SG901-1098 Miniature Wi-Fi Radio
Overview
Features
The SG901-1098 WiFi module is a shielded and
FCC module certified version of the SG901-1091
Radio Module.
It is optimized to simplify
successful integration into systems requiring the
latest performance with small size. This certified
module is a highly integrated single chip based
802.11b/g/n WLAN radio for embedded, lowpower and extremely small form factor mobile
applications. The product conforms to the IEEE
802.11b, g, and n protocols operating in the
2.45GHz ISM frequency band supporting
802.11g/n modulations from 6 to 65Mbps, and
802.11b modulations.
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The SG901-1098 is a fully integrated wireless
radio including RF Synthesizer/VCO, high-speed
data converters, digital baseband processor,
onboard MAC and PHY processors, Power
Management, and Power Amplifier.
On-chip auto-calibration eliminates unit specific
and customer calibration.
An on-board crystal and filter simplify system
integration. The addition of 2.3 to 4.8V and 1.8V
supplies, Antenna, and host communication
provides a complete WiFi solution.
Host control is provided by either an SDIO or SPI
interface at 1.8V.
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FCC Module Certifified, FCC ID VRA-SG9011098
Ultra Low Current Consumption
Supports SPI Interface and SDIO Interfaces
Small Footprint (13.5x21.25mm)
RF connector
Self Calibrated
RoHs Compliant
Fully Integrated 802.11 System Solution
Fully Compliant with the IEEE 802.11 WLAN
Standards
Support for 802.11g/n Modulations up to 65Mbps,
and Mandatory 802.11b Modulations
Intelligent Power Control, Including 802.11 Power
Save Mode
Factory Support for Linux /Android
Source Code Available for porting to RTOS or
Custom OS
Available under either:
o Industrial Temperature -40 to +85C
o Commercial Temperature 0 to +70C
Applications
• Hand-held Devices
• Embedded Systems
• Portable Systems
• Point of Sale terminals
• Personal Digital Assistants (PDA)
• Cameras
• Cable Replacement
Ordering Information
Packaging
Temp Range
Part Number
Tape and Reel
Industrial
SG901-1098-ET-TR
Bulk
Industrial
SG901-1098-ET-BLK
Tape and Reel
Commercial
SG901-1098-CT-TR
Bulk
Commercial
SG901-1098-CT-BLK
Evaluation Kit Available
This EVK supports embedded software
development.
EVK for 1098
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SG923-0010
DOC#: SG914-0034 Rev. 1.4
Block Diagram
VDDIO
Voltage
VBATT
IPEX
Antenna
Connection
Timebase
Supply Inputs
Power Management Unit
PA
T/R
Switch
ZIF
Transceiver
BB
Baseband
Processor
Processor
Host
Interface
Connection
SPI/SDIO
MA
C
To HOST
Hi Speed
g
Data
Converters
Standards Performance
Target Regulatory Domains
US – FCC
Canada – IC
EU – ETSI
Japan – TELEC
Standards Support
Modulations
Power Save
Encryption
Resources
Regulatory Support
Fast BSS Transition
Protected Frames
Direct Connect
1-800-779-7139
Yes
Planned
In Progress
Optional
b/g/n Modulations
802.11e/WMM/WMM-PS
802.11i/WEP/WPA/WPA2
802.11k
802.11d
802.11r
802.11w
Wi-Fi Direct
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DOC#: SG914-0034 rev.1.4
General Electrical Specifications
Parameter
Test Condition / Comment
Min.
Typ.
Max.
Units
Absolute Maximum Ratings
3.3V Supply
2.3
3.3
3.6
V
VHIO Supply
1.65
1.8
1.95
V
85
°C
3.3
3.6
Operating Conditions and Input Power Specifications
Operating Temperature Range
-40
Input Supply Voltage
2.3
Sleep Mode Current
3.3V Supply
VHIO Supply
V
80
uA
Power Save Mode
Current
DTIM = 1
0.87
mA
Peak TX Current
14.5dBm
294
mA
Peak RX Current
Processing OFDM
75
mA
Input Supply Voltage
VHIO input supply determines Host CMOS
logic levels
Input Supply Current
RX Active, processing OFDM
1.65
1.8
1.95
0.87
Sleep Mode Current
25
Input Voltage
Levels
VIL
-0.3
VIH
0.625VHIO
Output Voltage
Levels
VOL
IOL = 100uA
VOH
IOH = -100uA
V
mA
uA
0.35VHIO
V
V
VHIO-0.2
0.2
V
VHIO
V
RF Characteristics
Parameter
Test Condition / Comment
Antenna Port Impedance
Channel to Channel
De-sensitivity
Maximum Input Signal
1-800-779-7139
Typ.
50
Antenna Input Return Loss
RX Sensitivity
Min.
CH1 to CH14
Max.
Units
Ohms
-11
dB
11b, 1Mbps
-96
dBm
11b, 2 Mbps
-93
dBm
11b, 5.5 Mbps
-91
dBm
11b, 11 Mbps
-87
dBm
11g, 9Mbps
-89.5
dBm
11g, 18Mbps
-86
dBm
11g, 36Mbps
-80
dBm
11g, 54Mbps
-74.5
dBm
11n, MCS1, 13Mbps
-86.5
dBm
11n, MCS3, 26Mbps
-81.5
dBm
11n, MCS5, 52Mbps
-74
dBm
11n, MCS7, 65Mbps
-71
dBm
1
dB
-20
dBm
CH1 to 14
11g, 54Mbps 10% PER
CH7
11g, 54Mbps
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DOC#: SG914-0034 rev.1.4
RF Characteristics cont,
Parameter
Test Condition / Comment
Adjacent Channel
Rejection
Min.
Max.
Units
38
dBc
9Mbps
20
dBc
54Mbps
4
dBc
MCS1
24
dBc
MCS7
3
dBc
11b, 1Mbps
@802.11b spectral mask
11b, 11Mbps
11g, 9Mbps
TX Output Power
Typ.
11Mbps
@802.11g spectral mask
18.3
dBm
18.3
dBm
18.3
dBm
11g, 54Mbps
EVM = -27dB, 4.5%
13.7
dBm
802.11n MCS1
@802.11n spectral mask
18.3
dBm
802.11n MCS7
EVM = -27dB
13.5
dBm
Pinout List
SIGNAL NAME
PIN NUMBER
DESCRIPTION
NOTES
RF Pins
2G4_RF
U.FL Connector
2G4_RF
11
Hirose Electrical PN U.FL-R-SMT(10)
Optional PAD, Factory enabled only
Careful Layout for this RF Pad and nearby ground
Serial Interface Pins (VHIO Domain, logic levels compatible with the VHIO (Pin 26) input voltage)
SDCMD
21
SPI MOSI (input)
SDIO CMD
VHIO Domain
SDCLK
22
SPI Clock Input
SDIO CLK
VHIO Domain
SDD0
20
SPI MISO (output)
SDIO Data 0
VHIO Domain
SPI: Interrupt Output
SDIO Data 1
VHIO Domain, Push Pull. Indicated an interrupt on going
rising edge
SDIO Data 2
VHIO Domain- at reset, low selects SPI, high SDIO
SPI Chip Select Input
SDIO Data 3
VHIO Domain
SDD1
19
SDD2
18
SDD3
17
Control Pins
POWERUP
4
Power Up Enable (from Host)
RSTn
25
Reset Input
CLK32K
27
32.768 kHz Sleep Clock Input
VLDO Domain with internal pull up High = operating,
Low = off
VHIO Domain – Active Low reset, At power up,
RSTnmust be held LOW until 2 cycles of the CLK32K
have been initiated
VHIO Domain, Required for proper operation
Power and Ground Pins
26
Supply Voltage for I/O's
1.65 to 1.95V, Internally decoupled with a 0.1uF
capacitor
3.3V
8
RF PA supply
2.7 to 3.6V, Internally decoupled with a 10uF capacitor
GND
1,2,3,5,6,7,10,
12,13,14,15,16,
23,24,28,Paddle
VHIO
Ground Connections
SPI functions in MODE 3. Clock data in and out at the rising edge. SDCLK is idle at HIGH.
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DOC#: SG914-0034 rev.1.4
SG901-1098 SPI/SDIO Interfaces
The SPI/SDIO interface for the SG901-1098 is a 5-wire low voltage interface depicted in figure 1. SDD2
pin High/Active or grounded defines the interface type.
Figure 1: Host Interfacing Block Diagram
HOST
SG901-1098
22
SPI_CLK
17
SPI_CSN
SPI_MOSI
21
SDCLK
SDD3
SDCMD
SDD2 18
1.8V Interface
SPI_MISO
SPI_IRQ
20
SDD0
19 SDD1
SPI Interface
The five signals of the SG901-1098 SPI interface are as follows:
• SDD3: Device select allows the use of multiple slaves from a Host. (1 device select per slave).
This signal is active low. Signal is mandatory, even with only one slave because the Host must
drive this signal to indicate SPI frames.
• SDCLK: Clock signal, active for multiple data length cycles during a SPI transfer (SDD3) active).
The clock is allowed to be active when SDD3 is not active, in order to serve other possible
slaves.
• SDD0: Data transfer from SG1098 to Host. Data is generated on the negative edge of SDCLK by
the SG1098 and sampled on the positive edge of SDCLK. When SDD3 is inactive, SDD0 is in
Tri-state mode.
• SDCMD: Data transfer from Host to SG1098. Data is generated on the negative edge of SDCLK
by the Host and sampled on the positive edge of SDCLK
• SDD1: Interrupt from the SG1098, used to request a SPI transfer to the Host. This signal is
active High (Host input must be level sensitive).
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DOC#: SG914-0034 rev.1.4
The SG901-1098 SPI interface has the following characteristics:
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Maximum operating frequency of 52MHz.
The SPI interface operates in Half Duplex Mode.
Host is the Master and the SG1098 is the slave
The SPI data length, endianess and flow control are configurable. The Host can change the
configuration by writing in the SPI configuration register
16 and 32 bits word lengths are supported including the following configurable modes, where
[bn] is the bit transmission order from left to right:
32-bit Mode0:[b15-b8], [b7-b0], [b31-b24], [b23-b17]
32-bit Mode1:[b31-b24], [b23-b17], [b15-b8], [b7-b0]
32-bit Mode2:[b7-b0], [b15-b8], [b23-b17], [b31-b24]
16-bit Mode0:[b15-b8], [b7-b0]
16-bit Mode1:[b7-b0], [b15-b8]
The rising clock edge is used for sampling. Active clock edge for shifting is configurable
(rise/fall)
Supports automatic indirect addressing of device internal memory via fixed address SPI
register to facilitate bulk DMA transfer
Support Host wake up of the WLAN block by SPI register access
The default WLAN configuration is: (refer to figures 2 and 3)
32 bit data length
Most significant byte First, default is little Endian
Most significant bit First
Flow control on SDD0 and in a register
Figure 2: Default SPI transfer from Host to the SG901-1098
SPI Host to SG1098 Transfer
Host selects the
SG1098
Host de-Selects The SG1098
SDD3
SDCLK
IDLE
SDD0
SDCMD
WRITE
LENGHT
DATA
All Data
Transmitted
SDD1
Host sends Write Command
and Data to SG1098
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DOC#: SG914-0034 rev.1.4
Figure 3: Default SPI data transfer form the SG901-1098 to the Host
SPI SG1098 to Host Transfer
Host Selects the SG1098
Host De-selects the SG1098
SDD3
SDCLK
SDD0
IDLE
LENGHT
DATA
All data Transmitted
READ
SDCMD
SDD1
IDLE
Host sends Read command to
SG1098
SG1098 requests the BUS
SPI Timing Parameters. Refer to figure 4
Symbol
Description
Min.
T1
Clock Period
19.23
T2, T3
Clock High and Low duration
(0.45*T1)-T4
().55*T1)-T4
T4, T5
Clock rise and fall time (10 TO 90%)
1
2.5
ns
T6
Input Set Up time (SDCMD TO SDCLK active edge)
5
-
ns
T7
T8
T9
Input Hold time (SDCLK active edge to SDCMD Invalid)
Output Set Up time (SDCLK active edge to SDD0 Valid)
Output Hold time (SDCLK active edge to SDD0 Invalid)
5
14.23
5
ns
ns
ns
5
ns
1
ns
T10
T11
st
SDD3 to SDCLK (SDD3 fall to 1 SDCLK rising edge)
SDCLK to SDD3 (Last falling edge of SDCLK to SDD3 rising
edge
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Typ.
Max.
Units
ns
DOC#: SG914-0034 rev.1.4
ns
Figure 4: SPI Timing diagrams
T10
T11
SDD3
T1
T2
SDCLK
T3
T
T
T
T
SDCMD
T
T
SDD0
SDIO Interface
The SG901-1098 SDIO interface has the following characteristics:
Maximum operating frequency of 26MHz.
The SDIO interface is a 4 to 6 wire data interface
Compatible with the SDIO specification Version 1.10, except that the voltage range is not SD
compatible, but is compatible with the standard I/O levels defined in this data sheet
• Interrupt may be generated to the host in 4 bit SDIO mode even without the SDIO clock.
• The SDIO is master at the Host side and Slave at the 1098 side
• Operation in SD mode from 1 to 4 data bits
• The 6 signals are as follows:
SDCLK: clock signal
SDCMD: Bidirectional SDIO command line
SDD0: Bidirectional data line
SDD1: Bidirectional data line. When no data is present on this line, it is used as an interrupt from the
1098, used to request an SDIO transfer from the 1098 to the host
SDD2: Optional Bidirectional data line
SDD3: Optional Bidirectional data line
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DOC#: SG914-0034 rev.1.4
Figure 5: SDIO Timing Diagram
SDIO TIMING
T1
T2
SDCLK
T3
T
T
T
T
INPUT
T
T
OUTPUT
SDIO Interface timing. Refer to figure 5
Symbol
Description
Min.
T1
Clock Period
38.46
T4, T5
Clock Rise and Fall Time (10 to 90%)
T2, T3
Clock High and Low Time
10
T6, T7
Input Set Up and Hold Time (SDCMD TO SDCLK active edge)
5
T8, T9
Output Delay Time during data transfer mode
Typ.
Max.
Units
ns
9
-
ns
14
ns
WLAN Power Up/Down Sequence
The 1098 Power up sequencing is as follows:
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VHIO is applied
CLK32K (low power clock) is stable
RSTn pin is released after at least two CLK32K cycles
POWERUP is asserted. Internal supplies stabilize within 20ms
The Host must wait 30ms after RSTn release for all internal supplies to stabilize
The device is then in sleep mode
The Host shall then wake the module by writing over the Host interface, SPI or SDIO the
WUP bit
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ns
ns
DOC#: SG914-0034 rev.1.4
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The module requests the reference clock already running
The module will assert the RDY bit and assert the interrupt request to the Host
The Host can now download the firmware and release the by further SPI/SDIO write
The Host will wait for the Module to initialize and can clear the WUP bit
Once initialized including a series of messages between the Host and the module, the
Module may not have anything further to do and will enter the sleep state.
The 1098 power down has no constraints. It is recommended that the Host activates the RSTn at least 2
cycles of the CLK32K before powering off the supplies.
Figures 6 depicts the power up and down timing diagrams.
Figure 6. Power On and Off sequence diagrams
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DOC#: SG914-0034 rev.1.4
Software Support
The Wi-Fi module is supported via two different software stacks: 1) a Linux device driver (GPL License)
that integrates with the Linux mac80211 layer and existing usermode tools, and 2) a phone-handsetoriented chipset-vendor supplied software stack that is available for customers with non-GPL
requirements.
In both cases a license is required to distribute the chipset MAC firmware binary.
Linux Stack Features:
● Client mode
● Mini-AP mode (max 5 clients)
● Security: All standard modes (note: all packet encryption handled in MAC hardware)
○ Open System,
○ WEP,
○ WPA (TKIP) PSK and Enterprise, and
○ WPA2 (AES) PSK and Enterprise
● QoS
● OS Support: Linux v2.6 and 3.0, Android
● License: GPL
Vendor Stack Features:
● Client mode
● Mini-AP mode (max 5 clients)
● Security: All standard modes (note: all packet encryption handled in MAC hardware)
○ Open System,
○ WEP,
○ WPA (TKIP) PSK and Enterprise, and
○ WPA2 (AES) PSK and Enterprise
● QoS
● OS Support: Linux v2.6, Android, portable codebase
● License: chipset-vendor SLA
The complete 802.11 stack requires about 350KB of space for the implementation of the entire
specification. Extremely small versions can be created by knowledgeable customers but is a considerable
task and requires detailed understanding of 802.11.
As a service to customers, Sagrad offers extended technical support on a fee basis.
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DOC#: SG914-0034 rev.1.4
Mechanical
o
Maximum Peak Reflow Temperature: 240 C
Recommended Reflow Profile:
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•
PEAK
Ramp
0.5 –
2.0oC/sec
230-245oC
TAL
Target 235-240oC
35-90sec
Temperature ( 0C)
250
200
150
100
Not in scale
Ramp Up
50
0.8 – 1.7oC/sec
50
100
150
200
250
Time (Seconds)
300
350
400
130-220oC:Target 90-135sec
170-220oC:Target 60-90sec
Moisture Level Sensitivity: 1
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DOC#: SG914-0034 rev.1.4
Mechanical (Bottom view)
Pin numbering proceeds clockwise in the drawing above.
The nominal size of the part is 13.5x21.25mm with a height of 2.5mm.
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DOC#: SG914-0034 rev.1.4
Recommended Layout
PCB design requires detailed review of center exposed pad. This pad requires good thermal conductivity.
Soldering coverage should be maximized and checked via x-ray for proper design. There is a trade off in
providing enough soldering for conductivity and too much which allows the module to “float” on the paddle
creating reliability issues. Sagrad recommends two approaches, a large center via that allows excess
soldering to flow down into the host PCB with smaller vias arount it. Or many smaller vias with just
enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the smaller vias.
Each of these approaches need to result in 60% or more full contact solder coverage on the paddle after
reflow. Sagrad strongly encourages PCB layout teams to work with their EMS providers to ensure vias
and solder paste designs will result in satisfactory performance.
Note: Pin 1 is on the bottom left of this diagram.
This view is viewed from the top.
Packaging
The part comes packaged in Tape and Reel or Bulk.
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DOC#: SG914-0034 rev.1.4