EC19D01-RL

Rev. 1 Issued: 21-Oct-13 Datasheet EC19D01 (Preliminary) Powers the Internet of Things Revision History WiSmart™ EC19D0x Datasheet Revision History Rev Date 1 21-Oct-2013 REV.1, 21-Oct-13 Comments Initial document release ©eConais, Proprietary and Confidential 1 Disclaimer and copyright notice WiSmart™ EC19D0x Datasheet Disclaimer and copyright notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppels or otherwise, to any intellectual property rights are granted herein. • • • • • • • • • • • • • WiSmart™ is a trademark owned by eConais inc WiCReal™ is a trademark owned by eConais inc Wi-Fi™ is a trademark owned by Wi-Fi Alliance, U.S.A. Exynos, Exynos4210, FlexOneNAND, and OneNAND are trademarks of Samsung Electronics. ARM, Jazelle, TrustZone, and Thumb are registered trademarks of ARM Limited. Cortex, ETM, ETB, Coresight, ISA, and Neon are trademarks of ARM Limited. Java is a trademark of Sun Microsystems, Inc. SD is a registered trademark of Toshiba Corporation. MMC and eMMC are trademarks of MultiMediaCard Association. JTAG is a registered trademark of JTAG Technologies, Inc. Synopsys is a registered trademark of Synopsys, Inc. I2S is a trademark of Phillips Electronics. I2C is a trademark of Phillips Semiconductor Corp. MIPI and Slimbus are registered trademarks of the Mobile Industry Processor Interface (MIPI) Alliance All other trade names, trademarks and registered trademarks are property of their respective owners Copyright ©2013 eConais REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 2 Table of Contents WiSmart™ EC19D0x Datasheet Table of Contents Revision History.................................................................................................................................... 1 Disclaimer and copyright notice .......................................................................................................... 2 Table of Contents ................................................................................................................................. 3 1 Module Handling Guide ................................................................................................................ 5 2 List of Acronyms ........................................................................................................................... 6 3 Device details, block diagram and schematics ............................................................................. 7 4 Electrical Data ............................................................................................................................. 10 4.1 Absolute Maximum Ratings ................................................................................................ 10 4.2 Recommended Operating Conditions ................................................................................. 10 4.3 Current Consumption .......................................................................................................... 11 4.4 RF Performance ................................................................................................................... 11 4.5 Channel Frequencies ........................................................................................................... 11 4.6 Receiver Performance ......................................................................................................... 12 4.7 Receiver sensitivity .............................................................................................................. 12 4.8 Transmitter Performance .................................................................................................... 13 4.9 Output Power vs. Supply Voltage........................................................................................ 13 4.10 Output Power vs. Temperature .......................................................................................... 14 5 6 I/O Characteristics ...................................................................................................................... 15 5.1 SDIO timing characteristics ................................................................................................. 15 5.2 SPI timing characteristics .................................................................................................... 16 5.3 Digital I/O pad ..................................................................................................................... 17 5.4 Protection digital pins ......................................................................................................... 18 5.5 Shutdown ............................................................................................................................ 18 PIN Configuration........................................................................................................................ 19 6.1 Device Pin Out ..................................................................................................................... 19 6.2 Pin assignment .................................................................................................................... 21 6.3 Pin Functions and Configurations ....................................................................................... 21 7 Mechanical dimensions, footprint.............................................................................................. 24 8 Layout considerations................................................................................................................. 25 8.1 DC-DC converter .................................................................................................................. 25 REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 3 Table of Contents WiSmart™ EC19D0x Datasheet Reference Design ........................................................................................................................ 26 9 10 Reflow profile .......................................................................................................................... 27 11 Device Operation Description ................................................................................................. 28 11.1 WLAN Radio ......................................................................................................................... 28 11.1.1 WLAN RF Receiver ........................................................................................................ 28 11.1.2 RF Transmitter.............................................................................................................. 28 11.2 WLAN Baseband and MAC .................................................................................................. 28 11.2.1 Operational Modes ...................................................................................................... 28 11.3 Power ON Sequence with external 1.5 Volt Supply ............................................................ 30 11.3.1 Shutdown Sequence .................................................................................................... 30 11.3.2 Interfaces ..................................................................................................................... 31 11.3.3 Memory ........................................................................................................................ 32 11.3.4 Bluetooth Coexistence ................................................................................................. 32 11.4 Audio Subsystem ................................................................................................................. 33 11.4.1 I2S/PCM........................................................................................................................ 33 11.4.2 Class D .......................................................................................................................... 33 11.5 Power Management ............................................................................................................ 33 11.5.1 IO Supply ...................................................................................................................... 33 11.5.2 Ground ......................................................................................................................... 34 11.6 Clock Management.............................................................................................................. 34 11.6.1 High Frequency Clock, HFC .......................................................................................... 34 11.6.2 External reference requirements................................................................................. 35 11.6.3 Low Frequency Clock, LFC ............................................................................................ 35 11.7 WLAN Firmware .................................................................................................................. 36 11.7.1 Features........................................................................................................................ 36 12 Pick and Place and Packing information ................................................................................. 39 13 Contact Information ................................................................................................................ 41 REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 4 Module Handling Guide 1 WiSmart™ EC19D0x Datasheet Module Handling Guide Precaution against Electrostatic Discharge When using semiconductor devices, ensure that the environment is protected against static electricity: 1. Wear antistatic clothes and use earth band. 2. All objects that are in direct contact with devices must be made up of materials that do not produce static electricity. 3. Ensure that the equipment and work table are earthed. 4. Use ionizer to remove electron charge. Contamination Do not use semiconductor products in an environment exposed to dust or dirt adhesion. Temperature/Humidity Semiconductor devices are sensitive to: • Environment • Temperature • Humidity High temperature or humidity deteriorates the characteristics of semiconductor devices. Therefore, do not store or use semiconductor devices in such conditions. Mechanical Shock Do not to apply excessive mechanical shock or force on semiconductor devices. Chemical Do not expose semiconductor devices to chemicals because exposure to chemicals leads to reactions that deteriorate the characteristics of the devices. Light Protection In non- Epoxy Molding Compound (EMC) package, do not expose semiconductor IC to bright light. Exposure to bright light causes malfunctioning of the devices. However, a few special products that utilize light or with security functions are exempted from this guide. Radioactive, Cosmic and X-ray Radioactive substances, cosmic ray, or X-ray may influence semiconductor devices. These substances or rays may cause a soft error during a device operation. Therefore, ensure to shield the semiconductor devices under environment that may be exposed to radioactive substances, cosmic ray, or X-ray. EMS (Electromagnetic Susceptibility) Strong electromagnetic wave or magnetic field may affect the characteristic of semiconductor devices during the operation under insufficient PCB circuit design for Electromagnetic Susceptibility (EMS). REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 5 List of Acronyms 2 WiSmart™ EC19D0x Datasheet List of Acronyms Acronym 802.11™ AP BOM BPSK BT CCK COB DPSK DQPSK DTIM1 DTIM3 FW HFC I/O IC LDO LFC LNA MIB MIMO OFDM PA PLL POR QAM QPSK RAM RF RoHS ROM STBC UART VCO Description WLAN specification defined by a working group within the IEEE WLAN Access Point Bill of Material Binary Phase Shift Keying Bluetooth Complementary Code Keying Chip on Board Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Delivery Traffic Indication Message – 100ms beacon interval Delivery Traffic Indication Message – 300ms beacon interval Firmware WLAN, High Frequency Clock, 26 or 40 MHz Input/Output Integrated Circuit Low-dropout regulator Low Frequency Clock, 32.768 kHz Real Time Clock Low Noise Amplifier Management Information Base Multiple-In, Multiple-Out Orthogonal Frequency Division Multiplexing Power Amplifier Phase Locked Loop Power On Reset Quadrature Amplitude Modulation Quadrature phase-shift keying Random Access Memory Radio Frequency The Restriction of Hazardous Substances in Electrical and Electronic Equipment Directive (2002/95/EC) Read Only Memory Space-Time Block Coding Universal Asynchronous Receiver Transmitter Voltage Controlled Oscillator REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 6 Device details, block diagram and schematics 3 WiSmart™ EC19D0x Datasheet Device details, block diagram and schematics General Description EC19D01 is an 802.11bgn WLAN module including RF frontend circuitry, baseband, MAC, Clock Management and Power Management for direct battery operation. It also incorporates the balun and low pass filter and a 40MHz crystal. EC19D01 supports Bluetooth coexistence with the major Bluetooth chips available on the market. EC19D01 is designed for direct PCB attach without under-fill and a low BOM cost for the total solution. Key Features • Compliant with 802.11b/g/n • Supports direct attach to Li-Ion battery. Supports VBAT 2.7-4.5V with on-module power management. • Class D stereo headphone drivers • Digital Microphone input • I2S and PCM external codec interface • On-module IP stack and web server • WiFi Direct Group Owner (GO and Client) • Support for 802.11n up to MCS7, SGI 0.4us, STBC (Rx), L-SIG TXOP Protection, PSMP. • BT ePTA/PTA Co-existence support. • 802.1x, 802.11i, WEP, WPA, WPA2 (PSK/Enterprise, EAP), WPS security support, WAPI HW accelerator support. • 802.11e including WMM/WMM-PS QoS support. • 802.11d/h support • Support of SDIO 2.0 (52 MHz) host interface. • TX output power pre-calibrated in production. • High integration level o External clock reference 26, 38.4, 40, 52 MHz support (tolerance +/- 20 ppm). o Integrated TX/RX switches o Fully integrated power management (DCDC). o Support external Power Management. o Integrated PA and LNA. REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 7 Device details, block diagram and schematics WiSmart™ EC19D0x Datasheet Figure 1: EC19D0x Block diagram REV.1, 21-Oct-13 ©eConais, Proprietary and Confidential 8 Device details, block diagram and schematics REV.1, 29-Sep-13 WiSmart™ EC19D0x Datasheet ©eConais, Proprietary and Confidential 9 Electrical Data 4 WiSmart™ EC19D0x Datasheet Electrical Data 4.1 Absolute Maximum Ratings The absolute maximum ratings specify the values beyond which the device may be damaged permanently. Exposure to absolute maximum ratings conditions for extended periods of time may affect reliability. Each condition is applied with all other values kept within the recommended operating condition. Symbol VBAT VDD_DCDC VDD_IO, VDD_SDIO Parameter Direct battery connect Supply voltage Digital Supply voltage Supply voltage I/O Min. 0 -0.3 -0.3 Vin Input voltage on any digital pin -0.3 Vssdiff Tstg Maximum voltage difference between different types of Vss pins Storage temperature Max. 4.81 3.6 VDD_IO+0.3, VDD_SDIO+0.3 Unit V V V V V -65 125 °C Table 1:Absolute maximum ratings 1 2 : 5.5V acceptable for duration less than 2 ms : No Pb (Solder 40sec); Refer to the IPC/JEDEC J-STD-020C, July 2004. 4.2 Recommended Operating Conditions The recommended operating conditions specify the values in which region the device is operational meeting specification Symbol Tamb VBAT VDD_DCDC, VDD_IO, VDD_SDIO Parameter Operating ambient temperature Direct battery connect Supply voltage. - All specs guaranteed. - All specs guaranteed with output power back-off - Device functional with reduced performance Supply voltage I/O supply voltage Min. -30 Typ. Max. 70 Unit °C 2.7 3.6 4.5 V 3.6 V V 1.5 1.62 Table 2:Recommended operating condition REV.1, 29-Sep-13 ©eConais, Proprietary and Confidential 10 Electrical Data WiSmart™ EC19D0x Datasheet 4.3 Current Consumption VBAT current consumption. RF power, Pout, is referenced to IC interface. Conditions: VBAT= 3.6 V, Tamb = 25°C, internal DCDC for 1.5 Volt Mode Transmit 802.11b Transmit 802.11g Transmit 802.11n Receive 802.11b Receive 802.11g/n P0 (Sleep Mode) Power Save DTIM1 Power Save DTIM3 Shutdown Condition CCK 11Mbps, Pout=21 dBm OFDM 54 Mbps, Pout=18 dBm OFDM 72.2 Mbps, Pout=17 dBm (2.4 GHz) Normal mode – Max sensitivity Min Typ 220 215 Max Unit mA mA 185 mA 40 mA 42 mA 39 μA Beacon interval 100ms 0.8 mA Beacon interval 300ms 0.11 mA 10 μA Normal mode – Max sensitivity Table 3: Typical power consumption values in different modes 4.4 RF Performance All data is referenced to the IC interface. 4.5 Channel Frequencies Supported 2.4 GHz channels and frequencies according to IEEE802.11 b/g/n standard. Channel no. Frequency MHz 1 2 3 4 5 6 7 2412 2417 2422 2427 2432 2437 2442 Note Channel no. Frequency MHz 8 9 10 11 12 13 14 2447 2452 2457 2462 2467 2472 2484 Note Table 4: Channel and frequency table REV.1, 29-Sep-13 ©eConais, Proprietary and Confidential 11 Electrical Data WiSmart™ EC19D0x Datasheet 4.6 Receiver Performance Conditions: VBAT = 3.6 V. Tamb = 25°C. Mode Condition Min All data rates, CCK FER < 8%, OFDM PER < 10% Input level Adjacent channel rejection Typ Max Unit -20 dBm 11 Mbit/s, Pwanted = - 70 dBm 35 dB 6 Mbit/s, Pwanted = - 79 dBm 16 dB 54 Mbit/s, Pwanted = - 62 dBm -1 dB 72.2 Mbit/s, Pwanted = - 64 dBm -2 dB Table 5: Receiver performance 4.7 Receiver sensitivity Conditions: VBAT = 3.6 V, Tamb = 25°C. Standard 11n (OFDM, 20 MHz, Nss = 1) 2.4GHz 802.11b/g Band Rate Mbps 1 2 5,5 11 6 9 12 18 24 36 48 54 7,2 14,4 21,7 28,9 43,3 57,8 65 REV.1, 29-Sep-13 Modulation/Coding Rate DSSS DSSS CCK CCK BPSK 1/2 BPSK 3/4 QPSK 1/2 QPSK 3/4 16QAM 1/2 16QAM 3/4 64QAM 2/3 64QAM 3/4 MCS0 BPSK 1/2 MCS1 QPSK 1/2 MCS2 QPSK 3/4 MCS3 16QAM 1/2 MCS4 16QAM 3/4 MCS5 64QAM 2/3 MCS6 64QAM 3/4 Conditions @ FER