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1XVG025000RA

1XVG025000RA

  • 厂商:

    KDS(大真空)

  • 封装:

    SMD2520_4P

  • 描述:

    1XVG025000RA

  • 数据手册
  • 价格&库存
1XVG025000RA 数据手册
Serial No. : 2017-0561 DATE : 2017/06/28 CRYSTAL OSCILLATOR ITEM : DSV221SR TYPE : - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - 25.000MHz NOMINAL FREQUENCY : - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - 1XVG025000RA SPEC No. : - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - - - - -- - - - If there is a change in this specifications, the specification number may be changed. RECEIPT DATE RECEIVED (signature) (name) General Manufacture of Quartz Devices 1389 Shinzaike, Hiraoka-cho, Kakogawa, Hyogo 675-0194 Japan Phone (81)79-425-3141 Fax (81)79-425-1134 http://www.kds.info/index_en.htm C.ENG. ENG. Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 1/10 1. Device Name VCXO (Output Load Condition C-MOS) 2. Type Name DSV221SR 3. Nominal Frequency 25.000 MHz 4. Absolute Maximum Value Item Symbol Rating unit 1 Supply Voltage VCC -0.5 ~ +7.0 V 2 Storage Temperature Range T_stg -40 ~ +85 ℃ 5. Recommended Operating Conditions Item Symbol min. typ. max. unit 1 Supply Voltage VCC +1.62 +1.8 +1.98 V 2 Control Voltage Range Vcont 0 +0.90 +1.8 V 3 Operating Temperature Range T_use -10 - +70 ℃ 4 Output Load L_CMOS - - 15 pF 6. Electrical Characteristics (Unless otherwise noted: Ta=+25℃, L_CMOS=15pF, VCC=+1.8V, Vcont=+0.90V) Item Symbol Conditions VCC=+1.8±0.18V min. typ. max. unit -40 - +40 ppm 1 Frequency Tolerance f_tol 2 Frequency Control 1.Frequency Control Range f_cont Control Polarity: Positive Slope Vcont=+0.90±0.90V ±100 - - ppm Zcntr Vcont-GND 1 - - MΩ 3 Current Consumption ICC at No Load - - 4.0 mA 4 Output Character 45 - 55 % 2 Input Resistance Ta=-30~+85℃ Output :C-MOS 1.Symmetry SYM 50% VCC 2.Rise Time tr 10~90% VCC - - 10 ns 3.Fall Time tf 90~10% VCC - - 10 ns 4.Low Level VOL - - VCCx0.1 V 5.High Level VOH VCCx0.9 - - V Measurement circuit and output wave form is refer to Fig.1.and Fig.2. Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 2/10 N ot use for m easurem ent Icc TP mA V cc + S upply V oltage V - O utput V C XO 0.01μF V cont L_ C M O S GND V cont L_ C M O S :Including P robe and Jig C apacitance Fig.1.Measurement circuit tf tr VOH Vccx0.9 Vccx0.5 Vccx0.1 0V DC VOL TH TL TH SYM= x100 (%) TL+TH Fig.2.Output wave form Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 3/10 7. Dimensions 2.5 #3 #1 #2 Pin Connections Pin No. Connection #1 Vcont #2 GND Output #3 Vcc #4 Tolerance: ±0.15 unit: mm 0.815±0.08 2.0 #4 1.58 #2 #4 #3 0.68 #1 Index 0.53 1.23 #1 1.Type:refer to 【Type code】 2.Nominal Frequency:Include decimal point 4 dights 3.KDS LOGO(D) 4.Lot No. refer to 【Lot No.】 2 1 3 4 【Type Code】 Type Marking DSV221SR VR 【Lot No.】 Year (1digit)+Week (2digits) e.g. 2017/1/1 → 701 Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 4/10 8. Mechanical Performance 8.1 Natural Drop Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. The component shall satisfy requirement of the electrical characteristics. 8.2 Resistance impact 6ms/1000m/s2 to X,Y and Z axes (6 directions), 3cycles. The component shall satisfy requirement of the electrical characteristics. No physical damage. 8.3 Vibration Frequency 10~55Hz, Sine Wave full amplitude of 1.5mm to X, Y and Z axis, Duration of 2h to each axis. The component shall satisfy requirement of the electrical characteristics. No physical damage. 8.4 Sealing Tightness Leak Rate 1.0x10-9 Pa m3/s max. measured by Helium leak detector. And no bubble continued (1 time max.) in Fluorinert at +125±5℃. 8.5 Solderability After applying ROSIN Flux, dipping in solder bath at +245±5℃ for 5s. Over 90% of terminal shall be covered by solder. 9. Environment Performance 9.1 Humidity Temperature +60±2℃, RH 90~95%, Duration of 240h. Back to the room temperature first, then in 24h, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage. 9.2 Storage in Low Temperature Lower Operating temperature ±3℃, Duration of 240h. Back to the room temperature first, then in 24h, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage. 9.3 Storage in High Temperature Upper Operating temperature ±2℃, Duration of 240h. Back to the room temperature first, then in 24h, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage. 9.4 Temperature cycles Lower Operating temperature ±3℃(30 min) ⇔ Upper Operating temperature ±2℃(30 min) 20cycles. Back to the room temperature first, then in 24h, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage. 9.5 High Temperature Operation Upper Operating temperature ±2℃, maximam VCC Duration of 240h. Back to the room temperature first, then in 24h, the component shall be checked. The component shall satisfy requirement of the electrical characteristics. No physical damage. (*) Upper Operating temperature: Case of +85℃ max.-> +85℃ (*) Lower Operating temperature: Case of -30℃ max.-> -30℃ Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 5/10 10. Taping and Packing 10.1 Emboss Tape specifications Material:A-PET (Conductivity) unit: mm 10.2 Joint of Tape Emboss Tape and cover tape should not be jointed. Leader P ro d u c t S e t p a rt T ra ile r C o v e r ta p e o n ly C o v e r ta p e o n ly E m p ty E m b o s s E m p ty E m b o s s C o v e r ta p e E m b o s s ta p e # 1 in d e x P e e lin g d ire c tio n ***** *** ***** *** ***** *** ** ** ** 10.3 Taping Dimension Cover tape Leader Emboss tape The length of cover tape in the leader is more than 400mm including empty emboss area. After all products were packaged, must remain more than twenty pieces or 400mm empty area, which should be sealed by cover tape. Cover tape The tip of cover tape shall be fixed temporary by paper tape and roll around the core of reel one round. Emboss tape The empty emboss area which are sealed by cover tape must remain more than 40mm. Trailer Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 6/10 10.4 Peeling Strength of Cover tape The peeling strength of cover tape pulls and keep to angle 165~180° direction and make limit 0.1~0.7N without prescription, when it pulled it with the speed of 300mm/min. (Others conform to JIS C 0806_1990) Pulling direction 165 ~ 180° 10.5 Reel Dimensions A 0° 12 0° 9 12 11.4 Ф60 +1/-0 Ф180+0/-3 Material: PS (Conductivity) unit:mm A part 2 5±0.2 4±0.2 Ф13 Ф10 3-20 +0.4/-0 Ф21 3±0.2 Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 7/10 10.6 Storage Temperature:+40℃ max. Humidity:80% max. 10.7 Quantity on Reel 2000pcs./reel 10.8 Label in Reel Label at every reel. TYPE ******** SPEC ************** No. PARTS ************** No. (per your instruction) LOT ********* ** No. FREQ. * *.* * * * * * * Q’TY **** MADE IN JAPAN 10.9 Shipping Carton box Packed in a carton box. The following label on the side of carton box. The cushion is filled in the carton box. Item Lot No. Spec Q’ty Delivery Date Notes pcs Indication sheet Note) A designated actual thing vote uses it in the case that there is appointment. The above thing is used except for it. Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 8/10 11. Supplement 11.1 Soldering Please stay with our proposed reflow condition and do then soldering 2 times max. +260℃ A: Pre Heat +220℃ 120s B: Heat 60s max. +160~+180℃ C C: Peak 10s max. B A 11.2 Solder iron (Example) Bit temp.:+350℃ max. Duration: 5s max. Each terminal solder a 1 time max. 11.3 Land pattern layout (Example) 0.85 1.35 1.7 1.0 unit: mm Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 Serial No.2017-0561 DSV221SR TYPE SPECIFICATION 9/10 11.4 Mounting This component is designed for automatic insertion. However you are requested to do the trial with your insertion machine in order to be sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause soldering process. Please mount so that the metalize side and other electrical conductivity structures (a main part lid is included) of the ceramic base side do not contact electrically. 11.5 Cleaning Cleaning liquid which corrodes Nickel shall not be used. It may cause the problem on the surface color marking etc. Ultrasonic cleaning is possible however you are requested to check on your board. Because we only checked as single unit. 11.6 Handling This product is designed to withstand Drop and Vibration however the crystal blank might be broken. So if excess force is given, please check the characteristics before use. This Products has C-MOS circuit inside. Please pay attention to latch-up, static-electricity as same handling as other C-MOS devices. 11.7 By-pass Capacitor It has no by-pass capacitor integrated. We recommend you to use capacitor (like ceramic chip capacitor) 0.01μ F in-between VCC and GND. 11.8 Storage Please keep away from high temperature and high humidity, which may cause put solderbility. No direct Sunlight. No dew as well. 11.9 Thrust an ultrasonic cleaning Because It use a small, thin crystal piece depending on a condition, the inside does resonance, and there is fear to cause the non-oscillation. When it’ s the worst, it may be destroyed. About the ultrasonic cleaning, it is use in the implementation of your company is in a state and confirming a thing without the influence in the appearance and a characteristic beforehand. 11.10 Point out supersonic wave welding It can’ t recommend implementation by the supersonic wave welding and the processing so that the vibration excessive inside of the crystal oscillator propagates, and there is a threat that It cause characteristic deterioration and the non-oscillation. 11.11 About RoHS Compliance These Products do not contain the six substances restricted and prohibited on the restriction of the use of certain hazardous substances in electrical and electronic equipment. (DIRECTIVE 2011/65/EU OF THE EUROPIAN PARLIAMENT AND OF THE COUNCIL) Date Spec No. Rev. 2017/06/28 1XVG025000RA - Remark DAISHINKU CORP. DM-Z0002:Type-001 Ver.1 2017-0561 Revision Record Rev.No. Date - 2017/06/28 Reason Contents Initial Release Approved T.Hanaki Checked Drawn E.Kameda -10/10DM-Z0002:Type-005 Ver.1
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