0.985 1.065 4x: AGAIN = 01 3.66 3.85 4.16 × 16x: AGAIN = 10 64x: AGAIN = 11 16.0 59.6 62.7 67.8 Note(s) and/or Footnote(s): 1. Based on typical 3-sigma distribution. Not 100% tested. Figure 11: Wait Characteristics, VDD = 3V, TA = 25ºC, WEN = 1 (unless otherwise noted) Parameter Conditions Wait step size WTIME = 0xFF ams Datasheet [v1-08] 2015-Apr-30 Min Typ 2.78 Max Units ms Page 7 Document Feedback TCS3490 − Timing Characteristics The timing characteristics of TCS3490 are given below. Timing Characteristics Figure 12: AC Electrical Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted) Parameter(1) Conditions Min Max Unit 0 400 kHz fSCL Clock frequency (I²C only) tBUF Bus free time between start and stop condition 1.3 μs Hold time after (repeated) start condition. After this period, the first clock is generated. 0.6 μs tSU;STA Repeated start condition setup time 0.6 μs tSU;STO Stop condition setup time 0.6 μs tHD;DAT Data hold time 60 ns tSU;DAT Data setup time 100 ns tLOW SCL clock low period 1.3 μs tHIGH SCL clock high period 0.6 μs tHD;STA tF Clock/data fall time 300 ns tR Clock/data rise time 300 ns Ci Input pin capacitance 10 pF Note(s) and/or Footnote(s): 1. Specified by design and characterization; not production tested. Timing Diagram Figure 13: Parameter Measurement Information tHIGH tR tLOW tF VIH SCL VIL tHD; STA tSU; DAT tHD; DAT tSU; STA tSU; STO tBUF SDA VIH VIL STOP Page 8 Document Feedback START START STOP ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Typical Operating Characteristics Typical Operating Characteristics Figure 14: Spectral Responsivity 100% Clear Normalized Responsivity 90% Red Green 80% Blue 70% IR Channel 60% 50% 40% 30% 20% 10% 0% 300 400 500 600 700 800 900 1000 1100 Wavelength (nm) Normalized Responsivity Figure 15: Normalized Responsivity vs. Angular Displacement Θ - Angular Displacement - ° ams Datasheet [v1-08] 2015-Apr-30 Page 9 Document Feedback TCS3490 − Typical Operating Characteristics Figure 16: Responsivity Temperature Coefficient Page 10 Document Feedback Wavelength Temperature Coefficient 400 – 670nm 250 ppm/°C 850nm 2500 ppm/°C 950nm 5500 ppm/°C ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Functional Description Functional Description The TCS3490 device provides ambient light sensing and color temperature sensing. The internal state machine manages the operation of the device. It controls the ALS functionality and power down modes. Average power consumption is managed via control of variable endurance low power wait cycles. The interrupt feature improves system efficiency by eliminating the need to poll the sensor. Two interrupt sources (ALS, ALS saturation) can activate the open drain output pin. Each interrupt source is enabled independently. ALS interrupts appear when upper or lower thresholds are exceeded for a consecutive number of sample readings. The advanced digital color light sensor portion of the TCS3490 contains a segmented circular photodiode array used for color measurements. This architecture provides stable color sensing independent of the incident angle of light. Four integrating analog-to-digital converters (ADCs) integrate light energy from photodiodes simultaneously. Figure 17: Simplified ALS State Machine Communication with the device is accomplished through a fast (up to 400 kHz) two wire I²C serial bus for easy connection to a microcontroller or embedded controller. The device typically draws only 235μA in color operation and 1uA during power down. Sleep PON = 1 (0x80:b0) PON = 0 (0x80:b0) Start RGBC Wait ams Datasheet [v1-08] 2015-Apr-30 Page 11 Document Feedback TCS3490 − Register Description The device is controlled and monitored by registers accessed through the I²C serial interface. These registers provide for a variety of control functions and can be read to determine results of the ADC conversions. The register set is summarized in the figure below. Register Description Figure 18: Register Map Address Register Name R/W 0x80 ENABLE R/W Enables states and interrupts 0x00 0x81 ATIME R/W RGBC integration time 0xFF 0x83 WTIME R/W Wait time 0xFF 0x84 AILTL R/W Clear interrupt low threshold low byte 0x00 0x85 AILTH R/W Clear interrupt low threshold high byte 0x00 0x86 AIHTL R/W Clear interrupt high threshold low byte 0x00 0x87 AIHTH R/W Clear interrupt high threshold high byte 0x00 0x8C PERS R/W Interrupt persistence filter 0x00 0x8D CONFIG R/W Configuration 0x40 0x8F CONTROL R/W Gain control register 0x00 0x90 AUX R/W Auxiliary control register 0x00 0x91 REVID R Revision ID Rev 0x92 ID R Device ID Register Function Reset Value 84h for TCS34901 & TCS34905 87h for TCS34903 & TCS34907 0x93 STATUS R Device status 0x00 0x94 CDATAL R Clear / IR channel low data register 0x00 0x95 CDATAH R Clear / IR channel high data register 0x00 0x96 RDATAL R Red ADC low data register 0x00 0x97 RDATAH R Red ADC high data register 0x00 Page 12 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Register Description Address Register Name R/W 0x98 GDATAL R Green ADC low data register 0x00 0x99 GDATAH R Green ADC high data register 0x00 0x9A BDATAL R Blue ADC low data register 0x00 0x9B BDATAH R Blue ADC high data register 0x00 0xC0 IR R/W Access IR Channel 0x00 0xE4 IFORCE W Force Interrupt 0x00 0xE6 CICLEAR W Clear channel interrupt clear 0x00 0xE7 AICLEAR W Clear all interrupts 0x00 ams Datasheet [v1-08] 2015-Apr-30 Register Function Reset Value Page 13 Document Feedback TCS3490 − Register Description Enable Register (ENABLE 0 x 80) The Enable Register is used primarily to power the device ON/OFF, and enable functions and interrupts. Figure 19: Enable Register 7 6 5 4 3 2 1 0 Reserved SAI Reserved AIEN WEN Reserved AEN PON Field Bits Reserved 7 Reserved. Write as 0. SAI 6 Sleep After Interrupt. When asserted, the device will power down at the end of a RGBC cycle if an interrupt is generated. Reserved 5 Reserved. Write as 0. AIEN 4 ALS Interrupt Enable. When asserted permits ALS interrupts to be generated, subject to the persist filter. WEN 3 Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the wait timer. Reserved 2 Reserved. Write as 0. AEN 1 ADC Enable. This bit activates the four-channel (RGBC) ADC. Writing a 1 enables the ADC. Writing a 0 disables the ADC. 0 Power ON. This bit activates the internal oscillator to permit the timers and ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0 disables the oscillator and puts the part into a low power sleep mode. During reads and writes over the I²C interface, this bit is temporarily overridden and the oscillator is enabled, independent of the state of PON. PON Page 14 Document Feedback Description ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Register Description RGBC Integration Time Register (ATIME 0x81) The ATIME register controls the internal integration time of the RGBC channel ADCs. Upon power up, the RGBC time register is set to 0xFF. The maximum (or saturation) count value can be calculated based upon the integration time cycles as follows: min [CYCLES * 1024, 65535] Figure 20: RGBC Integration Time Register Description Field ATIME Bits 7:0 Value Cycles Time Max Count 0xFF 1 2.78 ms 1024 0xF6 10 27.8 ms 10240 0xDB 37 103 ms 37888 0xC0 64 178 ms 65535 0x00 256 712 ms 65535 Wait Time Register (WTIME 0x83) The WTIME controls the amount of time in a low power mode. It is set 2.78 ms increments unless the WLONG bit is asserted in which case the wait times are 12× longer. WTIME is programmed as a 2’s complement number. Upon power up, the wait time register is set to 0xFF. Figure 21: Wait Time Register Description Field WTIME Bits 7:0 Register Value Wait Time Time (WLONG=0) Time (WLONG=1) 0xFF 1 2.78 ms 0.03 sec 0xAB 85 236 ms 2.84 sec 0x00 256 712 ms 8.54 sec Note(s) and/or Footnote(s): 1. The wait time register should be configured before AEN is asserted. ams Datasheet [v1-08] 2015-Apr-30 Page 15 Document Feedback TCS3490 − Register Description Clear Channel Interrupt Threshold Register (0x84 - 0x87) The Clear Channel Interrupt Threshold Registers provide 16 bit values to be used as the high and low thresholds for comparison to the 16 bit CDATA values. If AIEN (0x80:b4) is enabled and CDATA is not between AILT and AIHT for the number of consecutive samples specified in APERS (0x8C:b[3:0]) an interrupt is asserted on the interrupt pin. Figure 22: Clear Channel Interrupt Threshold Registers Register Address Bits Description AILTL 0x84 7:0 Clear Channel low threshold lower byte AILTH 0x85 7:0 Clear Channel low threshold upper byte AIHTL 0x86 7:0 Clear Channel high threshold lower byte AIHTH 0x87 7:0 Clear Channel high threshold upper byte Page 16 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Register Description Interrupt Register (0x8C) The Interrupt Register controls the interrupt capabilities of the device. Figure 23: Interrupt Register 7 6 5 4 3 2 Reserved Field Bits Reserved 7:4 1 0 APERS Description Reserved. Write as 0. Clear Interrupt Persistence. Controls rate of Clear channel interrupt to the host processor. Field Value APERS ams Datasheet [v1-08] 2015-Apr-30 3:0 Persistence 0000 Every RGBC cycle generates an interrupt 0001 Any value outside of threshold range 0010 2 consecutive values out of range 0011 3 consecutive values out of range 0100 5 consecutive values out of range 0101 10 consecutive values out of range 0110 15 consecutive values out of range 0111 20 consecutive values out of range 1000 25 consecutive values out of range 1001 30 consecutive values out of range 1010 35 consecutive values out of range 1011 40 consecutive values out of range 1100 45 consecutive values out of range 1101 50 consecutive values out of range 1110 55 consecutive values out of range 1111 60 consecutive values out of range Page 17 Document Feedback TCS3490 − Register Description Configuration Register (CONFIG 0x8D) The CONFIG register sets the wait long time. The registers is set 0x40 at power up. Figure 24: Configuration Register 7 6 Reserved Reserved1 5 4 3 2 Reserved 1 0 WLONG Reserved Field Bits Description Reserved 7 Reserved. Write as 0. Reserved (1) 6 Reserved. Write as 1. Reserved 5:2 WLONG 1 Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the WTIME register. Reserved 0 Reserved. Write as 0. Reserved. Write all as 0. Note(s) and/or Footnote(s): 1. Bit 6 is reserved and has to be programmed = 1. Control Register (CONTROL 0x8F) Figure 25: Control Register 7 6 5 4 3 2 1 0 Reserved Field Bits Reserved 7:2 AGAIN Description Reserved. Write all as 0. RGBC Gain Control. AGAIN Page 18 Document Feedback FIELD VALUE RGBC GAIN VALUE 00 1X Gain 01 4X Gain 10 16X Gain 11 64X Gain 1:0 ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Register Description Auxiliary Register (AUX 0x90) The AUX register enables the ALS saturation detection interrupt. If ASIEN = 1 and an interrupt occurs it is cleared by accessing the Clear Interrupt registers at 0XE6 or 0XE7. Figure 26: Auxiliary Register 7 6 Reserved 5 4 3 ASIEN Field Bits Reserved 7:6 ASIEN 5 Reserved 4:0 2 1 0 Reserved Description Reserved. Write all as 0. 0 disables, 1 enables ALS Saturation Interrupt Reserved. Revision ID Register (REVID 0x91) This read-only register identifies the die revision level. Figure 27: Revision ID Register 7 6 5 4 3 Reserved 1 0 RevID Field Bits Reserved 7:4 Reserved. RevID 3:0 Wafer die revision level ams Datasheet [v1-08] 2015-Apr-30 2 Description Page 19 Document Feedback TCS3490 − Register Description ID Register (ID 0x92) The read-only ID register provides the device identification. Figure 28: ID Register 7 6 5 4 3 2 1 ID 0 VID Field Bits Description ID 7:2 Device Identification = 100001 VID 1:0 00b for TCS34901 & TCS34905 11b for TCS34903 & TCS34907 Status Register (STATUS 0x93) The read-only Status Register provides the internal status of the device. Figure 29: Status Register 7 6 ASAT Field 5 Reserved 4 AINT 3 2 Reserved 1 0 AVALID Bits Description ASAT 7 ALS Saturation. When asserted, the analog sensor was at the upper end of its dynamic range. The bit can be de-asserted by sending a clear channel interrupt command (0xE6 CICLEAR) or by disabling the ALS ADC (AEN=0). ATIME and AGAIN are controls that can be adjusted to set when saturation happens. This bit triggers an interrupt if ASIEN in AUX is set. Reserved 6:5 AINT 4 Reserved 3:1 AVALID 0 Page 20 Document Feedback Reserved. ALS Interrupt. If AEN is set, indicates that an ALS event that met the programmed ALS thresholds (AILT or AIHT) and persistence (APERS) occurred. Reserved. RGBC Valid. Indicates that the RGBC cycle has completed since AEN was asserted. ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Register Description RGBC Data Registers (0x94 - 0x9B) Clear, red, green, and blue data is stored as 16-bit values. The read sequence must read byte pairs (low followed by high) starting on an even address boundary (0x94, 0x96, 0x98, or 0x9A) inside the RGBC Data Register block. When the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent read to the upper byte. The upper register will read the correct value even if additional ADC integration cycles end between the reading of the lower and upper registers. Figure 30: RGBC Data Registers Register Address Bits Description CDATAL 0x94 7:0 Clear / IR data low byte CDATAH 0x95 7:0 Clear / IR data high byte RDATAL 0x96 7:0 Red data low byte RDATAH 0x97 7:0 Red data high byte GDATAL 0x98 7:0 Green data low byte GDATAH 0x99 7:0 Green data high byte BDATAL 0x9A 7:0 Blue data low byte BDATAH 0x9B 7:0 Blue data high byte ams Datasheet [v1-08] 2015-Apr-30 Page 21 Document Feedback TCS3490 − Register Description IR Register (0xC0) Access to IR channel; allows mapping of IR channel on clear channel. Figure 31: IR Register 7 6 5 4 3 IR 2 1 0 Reserved Field Bits IR 7 Reserved 6:0 Description IR Sensor access. If this bit is set the clear channel reports the measurement from the IR sensor (center diode). Reserved. Always write as 0. Clear Interrupt Registers (0xE3, 0xE7) Any dummy data byte (0x00 recommended) written to the specified register will clear the indicated interrupt. Figure 32: Clear Interrupt Registers Register Address Bits IFORCE 0xE4 7:0 Forces an interrupt (any value) CICLEAR 0xE6 7:0 Clear channel interrupt clear (any value) AICLEAR 0xE7 7:0 Clears all interrupts (any value) Page 22 Document Feedback Description ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Power Supply Considerations Power Supply Considerations Place a 1-μF low-ESR decoupling capacitor as close as possible to the V DD pin. Figure 33: Typical Application Hardware Circuit V BUS Voltage Regulator V DD Cap sized per regulator specs RP RP R PI 1 µF GND TCS3490 INT SCL I/C SDA V BUS in the above figures refers to the I²C bus voltage which is either VDD or 1.8 V. Be sure to apply the specified I²C bus voltage shown in the Ordering & Contact Information for the specific device being used. The I²C signals and the Interrupt are open-drain outputs and require pull−up resistors. The pull-up resistor (RP) value is a function of the I²C bus speed, the I²C bus voltage, and the capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor (RPI) can be used for the interrupt line. ams Datasheet [v1-08] 2015-Apr-30 Page 23 Document Feedback TCS3490 − PCB Pad Layout PCB Pad Layout Suggested PCB pad layout guidelines for the surface mount module are shown. Flash Gold is recommended as a surface finish for the landing pads. Figure 34: Suggested PCB Layout PCB Layout: Suggested land pattern based on the IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard (2010) for the small outline no-lead (SON) package. ; ; 3,1 ; ; ; ;)8//5 Note(s) and/or Footnote(s): 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice. Page 24 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Package Drawings & Markings Package Drawings & Markings Figure 35: IC Package Mechanical Drawing 7239,(:   “ 9'' 6'$ 6&/ ,17 *1' ,& 3KRWRGLRGH $FWLYH$UHD “ (1'9,(: 6,'(9,(:  1RPLQDO ;“ “ 3KRWRGLRGH $FWLYH$UHD ;“ ;“ %277209,(: &/ RI6ROGHU&RQWDFWVDQG3KRWRGLRGH$FWLYH$UHD 1RWH 1RPLQDO1RWH &/ RI6ROGHU&RQWDFWV &/ RI3KRWRGLRGH$FWLYH$UHD 3,1 RoHS Green ;“ Note(s) and/or Footnote(s): 1. All linear dimensions are in micrometers. Dimension tolerance is ±20 μm unless otherwise noted. 2. The die is centered within the package within a tolerance of ±75 μm. 3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55. 4. Contact finish is Copper Alloy A194 with pre-plated NiPdAu lead finish. 5. This package contains no lead (Pb). 6. This drawing is subject to change without notice. ams Datasheet [v1-08] 2015-Apr-30 Page 25 Document Feedback TCS3490 − Package Mechanical Data Package Mechanical Data Figure 36: Carrier Tape & Reel Information  “    %  “     %  “ $ ƒ0$; $ ƒ0$; “ “ $R “ .R 6(&7,21$$ “ %R 6(&7,21%% 527$7(' &: Note(s) and/or Footnote(s): 1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted. 2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001. 4. Each reel is 330 millimeters in diameter and contains 2500 parts. 5. Packaging tape and reel conform to the requirements of EIA Standard 481−B. 6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. 7. This drawing is subject to change without notice. 8. The device pin 1 is located in the upper left corner inside the T&R pockets. Page 26 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Soldering & Storage Information Soldering & Storage Information The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 37: Solder Reflow Profile Parameter Reference Average temperature gradient in preheating Device 2.5 ºC/sec tsoak 2 to 3 minutes Time above 217 ºC (T1) t1 Max 60 sec Time above 230 ºC (T2) t2 Max 50 sec Time above Tpeak - 10 ºC (T3) t3 Max 10 sec Peak temperature in reflow Tpeak 260 ºC Soak time Temperature gradient in cooling Max -5 ºC/sec Figure 38: Solder Reflow Profile Graph NottoScale Tpeak T3 T2 Temperaturein°C T1 Timeinseconds t3 t2 ams Datasheet [v1-08] 2015-Apr-30 Page 27 Document Feedback TCS3490 − Soldering & Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions: • Shelf Life: 12 months • Ambient Temperature: < 40°C • Relative Humidity: < 90% Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Floor Life The FN package has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: • Floor Life: 168 hours • Ambient Temperature: < 30°C • Relative Humidity: < 60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours. Page 28 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Ordering & Contact Information Ordering & Contact Information The device is packaged in a small OFN (Optical FN) package which is 2mm x 2.4mm. Figure 39: Ordering Information Ordering Code Address Interface Delivery Form TCS34901FN (1) 0x39 I²C VBUS = VDD Interface FN-6 TCS34903FN 0x39 I²C bus = 1.8V Interface FN-6 TCS34905FN (1) 0x29 I²C VBUS = VDD Interface FN-6 TCS34907FN 0x29 I²C bus = 1.8V Interface FN-6 Note(s) and/or Footnote(s): 1. Contact ams for availability. Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com ams Datasheet [v1-08] 2015-Apr-30 Page 29 Document Feedback TCS3490 − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Page 30 Document Feedback ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. ams Datasheet [v1-08] 2015-Apr-30 Page 31 Document Feedback TCS3490 − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) Page 32 Document Feedback Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs ams Datasheet [v1-08] 2015-Apr-30 TCS3490 − Revision Information Revision Information Changes from 1-05 (2015-Jan-17) to current revision 1-08 (2015-Apr-30) Page 1-05 (2015-Jan-17) to 1-06 (2015-Apr-21) Updated Figures 3 & 4 3 Updated Figure 5 4 Updated Figure 7 5 Updated Figures 8 & 9 6 Updated Figure 10 7 Updated Figure 27 (Revision ID Register) 19 Updated Figure 33 23 Updated Figure 35 25 Updated Figure 38 27 1-06 (2015-Apr-21) to 1-07 (2015-Apr-22) Updated Figure 16 10 Updated Figure 36 (Carrier Tape & Reel) 26 1-07 (2015-Apr-22) to 1-08 (2015-Apr-30) Updated Figure 9 6 Updated Figure 10 7 Updated text under Functional Description 11 Updated Figure 19 (Enable Register) 14 Updated Figure 29 (Status Register) 20 Updated Figure 35 (Package Drawings) 25 Note(s) and/or Footnote(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision. 2. Correction of typographical errors is not explicitly mentioned. ams Datasheet [v1-08] 2015-Apr-30 Page 33 Document Feedback TCS3490 − Content Guide Content Guide Page 34 Document Feedback 1 1 1 2 General Description Key Benefits & Features Applications Block Diagram 3 4 5 Pin Assignment Absolute Maximum Ratings Electrical Characteristics 8 8 Timing Characteristics Timing Diagram 9 11 Typical Operating Characteristics Functional Description 12 14 15 15 16 17 18 18 19 19 20 20 21 22 22 Register Description Enable Register (ENABLE 0 x 80) RGBC Integration Time Register (ATIME 0x81) Wait Time Register (WTIME 0x83) Clear Channel Interrupt Threshold Register (0x84 - 0x87) Interrupt Register (0x8C) Configuration Register (CONFIG 0x8D) Control Register (CONTROL 0x8F) Auxiliary Register (AUX 0x90) Revision ID Register (REVID 0x91) ID Register (ID 0x92) Status Register (STATUS 0x93) RGBC Data Registers (0x94 - 0x9B) IR Register (0xC0) Clear Interrupt Registers (0xE3, 0xE7) 23 24 25 26 Power Supply Considerations PCB Pad Layout Package Drawings & Markings Package Mechanical Data 27 28 28 28 28 Soldering & Storage Information Moisture Sensitivity Shelf Life Floor Life Rebaking Instructions 29 30 31 32 33 Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information ams Datasheet [v1-08] 2015-Apr-30