HY19P03 D/U/V
P-Channel Enhancement Mode MOSFET
Feature
Pin Description
-30V/-90A
RDS(ON)= 4.8mΩ(typ.)@VGS = 10V
RDS(ON)= 6.5mΩ(typ.)@VGS = 4.5V
100% avalanche tested
Reliable and Rugged
Lead Free and Green Devices Available
(RoHS Compliant)
TO-252-2L
TO-251-3L
TO-251-3S
Applications
Power Management in DC/DC converter.
P-Channel MOSFET
Ordering and Marking Information
Package Code
D
U
V
HY19P03
HY19P03
HY19P03
YYXXXJWW G
YYXXXJWW G
YYXXXJWW G
D: TO-252-2L
Date Code
YYXXX WW
U: TO-251-3L
V:TO-251-3S
Assembly Material
G:Halogen Free
Note: HOOYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate Termination finish; which are fully compliant with RoHS. HOOYI lead-free products meet or exceed the lead-Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HOOYI defines “Green”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).
HOOYI reserves the right to make changes to improve reliability or manufacturability without notice, and Advise
customers to obtain the latest version of relevant information to verify before placing orders.
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V2.1
1
HY19P03 D/U/V
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (Tc=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
-30
V
VGSS
Gate-Source Voltage
±20
V
Maximum Junction Temperature
150
°C
-55 to 150
°C
Tc=25°C
-90
A
Tc=25°C
-360
A
Tc=25°C
-90
A
Tc=100°C
-59
A
Tc=25°C
50
W
Tc=100°C
20
W
TJ
TSTG
Storage Temperature Range
IS
Drain Current-Continuous
Mounted on Large Heat Sink
Note:
IDM
Pulsed Drain Current *
ID
Continuous Drain Current
PD
Maximum Power Dissipation
RJC
Thermal Resistance, Junction-to-Case
2.5
°C/W
RJA
Thermal Resistance, Junction-to-Ambient **
110
°C/W
EAS
SinglePulsed-Avalanche Energy ***
358***
mJ
*
**
***
L=0.3mH
Repetitive rating; pulse width limited by max junction temperature.
Surface mounted on FR-4 board.
Limited by TJmax , starting TJ=25°C, L = 0.3mH, RG= 25Ω, VGS =10V.
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)
Symbol
Parameter
Test Conditions
HY19P03
Unit
Min
Typ
Max
VGS=0V,IDS=250uA
-30
-
-
V
VDS=-30V, VGS=0V
-
-
-1
uA
-
-
-10
uA
-3.0
V
±100
nA
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Drain-to-Source Leakage Current
VGS(th)
IGSS
RDS(ON)*
TJ=55°C
Gate Threshold Voltage
VDS=VGS, IDS=250uA
-1.0
-1.7
Gate-Source Leakage Current
VGS=±20V,VDS=0V
-
-
VGS=-10V,ID= -45A
-
4.8
6
mΩ
6.4
8
mΩ
-
-0.82
-1.3
V
-
25
-
ns
-
20
-
nC
Drain-Source On-state Resistance
VGS=-4.5V,ID= -45A
Diode Characteristics
VSD*
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD= -45A,VGS=0V
ISD= -45A,dI/dt=100A/us
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V2.1
2
HY19P03 D/U/V
Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted)
Symbol
Parameter
Test Conditions
HY19P03
Min
Typ
Max
-
3.5
-
-
4787
-
Unit
Dynamic Characteristics
Ciss
Input Capacitance
VGS=0V,VDS=0V,F=1
MHz
VGS=0V,
Coss
Output Capacitance
VDS=-15V,
-
461
-
Crss
Reverse Transfer Capacitance
Frequency=1.0MHz
-
329
-
td(ON)
Turn-on Delay Time
-
12
-
Tr
Turn-on Rise Time
VDD= -15V,RG=3Ω,
-
16
-
td(OFF)
Turn-off Delay Time
IDS= -45A,VGS=10V
-
75
-
-
37
-
-
90
-
-
7.6
-
-
19
-
RG
Tf
Gate Resistance
Turn-off Fall Time
Gate Charge
Ω
pF
ns
Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS = -24V, VGS= -10V,
ID= -45A,
Note: *Pulse test; pulse width ≤ 300us,duty cycle ≤ 2%
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V2.1
3
nC
HY19P03 D/U/V
Typical Operating Characteristics
-ID-Drain Current(A)
Voltage
Figure 2: Drain Current
Power Dissipation (w)
Figure 1: Power Dissipation
Tc-Case Temperature(℃)
Impedance
Thermal
Normalized Transient
Figure 4: Thermal Transient Impedance
Zθ jc
Voltage
-ID-Drain Current(A)
Figure 3: Safe Operation Area
Tc-Case Temperature(℃)
Maximum Effective Transient Thermal
Impedance, Junction-to-Case
-VDS-Drain-Source Voltage(V)
-VDS-Drain-Source Voltage (V)
Voltage
RDS(ON)-ON-Resistance(Ω)
Figure 6: Drain-Source On Resistance
Voltage
-ID-Drain Current(A)
Figure 5: Output Characteristics
- ID-Drain Current(A)
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V2.1
4
HY19P03 D/U/V
Typical Operating Characteristics(Cont.)
Voltage
-IS-Source Current (A)
Figure 8: Source-Drain Diode Forward
Voltage
Normalized On-Resistance
Figure 7: On-Resistance vs. Temperature
Tj-Junction Temperature (℃)
-VDS-Drain-Source Voltage (V)
Voltage
-VGS-Gate-Source Voltage (V)
Figure 10: Gate Charge Characteristics
Voltage
C-Capacitance(pF)
Figure 9: Capacitance Characteristics
-VSD-Source-Drain Voltage(V)
Q G-Gate Charge (nC)
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V2.1
5
HY19P03 D/U/V
Avalanche Test Circuit
Switching Time Test Circuit
Gate Charge Test Circuit
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V2.1
6
HY19P03 D/U/V
Device Per Unit
Package Type
Unit
Quantity
TO-252-2L
TO-251-3L
TO-251-3S
Tube
Tube
Tube
75
75
75
Package Information
TO-252-2L
COMMON DIMENSIONS
SYMBOL
mm
MIN
NOM
MAX
A
2.20
2.30
2.40
A1
0.00
-
0.20
A2
0.97
1.07
1.17
b
0.68
0.78
0.90
b3
5.20
5.33
5.50
c
0.43
0.53
0.63
D
5.98
6.10
6.22
D1
5.30REF
E
6.40
6.60
6.80
E1
4.63
-
-
e
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2.286BSC
H
9.40
10.10
10.50
L
1.38
1.50
1.75
L1
2.90REF
L2
0.51BSC
L3
0.88
-
1.28
L4
-
-
1.00
L5
1.65
1.80
1.95
θ
0°
-
8°
V2.1
7
HY19P03 D/U/V
TO-251-3L
COMMON DIMENSIONS
SYMBOL
mm
MIN
NOM
MAX
A
2.20
2.30
2.40
A2
0.97
1.07
1.17
b
0.68
0.78
0.90
b2
0.00
0.04
0.10
b2'
0.00
0.04
0.10
b3
5.20
5.33
5.50
c
0.43
0.53
0.63
D
5.98
6.10
6.22
D1
5.30REF
E
6.40
6.60
6.80
E1
4.63
-
-
e
2.286BSC
H
16.22
16.52
16.82
L1
9.15
9.40
9.65
L3
0.88
1.02
1.28
L5
1.65
1.80
1.95
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V2.1
8
HY19P03 D/U/V
TO-251-3S
COMMON DIMENSIONS
SYMBOL
mm
MIN
NOM
MAX
A
2.20
2.30
2.40
A2
0.97
1.07
1.17
b
0.68
0.78
0.90
b3
5.20
5.33
5.50
c
0.43
0.53
0.63
D
5.98
6.10
6.22
D1
5.30REF
E
6.40
6.60
6.80
E1
4.63
-
-
e
2.286BSC
H
10.00
11.22
11.44
L1
3.90
4.10
4.30
L3
0.88
1.02
1.28
L5
1.65
1.80
1.95
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V2.1
9
HY19P03 D/U/V
Classification Profile
Classification Reflow Profiles
Profile Feature
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to peak temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
150 °C
200 °C
60-120 seconds
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
217 °C
60-150 seconds
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
20** seconds
30** seconds
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
*Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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V2.1
10
HY19P03 D/U/V
Table 1.SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Volume mm³
Volume mm³
Thickness
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