SMD0805P035TF

SMD0805 Series Surface Mountable PTC Resettable Fuse Features：      RoHS Compliant ＆ Halogen Free faster tripping, 0805 Dimension, Surface mountable, Solid state Operation Current: 0.05A~1.10A Maximum Voltage: 6V~15Vdc Operating Temperature：-40℃ TO 85℃ Product Dimensions Terminal pad materials :Tin-Plated Nickle-copper Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Pig.1 Unit ：mm Model Marking SMD0805 P005TF A B C D E Min Max Min Max Min Max Min Min 1 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.10 SMD0805P010TF 1 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.10 SMD0805P020TF 2 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.10 SMD0805P035TF 3 2.00 2.20 1.20 1.50 0.30 1.00 0.20 0.10 SMD0805P050TF 5 2.00 2.20 1.20 1.50 0.40 0.80 0.20 0.10 SMD0805P075TF 7 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 SMD0805P100TF 0 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 SMD0805P110TF 0 2.00 2.20 1.20 1.50 0.50 1.20 0.20 0.10 1/6 SMD0805 Series Surface Mountable PTC Resettable Fuse Thermal D erating Chart-IH（A） -40 -20 Maximum ambient operating temperatures（℃） 0 50 60 25 40 SMD0805 P005TF 0.07 0.06 0.055 0.05 0.04 0.35 0.3 0.25 0.15 SMD0805P010TF 0.14 0.12 0.11 0.1 0.8 0.7 0.6 0.5 0.3 SMD0805P020TF 0.28 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 SMD0805P035TF 0.47 0.44 0.39 0.35 0.30 0.27 0.24 0.20 0.14 SMD0805P050TF 0.68 0.62 0.55 0.50 0.40 0.37 0.33 0.29 0.23 SMD0805P075TF 1.00 0.90 0.79 0.75 0.63 0.57 0.53 0.41 0.34 SMD0805P100TF 1.35 1.25 1.10 1.00 0.82 0.74 0.65 0.55 0.42 SMD0805P110TF 1.45 1.35 1.20 1.10 0.92 0.84 0.75 0.65 0.52 Model 70 85 Electrical Characterist ic Vmax Imax Ihold I trip ( Vdc) (A) (A) (A) SMD0805 P005TF 15 100 0.05 SMD0805P010TF 15 100 SMD0805P020TF 9 SMD0805P035TF Pd Maximum time to trip Resistence Max. Current Time Rimin R1 max (W) (A) (Sec) () () 0.15 0.5 0.5 2.00 2.00 50.0 0.10 0.30 0.5 0.5 0 .20 0.50 0 .5 8.0 1.00 0 .50 6.00 100 1.50 0.02 6 100 0.35 0.75 0.5 8.0 0.10 0.25 SMD0805P050TF 6 100 0 .50 1.00 0 .6 8.0 0.10 0 .15 1.20 0. 85 SMD0805P075TF 6 100 0.75 1.50 0.6 8.0 0.20 0.09 0.385 SMD0805P100TF 6 100 1.00 1.95 0.6 8.0 0.30 0.06 0.23 SMD0805P110TF 6 100 1.10 2.20 0.6 8.0 0.30 0.06 0.21 Model 2/6 3. 50 SMD0805 Series Surface Mountable PTC Resettable Fuse Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Resistance In still air @ 25℃ Rmin≤R≤Rmax Time to Trip Specified current，Vmax，25℃ Tmaximum Time to Trip Hold Current 30min，at IH No trip Trip Cycle Life Vmax，Imax，100cycles No arcing or burning Trip Endurance Vmax，1 hours No arcing or burning Physical Characteristics and Environmental Specifications Physical Characteristics Terminal materials : Tin-Plated Nickle-copper Soldering Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. zone Environmental Specifications Test Conditions Resistance Change Passive aging 85℃,1000hours ±10% Humidity aging 85℃/85%RH.1000 hours ±5% Thermal shock MIL-STD-202,Method 107G +85℃/-40℃,20times -30% typical resistance change Solvent Resistance MIL-STD-202,Method 215 no change Vibration ML-STD-883C,Test Condition A No chage Electrical Specifications: Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. 3/6 SMD0805 Series Surface Mountable PTC Resettable Fuse Recommended pad layout (mm) Solder reflow conditions Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free. ● Devices are not designed to be wave soldered to the bottom side of the board. ● Recommended maximum paste thickness is 0.25mm (0.010inch). ● Devices can be cleaned using standard industry methods and solvents. ● Soldering temprature profile meets RoHs leadfree process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements 4/6 SMD0805 Series Surface Mountable PTC Resettable Fuse Tape Sp ecification And Reel Dimens ion s Coverning Specifications EIA 481-1(Unit:mm) W 8.00± 0.30 P0 4.0 ± 0.10 P1 4.0± 0.10 P2 2.0 ± 0.05 A0 1.65 ± 0.10 B0 2.35 ± 0.10 D0 1.55± 0.05 F 3.50± 0.05 E1 1.75 ± 0.10 T 0.20± 0.10 Leader min. 390 Trailer min. 160 Reel Dimensions A 178±1.0 N 59±1 W1 8.5+1.0/-0.2 W2 12.0±1 Packaging Quantity Model Quantity Model Quantity SMD0805P005TF 5000 SMD0805P050TF 5000 SMD0805P010TF 5000 SMD0805P075TF 4000 SMD0805P020TF 5000 SMD0805P100TF 4000 SMD0805P035TF 5000 SMD0805P110TF 4000 Storage The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present 5/6 SMD0805 Series Surface Mountable PTC Resettable Fuse WARNING • Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. • PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. • Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. • Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods. • Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices. 6/6