TAI-TECH
P1
SMD Power Inductor
HPC5040NF-Series
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
16/03/25
新發行
楊祥忠
詹偉特
何秦芝
備
注
TAI-TECH
P2
SMD Power Inductor
HPC5040NF-Series
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Halogen
Pb
Halogen-free
Pb-free
Recommended Land pattern
100
Series
Inductance
≤10 uH
HPC5040NF
>10 uH
A(mm)
B(mm)
4.95±0.2 4.95±0.2
C(mm)
3.9±0.2
3.8±0.2
D(mm)
E (mm)
1.3±0.3
4.2±0.2
F(mm)
3.7ref
3. Part Numbering
HPC
5040
NF
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
.
-
100
M
D
E
A/B*C
1R0=1.00uh 100=10uh,101=100uh,102=1000uh
K=±10%, L=±15%,M=±20%,Y=±30%.
marking direction cannot decide polarity. Color: Black, unidirectional.
magnetic shielding
G(mm)
2.1
H(mm)
I(mm)
4.2
1.5
Note : Recommend solder paste
thickness at 0.12mm and above
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P3
4. Specification
Rated current
Part Number
Inductance
L0 (uH)
@0A
Tolerance
K
L
M
Y
Temperature
current
I rms (A)
Saturation
current
I sat (A)
DCR
(mΩ) @25℃
±20%.
HPC5040NF-1R0
1.00
/
/
±20%
±30%
5.00
7.50
12
HPC5040NF-1R5
1.50
/
/
±20%
±30%
4.50
6.50
15
HPC5040NF-2R2
2.20
/
/
±20%
±30%
3.80
5.70
21
HPC5040NF-3R3
3.30
/
/
±20%
±30%
3.50
4.40
24
HPC5040NF-4R7
4.70
/
/
±20%
±30%
3.20
3.90
32
HPC5040NF-6R8
6.80
/
/
±20%
±30%
2.50
3.30
43
HPC5040NF-100
10.0
/
/
±20%
±30%
2.20
2.52
56
HPC5040NF-150
15.0
/
±15%
±20%
±30%
1.80
2.00
80
HPC5040NF-220
22.0
/
±15%
±20%
±30%
1.50
1.62
123
HPC5040NF-330
33.0
/
±15%
±20%
±30%
1.20
1.30
180
HPC5040NF-470
47.0
±10%
±15%
±20%
±30%
1.00
1.10
270
HPC5040NF-680
68.0
±10%
±15%
±20%
±30%
0.80
0.90
400
HPC5040NF-101
100
±10%
±15%
±20%
±30%
0.72
0.75
560
Note:
1. All test data referenced to 25℃ ambient , Ls:100KHz/1V.
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.).
4. Saturation Current (Isat) will cause L0
to drop
30% typical. (keep quickly).
5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
6. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P4
5. Material List
g
b
a
c
d
e
f
NO
Items
Materials
a
Core
Ferrite Core
b
Wire
Copper Wire
c
Glue
Magnetic Resin
d
Solder
Lead free-Sn Cu
e
Adhesive
Epoxy
f
Copper foil
Pure Copper
g
ink
Halogen-free ketone
6. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
1. -10~+40℃,50~60%RH (Product without taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
△L30% typical.
Saturation DC Current (Isat) will cause L0
to drop △L(%)(keep quickly).
Heat Rated Current (Irms)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃) without core loss.
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning:
Run
through
IR
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃(Inductor)
Life Test
reflow
for
2
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪ R.H,
Load Humidity
reflow
for
2
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Moisture Resistance
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Thermal
shock
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
for
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Vibration
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
2
TAI-TECH
P5
Item
Shock
Performance
Type
Peak
value
(g’s)
Normal
duration (D)
(ms)
SMD
1500
Lead
100
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Bending
Solderability
Test Condition
More than 95% of the terminal electrode should
be covered with solder。
Wave
form
Velocity
change
(Vi)ft/sec
0.5
Half-sine
15.4
6
Half-sine
12.3
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
=0805:1.2mm
0805:1kg ,
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