TMPC0518HP-R47MG-D

TAI-TECH P1 SMD Power Inductor TMPC0518HP-Series(G)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 16/04/26 新 發 行 楊祥忠 詹偉特 何秦芝 備 註 TAI-TECH P2 SMD Power Inductor TMPC0518HP-Series(G)-D 1. Features 1. Carbonyl powder inductor. 2. Compact design. 3. High current，low DCR，high efficiency. Halogen Pb Halogen-free Pb-free 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter. 3. Dimensions Recommend PC Board Pattern Dr. MOS application C E 　2R2 1R0 1151 1150 B L D H A G Series A(mm) B(mm) C(mm) D(mm) E(mm) TMPC0518HP 5.7±0.3 5.2±0.2 1.6±0.2 1.1±0.3 2.5±0.3 L(mm) G(mm) 4. Part Numbering TMPC 0518 HP A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: D/C - 2R2 D MG E H(mm) 6.2 2.2 2.8 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. D F BxC H: Carbonyl powder, P: PAD broaden 2R2=2.2uH M=±20% 印字:黑色, 2R2 及 D/C 1150 (D/C 前二碼是年份,後二碼是週期,依實際生產週期而定) TAI-TECH P3 5. Specification Inductance L0 (uH) @ 0 A I rms (A) typ. TMPC0518HP-R22MG-D 0.22±20% 13 22 4.2 5.0 TMPC0518HP-R33MG-D 0.33±20% 11 15 7.5 8.6 TMPC0518HP-R47MG-D 0.47±20% 10 14 9.8 11.3 TMPC0518HP-R68MG-D 0.68±20% 9 13 12.4 14.3 TMPC0518HP-1R0MG-D 1.0±20% 6.8 10 18.2 21 TMPC0518HP-1R5MG-D 1.5±20% 6.0 9.0 26 30 TMPC0518HP-2R2MG-D 2.2±20% 4.5 7.5 42 48.3 TMPC0518HP-3R3MG-D 3.3±20% 3.5 5.0 60 69 TMPC0518HP-4R7MG-D 4.7±20% 3.0 4.5 85 98 TMPC0518HP-5R6MG-D 5.6±20% 2.5 4.0 110 127 TMPC0518HP-6R8MG-D 6.8±20% 2.4 3.5 118 137 TMPC0518HP-8R2MG-D 8.2±20% 2.3 3.0 143 165 TMPC0518HP-100MG-D 10±20% 2.3 2.8 165 190 Part Number I sat (A) typ. DCR DCR (mΩ) typ. @25℃ (mΩ) max. @25℃ Note: 1. Test frequency : L : 100KHz /1.0V 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt40℃ . 5. Saturation Current (Isat) will cause L0 to drop approximately 20%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P4 6. Material List NO Items Materials 1 Core Carbonyl Powder. 2 Wire Polyester Wire or equivalent. 3 Clip 100% Pb free solder(Ni+Sn---Plating) 4 paint Epoxy resin 5 Ink Halogen-free ketone 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1. -10~+40℃,50~60%RH (Product without taping) 2. -40~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L20% Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Reliability Test Life Test Load Humidity Moisture Resistance Thermal shock Vibration Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs 2 Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs 2 Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 2 TAI-TECH Item P5 Performance Test Condition Type Shock Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,