RFBPF2012080A7T

Approval sheet RFBPF Series – 2012(0805)- RoHS Compliance MULTILAYER CERAMIC BAND PASS FILTER 2.4 GHz ISM Band Working Frequency P/N: RFBPF2012080A7T *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_RFBPF2012080A7T_V04 Mar. 2010 Approval sheet FEATURES 1. Miniature footprint: 2.0 X 1.2 X 0.8 mm 2. Low Profile Thickness 3. Low Insertion loss 4. High Rejection Rate 5. High attenuation on 2 6. LTCC process nd 3 harmonic suppressed APPLICATIONS 1. 2.4GHz ISM band RF applications 2. Bluetooth, Wireless LAN 802.11b/g, HomeRF CONSTRUCTION P4 P1 03 PIN Connection PIN Connection 1 GND 4 INPUT/OUTPUT 2 INPUT/OUTPUT 3 GND P3 P2 DIMENSIONS Figure L B D W 03 Page 2 of 7 Dimension (mm) L 2.00 ± 0.15 W 1.25 ± 0.15 T 0.80 ± 0.10 A 1.00 ± 0.15 B 0.30 ± 0.15 C 0.50 ± 0.15 D 0.25 ± 0.15 E 0.25 ± 0.15 T E C Symbol A ASC_RFBPF2012080A7T_V04 Mar. 2010 Approval sheet ELECTRICAL CHARACTERISTICS RFBPF2012080A7T Specification Frequency range 2450 ± 50 MHz Insertion Loss 2.8 dB max (typ. 2.5 dB ) VSWR 2.0 max Impedance 50 Ω 40 dB @ DC~1600 MHz 35 dB @ 1710 MHz 25 dB @ 1900 MHz 12 dB @ 2100 MHz Attenuation (min.) 8 dB @ 2170 MHz 30 dB @ 3100 MHz 40 dB @ 4800~5000 MHz 20 dB @ 7200~7500 MHz Operation Temperature Range -45°C ~ +85°C Typical Electrical Chart SOLDER LAND PATTERN Figure Line width to be design to match 50Ω Ω characteristic impedance, depending on PCB material and thickness. Φ are the grounding through holes. Page 3 of 7 Symbol Dimension (mm) L1 1.270 ± 0.10 L2 0.508 ± 0.05 L3 0.610 ± 0.05 L4 0.381 ± 0.05 L5 0.508 ± 0.05 W1 0.762 ± 0.10 W2 1.016 ± 0.10 W3 0.406 ± 0.05 W4 0.762 ± 0.05 S1 0.489 ± 0.05 S2 0.254 ± 0.05 S3 0.381 ± 0.05 Φ 0.406 ± 0.10 ASC_RFBPF2012080A7T_V04 Mar. 2010 Approval sheet RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 *Solder bath temperature：235 ± 5°C At least 95% of a surface of each terminal JESD22-B102D *Immersion time：2 ± 0.5 sec electrode must be covered by fresh solder. *Solder：Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature：260 ± 5°C Loss of metallization on the edges of each of metallization) *Leaching immersion time：30 ± 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature：120~150℃, JIS C 0050-5.4 1 minute. No mechanical damage. Samples shall satisfy electrical specification *Solder temperature：270±5°C after test. *Immersion time：10±1 sec Loss of metallization on the edges of each electrode shall not exceed 25%. *Solder：Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24±2 hrs Drop Test JIS C 0044 *Height：75 cm No mechanical damage. *Test Surface：Rigid surface of concrete Samples shall satisfy electrical specification after test. or steel. *Times：6 surfaces for each units；2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Pressurizing force： 5N(≦0603)；10N(>0603) No remarkable damage or removal of the termination. *Test time：10±1 sec The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 4 of 7 ASC_RFBPF2012080A7T_V04 Mar. 2010 Approval sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, specification after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs Vibration JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude：1.5mm Samples shall satisfy electrical specification *Test times：6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature：85°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity：90% to 95% R.H. No mechanical damage. *Temperature：40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time：1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature：-40°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Page 5 of 7 ASC_RFBPF2012080A7T_V04 Mar. 2010 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF BPF 201208 0 Walsin Product Code Dimension code RF device BPF : Band Pass Filter Per 2 digits of Length, Width, Thickness : A Unit of dimension 0 : 0.1 mm 7 T Application Specification Packing A : 2.4GHZ ISM Band Design Code T : Reeled 1 : 1.0 mm e.g. : 201208 = Length 20, Width 12, Thickness 08 Minimum Ordering Quantity: 2000 pcs per reel. PACKAGING P2 P1 ΦD P0 E F W 03 03 03 03 03 B0 T A0 Plastic Tape specifications (unit :mm) Index Dimension (mm) Index Dimension (mm) Page 6 of 7 ΦD Ao 1.45 ± 0.10 Bo 2.25 ± 0.10 1.55 ± 0.10 T 1.10 ± 0.10 W 8.00 ± 0.30 E 1.75± 0.10 F 3.50 ± 0.05 Po 4.00 ± 0.10 P1 4.00 ± 0.10 P2 2.00± 0.10 ASC_RFBPF2012080A7T_V04 Mar. 2010 Approval sheet Reel dimensions C Index A Φ178.0 Dimension (mm) B Φ60.0 A B C Φ13.0 Taping Quantity:2000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) (2) (3) (4) (5) (6) (7) (8) Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Disaster prevention / crime prevention equipment Traffic signal equipment Transportation equipment (vehicles, trains, ships, etc.) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition.



Products should be storage in the warehouse on the following conditions.


Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Page 7 of 7 Temperature : -10 to +40℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. ASC_RFBPF2012080A7T_V04 Mar. 2010