IC14-G-PEJL(10)

Single Slot SMT Connectors for Card-Bus Based PC Cards IC14 Series PC Card Standard Compliant Board Space-Saving SMT Unit Guide Unit Secure board retention Two anchoring pins ■Features Four metal fittings 1. Space-Saving design facilitates pattern routing Responding to the need for the equipment miniaturization, the board mounting area has been further reduced by relocation of the mounting screws away from the possible routing of the conductive traces. 2. Card insertion shock protection SMT Unit Total of 6 board retention points assures that there is no transfer of card insertion forces to the solder terminations. 3. New “Pop-Up” button card ejection mechanism The button does not protrude without the card being inserted, preventing it’s damage when carrying the notebook computer. Three-stage “Pop-Up” card ejection mechanism Existing products When the eject button is mistakenly pressed without a PC card inserted 4. Customized ejection buttons Equipment outline The configuration, color or length can be designed for customer’s specific applications. 5. Reliable and balanced card ejection mechanism Hirose’s unique ejection mechanism will apply force equally at each edge of the inserted card. In addition, large distance of the ejection allows easy hold on the card. IC14 Protruding button is vulnerable to damage. Board mounting Standoff Eject button Left ■Applications Notebook PCs, audio/video equipment and other devices utilizing PC cards. Standard 1.5mm 2.2mm Right Left Right Left Right Reverse 2.2mm Left Right A2 Pop-up Folding Rigid Pop-up Pop-up Pop-up Pop-up Folding Rigid Pop-up Pop-up Folding Rigid Pop-up ■Product Specifications Current rating Ratings Voltage rating Item Operating temperature 0.5A range 125V AC -55ç to +85ç (Note 1) Storage temperature range Operating humidity Relative humidity 95% max. Storage humidity range (No condensation) range Specifications -40ç to +70ç (Note 2) 40% to 70% (Note 2) Conditions 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 1000 Mø min. No flashover or insulation breakdown. 60 mø max. (Initial value) No electrical discontinuity of 100 ns or more. 5. Humidity Insulation resistance: 100 Mø min. 6. Temperature cycle Insulation resistance: 100 Mø min. 7. Durability (mating/unmating) 8. Resistance to soldering heat Contact resistance: 20mø max. from initial value 500 V DC 500 V AC / one minute 1mA DC Frequency: 10 to 2000 Hz, single amplitude of 1.52 mm or acceleration of 147m/s2 (peak), 4 hours / 3 axis 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% Temperature: -55ç / +5ç to +35ç / +85ç / +5ç to +35ç Duration: 30 / +5 max. / 30 / +5 max. (Minutes) 5 cycles 10000 cycles at 400 to 600 cycles per hour No deformation of any component. No affect on contacts. Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials/Finish SMT unit Component Material Insulator Heat resistant thermoplastic compound Contacts Brass Ground/eject metal fittings Positioning pin Stainless Brass Finish Color: Black Contact area: Gold plated Termination area: Tin-lead plated (Note) ---------Tin-lead plated (Note) Remarks UL94V-0 ---------------------------- Guide unit Component Material Finish Remarks Insulator Cover/Eject metal fittings Spring PBT Stainless Steel Color: Black ------------------- UL94V-0 ------------------- Note: Lead-free specified connectors are tin plated. A3 ■Ordering information ●SMT unit IC14 A - PLR - SF - EJR -(71) 1 1 Series name 2 Standoff type 2 3 5 6 4 SF : SMT unit 5 Eject button position : IC14 EJR : Right-side eject EJL : Left-side eject Number of ground contacts 6 Product specification code Blank : Tin-lead plated (71): Lead-free plated Blank : 0 mm A : 2.2 mm B : 1.5 mm 3 Board mounting type PL: Standard type PLR: Reverse type ●Guide unit 4 IC14 A - G - P EJR 7 7 Series name 8 Standoff type : IC14 Blank A B 9 G: Guide unite : 0 mm : 2.2 mm : 1.5 mm (Note 1) 8 9 10 11 10 Eject button type Blank : Rigid button P : Pop-up button F : Folding button 11 Eject button position EJR: Right-side eject EJL: Left-side eject Note 1: In the IC14B type, the screw attachment holes in the Guide unit are not threaded. Note 2: In this series the SMT unit and the Guide unit must be used in combinations shown below. Note 2: Other combinations cannot be used. * Series name * Standoffs * Ejection button position A4 ( 1⇔7 ) ( 2⇔8 ) ( 5 ⇔ 11 ) ■Standard Right Pop-up button SMT unit(1) No.1 32MAX No.34 No.35 No.2 No.36 Eject metal components movable range No.68 GND C 6 GND 57.4 7.5MAX 5.5MAX 3 ●IC14, IC14A SAR GND 3.3 74.5 85.8(Card fully inserted) 30.55 27.45 84.55(Ejector button pushed-in for withdrawal) 62.55 GND 3 58.9 #2-M2(2X) 3 61.8 PRA 32.6 Button position for card ejection 63.5 Guide unit(2) No.34 No.2 3.5 A (7.4) B 4.8 No.1 No.35 No.36 No.68 ●IC14B 5 5 62.6 SBR PRBM3 2.5 2.5 22.8 43.8 Stand off height SMT unit 1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14-PL-SF-EJR CL640-1301-0 IC14-G-PEJR CL640-1409-7 2.7 5.5 0.3 13.1 2.2mm IC14A-PL-SF-EJR CL640-1303-6 IC14A-G-PEJR CL640-1411-9 4.9 7.7 2.5 13.5 1.5mm IC14B-PL-SF-EJR CL640-1309-2 IC14B-G-PEJR CL640-1413-4 4.2 7 1.8 13.3 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. A5 ■Standard Left Pop-up button ●IC14, IC14A 3 57.4 No.1 Eject metal components movable range C No.34 SMT unit(1) No.68 GND 6 7.5MAX 5.5MAX GND 32MAX No.35 No.2 No.36 SAL GND 62.55 27.45 74.5 30.55 3.3 85.8 (Card fully inserted) 84.55(Ejector button pushed-in for withdrawal) GND 3 58.9 #2-M2(2X) 3 61.8 PLA 32.6 (7.4) Button position for card ejection Guide unit(2) 63.5 No.1 No.34 No.2 A B 4.8 3.5 No.35 No.36 No.68 ●IC14B 5 62.6 SBL PLBM9 2.5 2.5 22.8 43.8 Stand off height A6 SMT unit 1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14-PL-SF-EJL CL640-1302-3 IC14-G-PEJL CL640-1410-6 2.7 5.5 0.3 13.1 2.2mm IC14A-PL-SF-EJL CL640-1304-9 IC14A-G-PEJL CL640-1412-1 4.9 7.7 2.5 13.5 1.5mm IC14B-PL-SF-EJL CL640-1310-1 IC14B-G-PEJL CL640-1414-7 4.2 7 1.8 13.3 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. ■Reverse Right Pop-up button 3 57.4 32MAX SMT unit(1) No.68 No.34 No.35 No.2 GND No.1 Eject metal components movable range GND C 7.5MAX 6 5.5MAX No.36 GND RA 3.3 3 58.9 3 61.8 85.8 (Card fully inserted) 30.55 74.5 27.45 84.55(Ejector button pushed-in for withdrawal) 62.55 GND PRA 32.6 Button position for card ejection 63.5 No.35 No.36 3.5 A B 4.8 No.68 ( 7.4) Guide unit(2) No.34 Stand off height 2.2mm No.1 No.2 SMT unit 1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14A-PLR-SF-EJR CL640-1307-7 IC14A-G-PEJR CL640-1411-9 4.9 7.7 2.3 14.3 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. A7 ■Reverse Left Pop-up button type 3 Eject metal components movable range 57.4 32 MAX No.68 No.35 No.2 No.36 No.34 GND SMT unit(1) No.1 GND 7.5MAX 6 5.5MAX C GND LA 62.55 27.45 74.5 30.55 3.3 85.8 (Card fully inserted) 84.55(Ejector button pushed-in for withdrawal) GND 3 58.9 3 61.8 PLA 32.6 (7.4) Button position for card ejection Guide unit(2) 63.5 No.35 No.36 No.68 A B 4.8 3.5 No.34 Stand off height 2.2mm A8 No.1 No.2 SMT unit 1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14A-PLR-SF-EJL CL640-1308-0 IC14A-G-PEJL CL640-1412-1 4.9 7.7 2.3 14.3 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. ■Standard Left folding button 3 57.4 SMT unit(1) 32MAX No.35 No.1 Eject metal components movable range No.34 No.2 No.36 GND GND 6 7.5MAX 5.5MAX C No.68 SAL GND 62.55 GND 3 61.8 3 58.9 (93.6) 3.3 Card fully inserted:85.6 74.5 27.45 8 5 Ejector pushed-in for withdrawal:(9.5) LA 34.55 42.05 Button position for card ejection (65.45) Guide unit(2) No.34 No.2 A B 4.8 No.1 No.35 Stand off height 2.2mm No.36 No.68 SMT unit 1 Guide unit 2 Part Number CL No. IC14-PL-SF-EJL CL640-1302-3 IC14A-PL-SF-EJL CL640-1304-9 CL No. A (mm) B (mm) C (mm) Weight (g) IC14-G-FEJL CL640-1406-9 2.7 5.5 0.3 13.9 IC14A-G-FEJL CL640-1408-4 4.9 7.7 2.5 14.1 Part Number 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. A9 ■Reverse Left folding button 3 57.4 32 MAX Eject metal components movable range No.68 No.35 No.2 No.36 No.34 GND GND 7.5MAX 6 5.5MAX C SMT unit(1) No.1 GND LA 62.55 GND 74.5 3 61.8 3 58.9 3.3 (93.6) Card fully inserted:85.6 27.45 Ejector pushed-in for withdrawal:(9.5) 8 5 LA 34.55 Button position for card ejection 42.05 Guide unit(2) (65.45 ) No.68 No.36 A B 4.8 No.35 No.34 Stand off height 2.2mm A10 No.1 No.2 SMT unit 1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14A-PLR-SF-EJL CL640-1308-0 IC14A-G-FEJL CL640-1408-4 4.9 7.7 2.3 14.9 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. ■Standard Left rigid button 3 57.4 32MAX Eject metal components movable range No.35 No.1 No.2 No.36 GND 6 5.5MAX C SMT unit(1) No.68 GND No.34 7.5MAX SAL GND 3 61.8 3 58.9 3.3 74.5 85.6(Card fully inserted) 27.45 62.55 GND 8 LA 32.6 63.5 Guide unit(2) 3.5 No.34 No.2 A B 4.8 No.1 No.35 Stand off height 2.2mm No.36 No.68 SMT unit 1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14-PL-SF-EJL CL640-1302-3 IC14-G-EJR CL640-1402-8 2.7 5.5 0.3 13.4 IC14A-PL-SF-EJL CL640-1304-9 IC14A-G-EJR CL640-1404-3 4.9 7.7 2.5 13.7 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. A11 ■Reverse Left rigid button 3 57.4 32MAX Eject metal components movable range No.68 GND No.35 No.2 No.36 No.34 GND 7.5MAX 6 5.5MAX C SMT unit(1) No.1 GND LA 62.55 GND 74.5 3 61.8 3 58.9 3.3 FL 85.6(Card fully inserted) 27.45 8 LA 32.6 63.5 No.68 Guide unit(2) No.36 No.35 B C A 4.8 3.5 No.34 Stand off height 2.2mm A12 No.2 SMT unit 1 No.1 Guide unit 2 Part Number CL No. Part Number CL No. A (mm) B (mm) C (mm) Weight (g) IC14A-PLR-SF-EJL CL640-1308-0 IC14A-G-EJL CL640-1404-3 4.9 7.7 2.3 14.4 1 : All illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with “PC card standard”. 3 : Indicated dimensions are symmetrical to the center of the card insertion slot. BPCB mounting pattern ●Standard ●Without Standoff ●Without Standoff 14.4MAX 54.425±0.05 50.4±0.05 54.425±0.05 Mounting area (2.2) (2.2) 50.4±0.05 2.5±0.1 4.025±0.05 3.5MIN 1.8MAX 4.3MIN 5.65MIN 1.95 MIN 32.5MIN No conductive traces 2.95MIN 2 58.9±0.05 (Right button) 50.4±0.05 No conductive traces No conductive traces 2 2 64.8±0.05 Card edge position 48±0.05 53.2MAX 59.2MIN 2.5±0.1 54.425±0.05 4.025±0.05 GND No conductive traces GND Card edge position 2 2 14.6MIN Mounting area 11.5MAX (2.2) GND 12.225±0.05 3.55±0.1 11.5MAX 2.5±0.1 54.425±0.05 14.6MIN Mounting area No conductive traces 46.2±0.05 53.2MAX 59.2MIN 2.4±0.05 4.2±0.05 C 2.6MAX 21±0.05 2 43.8±0.05 56.9MIN 3.5MIN 2.6 MAX 3.5MIN 4.4MAX 3.5 MIN 3.8 MIN 3.8 MIN 7.75 MIN No conductive traces 4.4MAX 2-Ø2.2 3.5 MIN Shield plate mounting area +0.1 +0 7MIN 7.75 MIN 3.5 MIN 2.6MAX +0.1 2-Ø2.2 +0 7MIN 3.5MIN 3.5MIN 4.4MAX Shield plate mounting area 3.5 MIN 4.3MIN 5.65MIN No conductive traces ●Standoff 1.5mm 50.4±0.05 (2.2) 53.9MIN 52.2MAX Shield plate mounting area (Left button) 12.225±0.05 3.55±0.1 2-Ø2.2 C ●Standoff 1.5mm 64.8±0.05 +0.1 +0 54.65±0.05 No conductive traces 2.95MIN 2 58.9±0.05 GND 55.2MIN 52.2MAX 2-Ø2.2 C 1.95MIN 3.55±0.1 2-Ø2.2 +0.1 Card edge position 4.25±0.05 Shield plate mounting area 2-Ø2.2 +0 GND 59.1MAX 54.65±0.05 12.225±0.05 4.8MIN 64.75±0.05 Card edge position 1.8MAX No conductive traces 2.5±0.1 GND 59.1MAX GND 4.25±0.05 Mounting area 4.025±0.05 32.5MIN 3.55±0.1 12.225±0.05 64.75±0.05 GND 4.025±0.05 14.4MAX (Right button) (Left button) 2.6MAX C 22.8±0.05 2 No conductive traces 4.4MAX 43.8±0.05 56.9MIN ●Standoff 2.2mm (Common to both Right & left buttons) 11.5MAX 2.5±0.1 54.425±0.05 14.6MIN Mounting area GND 3.55±0.1 (2.2) 4.025±0.05 No conductive traces GND Card edge position 4.3MIN 2.95MIN 1.5MAX 1.5MAX 1.95MIN 4.05MIN 7.25MIN 2-Ø2.2 +0.1 0 54.65±0.05 2 53.2MAX 2 59.2MIN 3.75MIN 4.25±0.05 5.65MIN 64.75±0.05 12.225±0.05 50.4±0.05 Shield plate mounting area C No conductive traces 2 58.9±0.05 Note 1) area show the conductive pattern prohibited area. Note.2) Indicated dimensions are symmerical to the center of the card insertion slot. 2 A13 ●Reverse ●Standoff 2.2mm 64.75±0.05 3.55±0.1 Mounting area 2.5±0.1 54.425±0.05 4.025±0.05 GND 11.5MAX (2.2) 12.225±0.05 50.4±0.05 14.6MIN (Common to both Right & left buttons) No conductive traces GND Card edge position 4.25±0.05 2 2 1.5MAX 1.5MAX 1.95MIN 4.05MIN 7.25MIN 5.65MIN 3.75MIN +0.1 0 4.3MIN 2-Ø2.2 54.65±0.05 53.2MAX 59.2MIN Shield plate mounting area C No conductive traces 2 58.9±0.05 Note 1) area show the conductive pattern prohibited area. Note.2) Indicated dimensions are symmerical to the center of the card insertion slot. 2 BPCB mounting area (Enlarged views) ●Standard ●Without Standoff 48.2±0.05 GND Ø2 No.1 No.2 .3 No.68 GND Ø2.3 No.34 No.35 Ø1.8±0.05(Plated through hole) P=0.635±0.03 68-0.37±0.03 3±0.1 1.9±0.1 3±0.1 4.4±0.1 2.2±0.05 5 Ø1.85±0.05(Plated through hole) C 48.2±0.05 ●Standoff 1.5mm, 2.2mm 3±0.1 Ø2 2.7MIN .3 4.2MIN 4.4±0.1 No.2 GND No.34 No.68 GND 3±0.1 No.1 1.9±0.1 P=0.635±0.03 68-0.37±0.03 Ø2.3 No.35 5 No conductive traces 1.05MIN 1.05MIN Ø1.8±0.05(Plated through hole) C Ø1.85±0.05(Plated through hole) 2 58.4MIN ●Reverse ●Standoff 2.2mm GND Ø2 No.68 No.34 4.2MIN 2.7MIN .3 P=0.635±0.03 68-0.37±0.03 No.2 No.1 GND No.35 Ø1.8±0.05(Plated through hole) 1.05MIN 1.05MIN No conductive traces C 2 58.4MIN Ø1.85±0.05(Plated through hole) 3±0.1 1.9±0.1 3±0.1 4.4±0.1 2.2±0.05 Ø2.3 5 4.4±0.1 3.9275±0.05 2±0.1(Terminal mounting area) 4.2±0.1(Terminal mounting area) 48.2±0.05 46.4725±0.05 4.4±0.1 2.2±0.05 2±0.1(Terminal mounting area) 4.2±0.1(Terminal mounting area) 46.4725±0.05 3.9275±0.05 A14 4.4±0.1 3.9275±0.05 2±0.1(Terminal mounting area) 4.2±0.1(Terminal mounting area) 46.4725±0.05 BAssembly of units and board placement procedures (1) Mount the SMT unit on the PCB board. SMT unit Guide unit SBR PRBM3 A Push rod Stroke arm PCB PAR PBR Fig. 1 Note 1: Verify and make sure that the position of the stroke arm of the SMT unit and the push rod of the Guide unit are at the positions indicated in Fig. 1. (as delivered). If needed, position them as shown. Correct position of the push rod and the stroke arm is required for correct assembly of both units. Note 2: Make sure that the SMT unit is positioned securely. Note 3: Soldering will not be possible with the Guide unit attached first. The Guide unit must be attached and secured to the PCB board AFTER the SMT unit is attached to the PCB. SBR SBR Interference Interference Fig. 2 A15 (2) Align both arrow marks (stamped on the shield plate) on the Guide unit with the corresponding grooves on the (mounted on the board) SMT unit (as illustrated of Fig. 3 and 3-1). SBR PRBM3 A Fig. 3-1 PAR PBR Fig. 3-2 Fig. 3 Shield plate Arrow mark Insulator part SBR A Position B Position A Groove Fig. 3-1 Gide unit SMT unit Fig. 3-2 A16 PCB Note 3: Place the Guide unit over the installed SMT unit, (exercising caution NOT to touch the spring, push rod or the stroke arm).Ref. Fig.4 PRBM3 Guide unit holding areas PAR PBR Fig. 4 A17 (3) Slide the Guide unit forward until it is locked with the SMT unit. Fully locked units should be as shown on Fig. 5. Slide forward Shiel plate SMT unit SBR PRBM3 Spring portion Guide unit holding areas Slide forward PAR PBR Fully locked SBR Visible insulator Locking area No space Fig. 5 A18 Note 5: It is assumed that the Guide unit and the SMT unit will be mounted on the same PCB. However, in some applications the Guide unit may be mounted directly on the device’s case/housing. It is critical that the miss-alignment of the Guide unit must be kept within ± 0.15 mm. The side clearance between the case/housing and the shield plate should be 0.15mm minimum. Ref. Fig. 6 Note 5. Clearance between body and shield: 0.15 mm minimum. ±0.15 PRBM3 SBR ±0.15 PAR PBR Device case/housing Fig. 6 Note 6: DO NOT insert/eject the PC card before the SMT unit and the Guide unit are fully mounted and locked, with the push rod and stroke arm connected. A19 (4) The Guide unit should be securely attached with two screws. (4-1) IC14 and IC14A Types ••• Fig. 7 (From the bottom of the PCB) PAR Fig. 7 (4-2) IC14B Type ••• Fig. 8 (From the top of the PCB) PAR PBR Fig. 8 Note 7: The IC14 and IC14A assemblies do not require separate hex nuts. Note 8: Hex nuts and screws are required for the IC14B assemblies. Max. length of the screw thread is 1.4mm. Screw size M2∞0.4 A20 Connector type Recommended tightening torque (N•m) IC14 type 0.12~0.16 IC14A and IC14B type 0.14~0.18 BRecommended procedure for removal of the Guide unit (1) Remove the 2 screws attaching the Guide unit to the PCB. (2) Make sure that the stroke arm of the SMT unit and the pushrod of the Guide unit are at the positions indicated in Fig. 1. Guide unit SMT unit Remove screws SBR PRBM3 Push rode Stroke arm PAR PBR PCB Fig. 1 (3) As illustrated in Fig. 2, the lock between the shield plate and the ribs of the insulated case can be released. Press the insulator on both side of the installed assembly and carefully slide the Guide unit. Press Shield plate Range of retaining position Detail A Pull guide unit in this direction Left side Right side SBR PRBM3 Pull guide unit in this direction Press Release pressure points (each side) PAR PBR Release pressure points (each side) Fig. 2 A21 Note 1: As illustrated in the enlarged view of Fig. 3, the lock is released by deflecting the insulator approximately 0.5 mm. Detail A lock release condition Shield plate Insulator (deflect) Fig. 3 detail A - enlarged view Note 2: Assure that the push rod remains in its original position. Moving it from this position may cause it to fall-out. SBR PRBM3 Original push rod position Fig. 4 A22 Do not move in this position BRecommended opening dimensions for the device housing (Card Insertion Slot and Ejection button guide) (55) 1 (6) 1 (28.5) (33.2) 1 : PC Card center Line dimensions BHandling Precautions (1) Metal components of these connector assemblies have sharp edges. Use caution when handling, installing or dis-assembling. (2) The design of the device’s case/housing should incorporate sufficient guide and support for the ejection button. (3) Slight tool marks or cleaning liquid residue the surfaces of the Guide unit will not affect form, fit or function of the assemblies. A23 BRecommended temperature profile ●Using Typical Solder Paste Temperature (ç) 5S max Recommended conditions Reflow system : IR reflow Solder composition : Paste, 63%Sn/37%Pb (Flux content 9wt%) Test board : Glass epoxy 80mm∞125mm∞1.6mm thick Metal mask 60~90S Preheating 30S : 0.15mm thick 20~30S Soldering Start Time (Seconds) ●Using Lead-free Solder Paste 250ç(PEAK) 250 Recommended conditions 220ç Temperature (ç) 200 Reflow system : IR reflow Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Flux content 10.5wt%) 170ç 150 Test board : Glass epoxy Metal mask : 0.15mm thick 150ç 80mm∞125mm∞1.6mm thick 60s(MAX) 100 The temperature profiles are based on the above conditions. 60~120s 50 In individual applications the actual temperature may vary, 25ç Preheating 0 Start depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Time (Seconds) A24 Soldering