SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.:
HELE. Part No: SSW32768KF3CHC-IT
Application For:
Products:
Accepted Model:
Type & Freq.: HSO321S(RTC)/32.768KHz
EOS-C30007-1
Sample Order No:
OSCILLATOR
2012/03/07
Date:
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN (R.O.C.)
TEL:886-2-26588883
FAX:886-2-26588683
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TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路 39 號
No.39, Hua dong Rd., Daliao Dist.,Dafa
Industrial Park., Kaohsiung City 831,
Taiwan (R.O.C.)
TEL: (07)787-1555-6
FAX: (07)787-1557
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THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6, 200740-1
FAX: (032)200742
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-7309272 / 7309262
FAX: 0755-7309755
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HSO321S(RTC)
SPECIFICATION
INDEX
Tittle
Date
ITEM
PAGE
1. Type..............................
3
2. Output Frequency.......................
3
3. Absolute Maximum Ratings...................
3
4. Electric Specifications.....................
3-4
5. Dimensions...........................
5
6. Inside Structure.........................
6
7. Mechanical Performance.....................
6
8. Environment Performance....................
7
9. Supplement...........................
8-9
10. Taping and Packing.......................
9-11
11. Flow Chart...........................
12
12.Environmental Workload Chemical Substance Components List..
13
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1. Type Name:
HSO321S(RTC)
2. Output Frequency:
32.768000 KHz
3. Absolute Maximum Ratings:
Item
Symbol
Vdd terminal voltage
Vdd
Input terminal voltage
Vcont
Output terminal voltage
Vout
Output terminal current
Iout
Storage temp. range
Tstr
4.
Value
-0.5 ~ 4.0
-0.5 ~ Vdd+0.5
-0.5 ~ Vdd+0.5
20
-55 ~ 125
Unit
V
V
V
mA
deg.C
Electric Specifications:
Item
Symbol
Min
-30
-40
3.0
Value
Typ
25
3.3
Max
+30
+85
3.6
Unit
Etc
Condition
Vdd
Temp
Δf/F
Frequency Stability
ppm
3.3+/℃
Operating temp. range
Topr
0.3V
Supply voltage
Vdd
V
Current consumption 1
Idd1
3
mA
(#1 pin: open or "H")
Current consumption 2
Idd2
0.01
mA
(#1 pin: "L" level)
Fig1,2 3.3V
Symmetry
Duty
40
50
60
%
0.1xVdd
Low level output voltage
Vol
V
0.9xVdd
High level output voltage
Voh
V
Rise & Fall time
Tr & Tf
10
ns
Pin #1 options
YES
Output load
C-MOS CL = 15pF (Idd1, Idd2 test at No Load)
Low level input current
Iil
10
uA
High Level input current
Iih
10
uA
Vddx0.3
Low level input voltage
Vil
V
Vddx0.7
Fig3
3.3V
High level input voltage
Vih
V
Output disable time
Tplz
150
nsce
Output enable time
Tpzl
5
msce
ppm/year
Aging
-5
5
F :Output Frequency
Δf =Oscillation Frequency – F
Frequency Stability is inclusive of 25℃
Tolerance, operating temperature range, input voltage change,
Load chang, first of aging , shock and vibration.
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-40~85
℃
25+/-3
℃
25+/-3
℃
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Fig. 1) Measurement Circuit :
CL = Include jig & probe capacitance
(Refer to 4)
Switch
H
Open
L
Out term.
Oscillation out
Oscillation out
High Z
Fig. 2) Output Wave Form:
Fig. 3) Input Output Condition:
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5.
Dimensions:
Lot No.:
Year : Last digit of the year
Year
Code
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
0
1
2
3
4
5
6
7
8
9
Month : Alphabet assign below
Month
1
2
3
4
5
6
7
8
9
10
11
12
Code
A
B
C
D
E
F
G
H
J
K
L
M
Marking : Laser marking or Ink marking.
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6.
Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metalized Pad:
Ni Plating
Au Plating
(2)IC
IC(Si. Al. Ti.)
(3) Au Bonding Wire:
Au
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) LID:
Fe+Ni+Co
(6) Adhesive
Silver Conductive Silicon Resin
Inside Structure:
The use prohibition chemistry substance
of Table 1 of DHE-0204-1 (HE-QA-24) is
not included in this item.
7. Mechanical Performance:
1
Specifications
Code
Item
Test Methods
Natural Drop
Drop 3 times from the height of 50cm onto min. 30mm thickness hard
A
wooden board.
2
Vibration
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z
A
3 axes, Duration of 2 hours to each axis.
3
Sealing Tightness
(1) Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak
detector. – Fine Leakage.
---
(2) Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes, no gas
bubble observed from the inside of the can.
4
Solderability
After applying ROSIN Flux, dipping in solder bath at
B
245deg.C+/-5deg.C for 3+/-0.5 sec.
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8.
Environment Performance:
Item
1
Specifications
Code
Test Methods
Humidity
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours.
A
Back to room temperature first, then in 1~2 hours, the component shall
be checked.
2
Storage in Low
-40deg.C +/-2deg.C, Duration of 240 hours.
Temperature
Back to the room temperature first, then in 1~2 hours, the component
A
shall be checked.
3
Storage in High
+85deg.C +/-2deg.C, Duration of 240 hours.
Temperature
Back to the room temperature first, then in 1~2 hours, the component
A
shall be checked.
4
-30deg.C +/-2deg.C (30min) ↔ +80deg.C +/-2deg.C (30min) 25
Temperature cycles
cycles. Temp. increasing or reducing time need to be within 3 minutes.
A
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
5
High Temperature
+85deg.C +/-2deg.C, +3.3V Vdd Duration of 240 hours.
Operation
Back to the room temperature first, then in 1~2 hours, the component
A
shall be checked.
Specifications code
Specifications
A
Frequency variation shall be within +/-5ppm and equivalent resistance shall be within
the specification after the test
B
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More than 90% of lead shall be covered by new solder.
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9.
Supplement:
9.1. Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
9.2.Land Pattern Layout: (Example)
9.3.Solder Iron: (Example)
Bit temp.:350deg.C Max. ,
Time:3sec Max. , Each terminal solder a 1 time Max.
9.4.Mounting:
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering Process.
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9.5.Cleaning:
Cleaning liquid which corrodes Nickel shall not be used.
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
9.6.Handling:
HSO321S series is designed to withstand Drop and Vibration, however, the crystal
blank might be broken. So, if excess force is given, please check the characteristics
before use.
HSO321S series has C-MOS circuit inside. Please pay attention to static-electricity as
same handling as other C-MOS. devices.
9.7.By-pass Capacitor:
It has no by-pass capacitor integrated. We recommend you to use capacitor (like
ceramic chip capacitor) 0.01μF in-between Vdd and GND.
9.8.Storage:
Please keep away from high temperature and high humidity, which may cause put
solderbility. No direct Sunlight, No dew as well.
10. Taping and Packing:
10.1.Emboss Tape Specifications:
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10.2.Reel Specifications:
(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
9.3+/-0.3
Outer Width
W2
Out Line diameter
B
11.3+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Center
Core slit
Width
Position
Spindle diameter
Key Ditch
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Width
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10.3.Storage:
Temperature+40deg.C Max.
Humidity 80% Max.
10.4.Quantity on Reel:
3,000 PCS/REEL
10.5.Label:
Label is following information:
10.6.Shipping Carton:
The size carton box is shown as below. One carton contains 10 reels. In case of less
than 10 reels, suitable size of carton will be used. The cushion is filled in the carton
box, which material shall be anti-static.
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11.
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Flow Chart:
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12. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
D(H)SO321S
PERCENTAGE
25.2(mg)
ppm
WOLFRAM AND ITS COMPOUND(W)
0.21168
53.3434
COBALT AND ITS COMPOUND(Co)
0.96900
244.1880
CHROMIUM AND ITS COMPOUND(Cr)
0.07308
18.4162
SILVER(Ag)
0.15876
40.0075
COPPER(Cu)
0.07812
19.6862
NICKEL AND ITS COMPOUND(Ni)
2.26044
569.6309
MANGANESE AND ITS COMPOUND(Mn)
0.02016
5.0803
MOLYBDENUM AND ITS COMPOUND(Mo)
0.12348
31.1170
SILICON AND ITS COMPOUND(Si)
0.28476
71.7595
ALUMINIUM AND ITS COMPOUND(Al)
7.96320
2006.7264
GOLD(Au)
0.15372
38.7374
IRON(Fe)
3.37176
849.6835
Chemical Substance Components
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REV.
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REASON
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2012/03/07
NEW
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CONTENTS
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