TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Revision Record
Control No.
Revision
Description
Date
Drawn
Approved
2017/08/30
Heter
Roger
2018/02/09
Heter
Roger
2018/03/05
Heter
Roger
2018/05/16
Heter
Roger
Initial release
A0
TMAX-0420-R10-M
TMAX-0420-1R0-M
Add
A1
TMAX-0420-4R7-M
TMAX-0420-6R8-M
A2
Add
TMAX-0420-2R2-M
Add
TMAX-0420-R22-M
A3
TMAX-0420-R47-M
TMAX-0420-1R5-M
TMAX-0420-3R3-M
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TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
TMAX-0420-XXX-M Molded Power Inductor
Features
Low profile
Low core loss and low DCR
High rated current
High performance (Isat) realized by metal dust core
RoHS compliant and Halogen Free
Low EMI and low noise
Applications
Voltage Regulator Module
DC/DC converters
Thin type on-board power supply module for exchanger
Graphics cards
Laptops and PCs
SSD modules
Product Description
TMAX - 0420
- 1R0 -
M
Tolerance
Inductance
Dimensions
Product Series
M=±20%
1R0=1.0μH
Dimensions in millimeters
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A
4.4±0.35
B
4.2±0.25
C
2.0 Max.
D
2.0±0.2
E
0.8±0.3
F
0~0.15
TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Recommend Land Pattern Dimensions in millimeters
5.2
2.5
2.2
Marking
The inductor is marked with a 3-digit code by ink.
For example: 1R0→ 1.0μH, R10→ 0.1μH.
Inductance:
1.0μH
Specifications
Inductance
DCR (mΩ)
Part No.
Saturation
Heat Rating
Current
Current
Isat (Amps.)
Idc (Amps.)
L0(μH)
Tolerance
Typ.
Max.
Typ.
Typ.
TMAX-0420-R10-M
0.1
±20%
3.1
4.0
25
12
TMAX-0420-R22-M
0.22
±20%
5.8
6.6
16
11
TMAX-0420-R47-M
0.47
±20%
12.5
14
9.5
7.5
TMAX-0420-1R0-M
1.0
±20%
20
26
7.0
5.0
TMAX-0420-1R5-M
1.5
±20%
38
46
6.0
5.0
TMAX-0420-2R2-M
2.2
±20%
45
58
5.0
4.5
TMAX-0420-3R3-M
3.3
±20%
76
87
4.0
3.2
TMAX-0420-4R7-M
4.7
±20%
92
105
3.0
3.0
TMAX-0420-6R8-M
6.8
±20%
125
150
2.8
2.5
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TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Notes:
1. All test data is referenced to 23±3 °C and 45%RH to 70%RH ambient.
2. Test Instruments:3260B LCR Meter, 3265B Bias Current Source(100kHz,1V),EUCOL-U2516B
DC Low ohm meter.
3. Operating temperature range - 55 °C to + 125 °C(ambient + self-temp. rise).
4. Isat: DC current (A) that will cause L0 to drop approximately 30 %.
5. Idc: DC current (A) that will cause an approximate ΔT of 40 °C.
6. The part temperature (ambient + temp. rise) should not exceed 125 °C under worst case operating
conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other
cooling provisions all affect the part temperature. Part temperature should be verified in the end
application.
7. The rated current as listed is either the saturation current or the heat rating current depending on
which value is lower.
Inductance and Temperature Rise vs. DC Current
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天通控股股份有限公司
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Revision:
Control No.:
A3
TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Reliability:
Item
Test Method
Solderability
Solder heat proof :
1.Preheating: 160 10°C for 90 seconds
2.Retention time: 245 5℃ for 2
0.5 seconds
Vibration
1.Vibration frequency:
(10Hz to 55Hz to10Hz) in 60 seconds
as a period
2.Vibration time:
period cycled for 2 hours in each of 3
mutual perpendicular directions
3.Amplitude: 1.5mm max.
Shock
Specification and Requirement
The surface of terminal immersed
shall be minimum of 95% covered
with a new coating of solder.
ΔL/L0≤ 5%
No mechanical damage such as
1.Peak value: 100 G
2.Duration of pulse: 11ms
3.3 times in each positive and negative
direction of 3 mutual perpendicular
directions
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break.
TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Reliability:
Item
Test Method
Thermal Shock
1.Repeat 100 cycle as follow:
(-55 2°C,30 3minutes) (Room
temperature, 5 minutes)(+125 2°C,30
3minutes)
(Room temperature, 5 minutes)
2.Recovery: 48 + 4 / - 0 hours of recovery
under the standard condition after the test
High Temperature
Resistance
1.Environment Temperature : 85 2°C
2.Applied Current: Rated current
3.Duration : 1,000 + 4 / - 0 hours
Specification and Requirement
ΔL/L0≤ 5%
No distinct damage in
appearance.
Humidity
Resistance
Low Temperature
Store
High Temperature
Store
1.Environment Temperature: 60 2°C
2.Relative Humidity: 90~95%
3.Applied Current: Rated current
4.Duration: 1,000 + 4 / - 0 hours
1.Store temperature: -55 2°C for total
1,000 + 4 / - 0 hours
1.Store temperature: +125 2°C for total
1,000 + 4 / - 0 hours
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TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Packaging Dimensions in millimeters
G
F
I
T
H
A
4.5 0.1
4.8 0.1
2.5 0.15
0.35 0.05
8.0 0.1
12 0.2
J
K
D
E
B
C
φ1.5 0.1
φ1.5 0.1
2.0 0.1
4.0 0.1
5.5 0.1
1.75 0.1
100 ± 1.0
330.0 ± 2.0
Reel Dimensions in millimeters
20.0 ± 0.5
2.0 ± 0.5
13.0 ± 1.0
B
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A
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A
B
Color
12.5 0.2
2.0 0.2
Blue
TDG HOLDING CO., LTD.
天通控股股份有限公司
Peeling of top cover tape
The peeling speed shall be about 300 mm/minute.
The peeling force shall be between 0.1 to 0.7 N.
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Control No.:
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TDG HOLDING CO., LTD.
天通控股股份有限公司
Reflow Profile
Revision:
Control No.:
A3
Table1-StandardSnPb Solder(Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≧350
<2.5mm
235℃
220℃
≧2.5mm
220℃
220℃
Table2-Lead(Pb)Free Solder(Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350-2000
Volume
mm3
>2000
<1.6mm
260℃
260℃
260℃
1.6-2.5mm
260℃
250℃
245℃
>2.5mm
250℃
245℃
245℃
Reference JDEC J-STD-020(latest revision)
Profile Feature
Standard SnPb solder
Lead(Pb) Free Solder
●Temperature min.(Tsmin)
100℃
150℃
●Temperature max.(Tsmax)
150℃
200℃
●Time(ts):Tsmin to Tsmax
60-120 Seconds
60-120 Seconds
Average ramp up rate TL to Tp
3℃/Second Max.
3℃/Second Max.
Liquidous temperature(TL)
183℃
183℃
Time at liquidous (tL)
60-150 Seconds
60-150 Seconds
Peak package body temperature(Tp)*
Table 1
Table 2
20seconds**
30seconds**
Average ramp-down rate Tp to TL
6℃/Second Max.
6℃/Second Max.
Time 25℃ to Peak Temperature
6 Minutes Max.
8 Minutes Max.
Preheat and Soak
Time (tp)**within 5 ℃
of the specified classification
temperature(Tc)
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Numbers of taping
3,000 pieces/reel
Label marking
The following items shall be marked on the production and shipping
Label on the reel
Production Label
Part No.
Description
Quantity
Produce No.
Taping No.
Shipping Label
Customer’s Name
Customer’s Part No.
Manufacturer’s Part No.
Manufacturer’s Name
Manufacturer’s Country
Care note for use
Storage Condition: Temperature 25 to 35°C, Humidity 45 to 75% RH
Use Temperature:
Minimum Temperature: -55°C Ambient temperature of molded power inductor.
Maximum Temperature: +125°C The value of temperature including ambient of the
transformer and temperature rise of molded power inductor.
There is not a problem from -55°C ~ +125°C in a reliability test.
However, this is not meant a temperature grade guarantee of UL.
Model: When this molded power inductor was used in a similar or new product to the
original one, sometimes it might be unable to satisfy the specifications due to difference
of condition of usage.
Drop: If the molded power inductor suffered mechanical stress such as drop,
characteristics may become poor (due to damage on coil bobbin, etc.).Never use such
stressed molded power inductor.
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TDG HOLDING CO., LTD.
天通控股股份有限公司
Revision:
Control No.:
A3
Care note for Safety
Provision to Abnormal Condition
This molded power inductor itself does not have any protective function in abnormal
condition such as overload, short-circuit and open-circuit conditions, etc. Therefore, it
shall be confirmed as the end product that there is no risk of smoking, fire, dielectric
withstand voltage, insulation resistance, etc. in abnormal conditions to provide protective
devices and/or protection circuit in the end product.
Temperature Rise
Temperature rise of molded power inductor depends on the installation condition on end
products. It shall be confirmed on the actual end product that temperature rise of molded
power inductor is in the limit of specified temperature class.
Dielectric Strength
Dielectric withstanding test with higher voltage than specific value will damage insulating
material and shorten its life.
Water
This molded power inductor must not be used in wet condition by water, coffee or any
liquid because insulation strength becomes very low on the condition.
Potting
If this molded power inductor is potted in some compound, coating material of magnet
wire might be occasionally damaged. Please ask us if you intend to pot this molding.
Detergent
Please consult our company once in case of this because the confirmation of reliability
etc. is needed when the washing medicine is used for the molded power inductor.
Notes
This electronic component has been designed and developed for usage in general
electronic equipment only, not for usage in areas such as military, aerospace, aviation,
transportation (automotive control, train control, ship control) etc.. TDG Holding Co., Ltd.
must be informed about the intent of such usage before the design-in stage and the
parties must have executed an agreement specifically governing such use. In addition,
sufficient reliability evaluation checks for safety must be performed on every electronic
component.
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