Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 1 of 10
S P E C I F I C AT I O N S
Customer
Product Name
Multi-layer Chip Ferrite Bead
Sunlord Part Number
PZ1005U471-R50TF
Customer Part Number
[
New Released,
Revised]
SPEC No.: PZ10190000
【This SPEC is total 10 pages including specifications and appendix.】
【ROHS Compliant Parts】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For Customer approval Only】
Qualification Status:
Full
Approved By
Comments:
Verified By
Restricted
Date:
Rejected
Re-checked By
Checked By
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 2 of 10
【Version change history】
Rev.
01
Effective Date
Changed Contents
Change Reasons
Approved By
New release
/
Hai Guo
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 3 of 10
Caution
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The
products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or
quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person,
or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the
applications below. Please contact us for more details if you intend to use our products in the following applications.
1. Aircraft equipment
2. Aerospace equipment
3. Undersea equipment
4. nuclear control equipment
5. military equipment
6. Power plant equipment
7. Medical equipment
8. Transportation equipment (automobiles, trains, ships,etc.)
9. Traffic signal equipment
10. Disaster prevention / crime prevention equipment
11. Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
1.
Scope
This specification applies to PZ1005U471-R50TF of multi-layer ferrite chip bead.
2.
Product Description and Identification (Part Number)
1)
Description:
Multi-layer ferrite chip beads.
2)
Product Identification (Part Number)
PZ
1005
U
471
-R50
T
①
②
③
④
⑤
⑥
F
⑦
①
②
Type
PZ
③
For Large current
Page 4 of 10
External Dimensions(L X W) [mm]
1005 [0402]
1.0 X 0.5
Material Code
U
④
⑤
Rate Current
R50
0.50A
⑥
Packing
T
3.
Nominal Impedance
Example
Nominal Value
471
470Ω
⑦
Tape Carrier Package
HSF Products
Hazardous Substance Free Products
Electrical Characteristics
Part Number
Impedance (Ω)
PZ1005U471-R50TF
470±25%
Z Test Freq.
(MHz)
DCR
(Ω) Max.
Ir
(mA) Max.
100
0.300
500
Impedance Frequency Characteristics
PZ1005U471-R50TF
800
impedance(Ω)
600
Z
400
R
200
X
0
1
10
100
Frequency(MHz)
1)
2)
Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃
Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.)
1000
3000
Sunlord
4.
Specifications for Multi-layer Chip Ferrite Bead
Page 5 of 10
Shape and Dimensions
1)
Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table 4-1.
2)
Structure: See Fig. 4-3 and Fig. 4-4.
Solder-resist
Chip Bead
C
Land pattern
B
Fig. 4-1
A
B
Fig. 4-2
[Table 4-1]
Unit: mm [inch]
Type
L
W
T
a
A
B
C
1005
[0402]
1.0±0.15
[.039±.006]
0.5±0.15
[.020±.006
0.5±0.15
[.020±.003]
0.25±0.1
[.010±.006]
0.45~0.55
0.40~0.50
0.45~0.55
T
Structure of
Electro-plating
① Ferrite for Bead Series
② Internal electrode (Ag)
L
a
T
a
Ferrite
Sn
④-1 Terminal electrode: Inside (Ag)
Ni
W
④-2
④-2 Outside (Electro-plating Ni-Sn)
④-1
②
①
③
Ag
④
Fig. 4-4
Fig. 4-3
3)
③ Pull out electrode( Ag)
Material Information: See Table 4-2.
[Table 4-2]
5.
Code
Part Name
Material Name
①
Ferrite Body
Ferrite Powder
②
Inner Coils
Silver Paste
③
Pull-out Electrode (Ag)
④-1
Terminal Electrode: Inside Ag
④-2
Electro-Plating: Ni/Sn plating
Silver Paste
Termination Silver
Composition
Plating Chemicals
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86kPa to 106kPa
If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65±5%
c. Air Pressure: 86kPa to 106kPa
5.2 Visual Examination
a. Inspection Equipment: 20× magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a. Refer to Item 3.
b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
5.3.2 Impedance (Z)
a. Refer to Item 3.
b. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent.
Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216/4516.
Test signal: -20dBm or 50mV
c. Test frequency refers to Item 3.
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 6 of 10
5.3.3 Rated Current
a. Refer to Item 3.
b. Test equipment (see Fig. 5.3.3-1): Electric Power, Electric current meter, Thermometer.
c. Measurement method (see Fig. 5.3.3-1):
1. Set test current to be 0mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20℃.
against chip initial surface temperature(Ta). (see Fig. 5.3.3-2):
Temperature (℃)
Thermometer
Electric Power
Electric Current
+20
Meter
Ta
Chip
R
0
Rated current
Fig. 5.3.3-1
Ir (mA)
Fig. 5.3.3-2
e. When operating temperatures exceeding +85℃, derating of current is necessary for chip ferrite beads for which rated
current is 1000mA and over. Please apply the derating curve shown in chart Fig. 5.3.3-3 according to the operating
temperature.
7
6
Derated Current[A]
5
4
3
2.
2
1.5
51
0.
0
8 0
50
85
100
Operating Temperature[℃]
Fig. 5.3.3-3
125
150
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 7 of 10
5.4 Reliability Test
Items
Requirements
5.4.1
Terminal
Strength
Test Methods and Remarks
No removal or split of the termination or other
defects shall occur.
Chip
②
③
④
F
Mounting Pad
①
Solder the bead to the testing jig (glass epoxy board shown in
Fig. 5.4.1-1) using leadfree solder. Then apply a force in the
direction of the arrow.
5N force for 1005 series,
Keep time: 10±1s.
Speed:1.0mm/s.
Glass Epoxy Board
Fig.5.4.1-1
5.4.2
Resistance
Flexure
①
No visible mechanical damage.
to
Type
1005[0402]
a
b
c
0.4
1.5
0.5
②
③
④
Solder the bead to the test jig (glass epoxy board shown in Fig.
5.4.2-1) Using a leadfree solder. Then apply a force in the
direction shown Fig. 5.4.2-2.
Flexure: 2mm.
Pressurizing Speed: 0.5mm/sec.
Keep time: 30 sec.
Unit: mm [inch]
20
10
Φ4.5
c
a
R230
Flexure
40
b
45[1.772]
100
Fig. 5.4.2-1
5.4.3
Vibration
①
②
No visible mechanical damage.
Impedance change: within ±20%.
Fig. 5.4.2-2
①
②
Cu pad
45[1.772]
Solder mask
③
Glass Epoxy Board
Fig. 5.4.3-1
Solder the bead to the testing jig (glass epoxy board
shown in Fig. 5.4.3-1) using leadfree solder.
The bead shall be subjected to a simple harmonic motion
having total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be
applied for a period of 2 hours in each 3mutually perpendicular
directions (total of 6 hours).
5.4.4 Dropping
①
②
5.4.5
Temperature
Impedance change should be within ±20% of
initial value measuring at 20℃.
Temperature range: -55℃ ~ +125℃.
Reference temperature: +20℃.
5.4.6
Solderability
①
②
①
②
③
④
No visible mechanical damage.
Impedance change: within ±20%.
No visible mechanical damage.
Wetting shall exceed 75% coverage for
0603 series; exceed 95% for others
Drop chip bead 10 times on a concrete floor from a height of 100 cm.
Solder temperature: 240±2℃.
Duration: 3 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
Sunlord
5.4.7
Resistance to
Soldering Heat
5.4.8
Thermal Shock
Specifications for Multi-layer Chip Ferrite Bead
①
②
③
No visible mechanical damage.
Wetting shall exceed 75% coverage for 0603
series; exceed 95% for others
Impedance change: within ±20%.
①
②
③
④
⑤
Solder temperature: 260±3℃
Duration: 5 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
①
②
No mechanical damage.
Impedance change: Within ±20%
①
Temperature, Time: (See Fig. 5.4.8-1)
-55℃ for 30±3 min→125℃ for 30±3min
Transforming interval: Max. 20 sec.
Tested cycle: 100 cycles.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
125℃
30 min.
30 min.
Ambient
Temperature
-55℃
②
③
④
30 min.
Fig.5.4.8-1
6.
Page 8 of 10
20sec. (max.)
5.4.9
Resistance to
Low
Temperature
①
②
No mechanical damage.
Impedance change: within ±20%
①
②
③
Temperature: -55±2℃
Duration: 1000+24 hours.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.10
Resistance to
High
Temperature
①
②
No mechanical damage.
Impedance change: within ±20%
①
②
③
Temperature: 125±2℃.
Duration: 1000+24 hours.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.11
Damp Heat
(Steady States)
①
②
No visible mechanical damage.
Impedance change: within ±20%
①
②
③
④
Temperature: 60±2℃.
Humidity: 90% to 95% RH.
Duration: 1000+24 hours.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.12
Loading Under
Damp Heat
①
②
No visible mechanical damage.
Impedance change: within ±20%
①
②
③
④
⑤
Temperature: 60±2℃.
Humidity: 90% to 95% RH.
Duration: 1000+24 hours.
Applied current: Rated current.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.13
Loading at High
Temperature
(Life Test)
①
②
No visible mechanical damage.
Impedance change: within ±20%
①
②
③
④
Temperature: 85±2℃
Duration: 1000+24 hours.
Applied current: Rated current.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
Packaging, Storage
6.1 Packaging
Tape Carrier Packaging:
Packaging code: T
a. Tape carrier packaging are specified in attached figure Fig. 6.1-1~3
b. Tape carrier packaging quantity please see the following table:
Type
1005[0402]
T(mm)
0.5±0.15
Tape
Paper Tape
Quantity
10K
Sunlord
(1)
Specifications for Multi-layer Chip Ferrite Bead
Page 9 of 10
Taping Drawings (Unit: mm)
Paper Tape
Top Tape
Paper Tape
Sprocket Hole
Bottom Tape
Chip Cavity
Fig 6.1-1
Remark: The sprocket holes are to the right as the tape is pulled toward the user.
(2) Taping Dimensions (Unit: mm)
Sprocket Hole Φ1.5 (+0.1,0)
Chip Cavity
1.75±0.1
Paper Tape and Reel
Type
B
P
8.0±0.3
3.5±0.05
A
1005[0402]
A
B
P
T max
H
0.65±0.2
1.15±0.2
2.0±0.1
0.80
10
T
4.0±0.1
Fig 6.1-2
Direction of Feed
(3) Reel Dimensions (Unit: mm)
4.3±0.2mm
C
4.0±0.1mm
8.4+1.5/-0.0mm
2.45±0.2mm
5.0±0.1mm
58±2.0mm
13.5±0.2mm
3.0±0.1mm
max<14.4mm
178±2.0mm
Fig. 6.1-3
6.2 Storage
a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity.
Package must be stored at 40℃ or less and 70% RH or less.
b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful
gas (e.g. HCl, sulfurous gas of H2S).
c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight.
d. Solderability of the product s with external dimensions as 0603[0201] specified in Clause 5.4.6 shall be guaranteed for 6months
from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed
more than 6 months shall be checked solder-ability before use.
e. Solderability of the products, except ones with external dimensions as 0603[0201], specified in Clause 5.4.6 shall be guaranteed
for 12 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts,
which passed more than 12 months shall be checked solder-ability before use.
Sunlord
7.
Specifications for Multi-layer Chip Ferrite Bead
Recommended Soldering Technologies
7.1 Reflowing Profile:
△ Preheat condition: 150 ~200℃/60~120sec.
△ Allowed time above 217℃: 60~90sec.
△ Max temp: 260℃
△ Max time at max temp: 10sec.
△ Solder paste: Sn/3.0Ag/0.5Cu
△ Allowed Reflow time: 2x max
Page 10 of 10
Peak 260℃ max
260℃
Max Ramp Up Rate=3℃/sec.
217℃
Max Ramp Down Rate=6℃/sec.
60~90sec.
200℃
150℃
[Note: The reflow profile in the above table is only for
qualification and is not meant to specify board assembly
profiles. Actual board assembly profiles must be based on
the customer's specific board design, solder paste and
process, and should not exceed the parameters as the
Reflow profile shows.]
7.2 Iron Soldering Profile.
△ Iron soldering power: Max.30W
△ Pre-heating: 150 ℃ / 60sec.
△ Soldering Tip temperature: 350℃Max.
△ Soldering time: 3sec Max.
△ Solder paste: Sn/3.0Ag/0.5Cu
△ Max.1 times for iron soldering
[Note: Take care not to apply the tip of
the soldering iron to the terminal electrodes.]
8.
60~120sec.
25℃
Time 25℃ to Peak =8 min max
3sec. Max.
350℃
Soldering Iron
Power: max. 30W
Diameter of Soldering
Iron 1.0mm max.
Tc ℃
Supplier Information
a) Supplier:
Shenzhen Sunlord Electronics Co., Ltd.
b) Manufacturer:
Shenzhen Sunlord Electronics Co., Ltd.
c) Manufacturing Address:
Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
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