P1
TAI-TECH
Wire Wound Type Common Mode Filter
WCM3225F2SF-102T04
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
19/07/05
新發行
楊祥忠
林志鴻
何玉蓮
備
註
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TAI-TECH
Wire Wound Type Common Mode Filter
WCM3225F2SF-102T04
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
2. WCM3225F2SF series realizes small size and low profile. 3.2x2.5x2.2 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125℃ (Including self - temperature rise)
Halogen
Halogen-free
2. Dimension
Recommended PC Board Pattern
E
C
A
D
D
B
Series
A(mm)
B(mm)
C(mm)
D1(mm)
D2(mm)
E(mm)
G1(mm)
G2(mm)
H(mm)
L(mm)
3225F2SF 3.2±0.2
2.5±0.2
2.2±0.2
0.8±0.1
0.9±0.1
0.15±0.1
1.6
0.6
3.5
4.4
Units: mm
3. Part Numbering
WCM 3225
A
B
F
2
S
F
C
D
E
F
A: Series
B: Dimension
C: Material
D: Number of Lines
E: Type
F: Lead free type
G: Impedance
H: Packaging
I: Rated Current
-
102
T
04
G
H
I
Ferrite Core
2=2 lines
S=Shielded , N=Unshielded
102=1000Ω
T=Taping and Reel
04=400mA
4. Specification
TAI-TECH
Part Number
WCM3225F2SF-102T04
DC
Common mode
Withstand
IR
Impedance Test Frequency Resistance Rated Current Rated Volt. Volt. (Vdc)
(Vdc)max.
(Ω) min.
(MHz)
(mA)max.
(Ω)
max.
(Ω) max.
1000±25%
100
0.30
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400
50
125
10M
P3
TAI-TECH
WCM3225F2SF-102
10000
Common Mode
IMPEDANCE(Ohm)
1000
100
10
Normal Mode
1
0.1
1
10
100
FREQUENCY(MHz)
5. Schematic Diagram
6. Materials
No.
Description
Specification
a.
Upper plate
Ferrite
b.
Core
Ferrite Core
c
Termination
Ag/Ni/Sn
d
Wire
Enameled Copper Wire
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1000
10000
P4
TAI-TECH
7. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
-40~+125℃ (on board)
Test Condition
Electrical Performance Test
Z(common mode)
Agilent-4291A+ Agilent -16197A
Refer to standard electrical characteristics list.
DCR
I.R.
Agilent-4338B
Agilent4339
Temperature Rise Test
Rated Current < 1A
ΔT 20℃Max
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Rated Current ≧ 1A ΔT 40℃Max
Reliability Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Temperature:125±2℃
Life Test
Load Humidity
Moisture Resistance
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs.
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Thermal
shock
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room fempraturc after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Oscillation Frequency: 10Hz~2KHz~10Hz for 20 minute
Equipment: Vibration checker
Total Amplitude:10g
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Test the quantity:15pcs
Vibration
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Item
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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