SFH4010-Z

IR-Lumineszenzdiode Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4010 Nicht für Neuentwicklungen im Automobilbereich / not for new designs in automotive applications Wesentliche Merkmale Features • Sehr kleines Gehäuse: (LxBxH) 1,7 mm x 0,8 mm x 0,65 mm • Typische Peakwellenlänge 950 nm • Gegurtet lieferbar • Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm • Typical Peak wavelength 950 nm • Available on tape and reel Anwendungen Applications • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Alarm- und Sicherungssysteme • IR-Freiraumübertragung • • • • • • Miniature photointerrupters Industrial electronics For drive and control circuits Sensor technology Alarm and safety equipment IR free air transmission Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping 1) Ie (mW/sr) SFH 4010 Q65110A6459 > 1.0 (typ. 2.5) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2008-10-20 1 SFH 4010 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 100 mA Stoßstrom, τ = 10 μs, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 160 mW 450 K/W 250 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 5 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 5 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block 2008-10-20 2 SFH 4010 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A Δλ 55 nm Abstrahlwinkel Half angle ϕ ± 80 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimensions of the active chip area L×B L×W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr , tf 0.5 μs Kapazität Capacitance VR = 0 V, f = 1 MHz Co 25 pF VF VF 1.3 (≤ 1.5) 1.9 (≤ 2.5) V V Sperrstrom Reverse current VR = 5 V IR 0.01 (≤ 1) μA Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Φe 20 mW Temperaturkoeffizient von Ie bzw. Φe, TCI IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA – 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV –2 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs 2008-10-20 3 SFH 4010 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 1.0 2.5 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 μs Ie typ 22 mW/sr 2008-10-20 4 SFH 4010 Relative Spectral Emission Irel = f (λ) Single pulse, tp = 20 μs OHR01938 100 Ιe % Ι rel Ιe = f (IF) Ιe 100 mA Radiant Intensity 10 2 A OHR01551 OHR00883 120 Ι F mA Ι e 100 mA 80 Max. Permissible Forward Current IF = f (TA), RthJA = 450 K/W 100 10 1 80 60 R thjA = 450 K/W 10 0 60 40 40 10 -1 20 20 0 880 920 960 nm λ 1000 10 -2 10 -3 1060 Forward Current IF = f (VF) single pulse, tp = 20 μs ΙF 10 0 A 10 1 ΙF 10 4 OHR00860 tp Ι F mA 5 A 10 10 -1 Permissible Pulse Handling Capability IF = f (tp), TA = 25 °C duty cycle D = parameter OHR01554 10 1 0 10 -2 0 D= tp T D = 0.005 ΙF T 0.01 0.02 10 -1 10 3 5 0.05 0.1 0.2 10 -2 0.5 10 -3 0 1 2 3 4 5 6 V VF DC 10 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp 8 Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF00614 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 2008-10-20 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 5 100˚ 120˚ 0 20 40 60 80 100 ˚C 120 TA SFH 4010 Maßzeichnung Package Outlines 0.7 (0.028) ±0.05 (0.002) 5˚ 7˚ max Package marking 1.3 (0.051) ±0.1 (0.004) Package marking (0.002) 0.125 (0.005) +0.05 -0.03 (0.001) 1.7 (0.067) ±0.1 (0.004) 0.8 (0.031) ±0.1 (0.004) (0.001) 0.65 (0.026) +0.02 -0.05 (0.002) GPLY7036 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Epoxydharz, diffus / Epoxy, diffuse Farbe / Colour Farblos / colourless Gehäusemarkierung/ Package marking Kathode / cathode 2008-10-20 6 SFH 4010 Empfohlenes Lötpaddesign Recommended Solder Pad Reflow Löten Reflow Soldering Copper solder pad 0.8 (0.031) 0.8 (0.031) 0.8 (0.031) 0.8 (0.031) OHAPY606 0.7 (0.028) 0.8 (0.031) 0.8 (0.031) 0.6 (0.024) 0.05 (0.002) Solder stencil aperture Copper solder pad OHPY3832 Maße in mm (inch) / Dimensions in mm (inch). 2008-10-20 0.7 (0.028) Reflow Löten Reflow Soldering 0.05 (0.002) Alternatives Lötpaddesign Alternative Solder Pad 7 SFH 4010 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile ˚C 255 ˚C 240 ˚C T 250 ˚C 260 ˚C +0 -5 ˚C 245 ˚C ±5 ˚C ˚C 235 ˚C +5 -0 ˚C 217 ˚C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 t 2008-10-20 8 s 250 SFH 4010 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-10-20 9