CMFB 153J3950FB

南京时恒电子科技有限公司 规格承认书 APPROVAL SHEET 客户名称： CUSTOMER 产品名称： PART NAME 片式NTC热敏电阻规格书 产品规格： PART NUMBER CMFB 153J3950FB 日期： DATE 2023年4月6日 确 认 CONFIRM 客户 供货商/制造商 品保部： 规格书制作：鞠晓丽 业务员审核： 制造部： 技术部审核： 工程部： 品质部审核： 南京时恒电子科技有限公司 地址：南京市江宁区湖熟镇金阳路18号 TEL：025-52121868 Http:// www.shiheng.com.cn 邮编：211121 FAX：025-52122373 E-MAILsales@shiheng.com.cn 1 外形尺寸  尺寸：见图 1 和表 1  Dimensions: See Fig.1 and Table 1.  PCB 焊盘：见图 2 和表 1  Recommended PCB pattern for reflow soldering: See Fig.2 and Table 1 Shape and Dimensions 端电极(External electrode) 瓷体(NTC ceramic) 阻焊材料(Solder-resist) C 涂覆玻璃层(Glass coat) B A 图 1 Fig.1 B 图 2 Fig.2 基板(Land pattern) 表 1（Table 1） 2 类别 Type L W T a B 0.079±0.008 0.049±0.008 0.033±0.008 0.020±0.012 [0805] [2.0±0.2] [1.25±0.2] [0.85±0.2] [0.5±0.3] A B C [1.0-1.1] [0.6-0.7] [1.0-1.2] 产品标识（料号） Product Identification(Part Number) CMF B 153 J 3950 F B ① ② ③ ④ ⑤ ⑥ ⑦ ① 类别 Type CMF ③ 25℃的零功率电阻 片式 NTC 热敏电阻器 Chip NTC Thermistor Nominal Zero-Power Resistance ② 外形尺寸(mm) External Dimensions (L×W×T) 3 单位 unit: inch[mm] 0201 0.60×0.3 0×0.3 0 X[0402] 1.00×0.5 0×0.5 0 A[0603] 1.60×0.8 0×0. 80 B[0805] 2.00×1.2 5×0. 85 222 2.2kΩ 153 15kΩ 104 100kΩ ⑤ B 值常数 B Constant 3450 3450K 3950 3950K 4250 4250K ⑥ B 值公差 Tolerance of B Constant ④ 电阻值公差 Tolerance of Resistance F ±1% G ±2% H ±3% J ±5% F ±1% H ±3% ⑦ B 值计算方式 B constant calculation method A 25℃&85℃ B 25℃&50℃ 电气特性 Electrical Characteristics B 常数B B 常数B 型号 Resistance Constant Constant Part No (25℃) (25/50℃) (25/85℃) (kΩ) （K） （K） 允许工作电流 Permissible Operating Current ( 25℃) （mA） 15±5% 3950±1% 3987 ref. 0.36 电阻值 CMFB153J3950FB 耗散系数 Dissipation Factor (mW/℃) 2.0 热时间常数 Thermal Time Constant (s) ＜5 工作温度 额定功率 Operating Rated Electric Power(25℃) (mW) ambient temperature 100 注 Notes: 在 25℃静止空气中，以未贴装的独立单元测试。When measured at 25°C in still air, as a single unit without mounting. (℃) -40～+125 4 检验和测试程序 4 Test and Measurement Procedures Test Conditions 测试条件 如无特别规定，检验和测试的标准大气环境条件如下： Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. 环境温度：20±15℃； b. 相对湿度：65±20%； a. Ambient Temperature: 20±15℃ c. 气压：86 kPa~106 kPa b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa 如果对测试结果有异议，则在下述条件下测试： If any doubt on the results, measurements/tests should a. 环境温度：25±2 ℃； be made within the following limits: b. 相对湿度：65±5% a. Ambient Temperature: 25±2℃ c. 气压：86kPa ~ 106kPa b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa Inspection Equipment 检查设备 Visual Examination: 20×magnifier Resistance value test: Thermistor resistance tester 外观检查：20 倍放大镜； 阻值检查：热敏电阻测试仪 5 电性测试 序号 No. Electrical Test 项目 Items 25℃零功率电阻值 1 Nominal Zero-Power Resistance at 25℃(R25) 测试方法及备注 Test Methods and Remarks 环境温度 Ambient temperature：25±0. 05℃ 测试功率 Measuring electric power：≤0.1mW 分别在环境温度 25±0. 05℃， 50±0. 05℃或 85±0. 05℃下测量电阻值。 Measure the resistance at the ambient temperature of 25±0. 05℃, 50±0. 05℃ or 2 B 值常数 Nominal B Constant 85±0.05℃. B(25-50℃)= lnR25−lnR50 1⁄T25−1⁄T50 B(25-85℃)= T：绝对温度（K）Absolute temperature (K) lnR25−lnR85 1⁄T25−1⁄T85 在零功率条件下，当热敏电阻的环境温度发生急剧变化时，热敏电阻元件产生 最初温度 T0 与最终温度 T1 两者温度差的 63.2%的温度变化所需要的时间，通 常以秒(S)表示。 The total time for the temperature of the thermistor to change by 63.2% of the difference from ambient temperature T0 (℃) to T1 (℃) by the drastic change of the power applied to thermistor from Non-zero Power to Zero-Power state, normally expressed in second(S). 3 热时间常数 Thermal Time Constant 序号 No. 项目 Items 测试方法及备注 Test Methods and Remarks 在一定环境温度下，NTC 热敏电阻通过自身发热使其温度升高 1℃时所需要的 功率，通常以 mW/℃表示。可由下面公式计算： The required power which makes the NTC thermistor body temperature raise 1℃ 4 through self-heated, normally expressed in milliwatts per degree Celsius (mW/℃). It 耗散系数 Dissipation Factor can be calculated by the following formula: δ= W T−T0 5 6 在环境温度 25℃下因自身发热使表面温度升高 100℃所需要的功率。 额定功率 The necessary electric power makes thermistor’s temperature rise 100℃ by self- Rated Power heating at ambient temperature 25℃. 在静止空气中通过自身发热使其升温为 1℃的电流。 允许工作电流 The current that keep body temperature of chip NTC on the PC board in still air Permissible operating current rising 1°C by self -heating. 注 Notes: 在 25℃的静止空气中给 NTC 热敏电阻施加 100mW 的额定功率，NTC 热敏电阻会升温 100℃左右。但太 快的升温速度可能会导致 NTC 热敏电阻意外失效，因此请不要短时间内给其施加大于 10mW 的功率（10mW 的功率 会让 NTC 热敏电阻升温 10℃左右） 。建议电流小于允许工作电流值的 1/10 以防止 NTC 热敏电阻自热。功率与工作温 度的关系如下图所示： When Rated Electric Power(100mW) is applied to NTC thermistor at 25℃ in still air, temperature rise of the NTC thermistor is about 100℃. However, too rapid temperature rise may cause unexpected failures to the NTC thermistor, please do not apply more than 10mW of electric power to it in short time (10mW of power will increase the temperature of the NTC thermistor by about 10℃). The current less than 1/10 of the Permissive Operating Current value is recommended in order to prevent selfheating of the NTC thermistor. The relationship between electric power and operating temperature is showed as below: 6 信赖性试验 Reliability Test 项目 Items 测试标准 Standard Strength IEC 60068-2-21 要求 Requirements 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板），按箭头 端电极无脱落且瓷体无损伤。 所示方向施加作用力； No removal or split of the termination Solder the chip to the testing jig (glass epoxy board shown in the right) or other defects shall occur. using eutectic solder. Then apply a force in the direction of the arrow. 端头附着力 Terminal 测试方法及备注 Test Methods and Remarks 尺寸 Size F 0201 2N X, A 5N B 10N 保持时间 Duration 10±1s 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板），按下图 ① 无外观损伤。 No visible damage. 箭头所示方向施加作用力； Solder the chip to the test jig (glass epoxy board shown in the right) ② ∣∆R25/R25∣≤2% using a eutectic solder. Then apply a force in the direction shown as follow; 单位 unit：mm 抗弯强度 Resistance IEC 60068-2-21 to Flexure ① 尺寸 弯曲变形量 Size Flexure 0201, 1mm X, A, B 2mm 施压速度 Pressurizing Speed ＜0.5mm/s 类型 Type a b c 0201 0.25 0.3 0.3 X 0.4 1.5 0.5 A 1.0 3.0 1.2 B 1.2 4.0 1.65 保持时间 Duration 10±1s 将晶片焊接在测试基板上（如右图所示的环氧玻璃布板） ； 无外观损伤。 Solder the chip to the testing jig (glass epoxy board shown in the No visible damage. left) using eutectic solder. ② 晶片以全振幅为 1.5mm 进行振动，频率范围为 10Hz ～55 Hz； The chip shall be subjected to a simple harmonic motion having 振动 Vibration total amplitude of 1.5mm, the frequency being varied uniformly IEC 60068-2-80 between the approximate limits of 10 and 55 Hz. ③ 振动频率按 10Hz→55Hz→10Hz 循环，周期为 1 分钟，在空间 三个互相垂直的方向上各振动 2 小时（共 6 小时） 。 The frequency ranges from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). 坠落 Dropping IEC 60068-2-32 从 1m 的高度让晶片自由坠落至水泥地面 10 次。 无外观损伤。 Drop a chip 10 times on a concrete floor from a height of 1 meter. No visible damage. ① 焊接温度 Solder temperature: 245±5 ℃. 可焊性 Solderability ② 浸渍时间 Duration: 3±0.3s. IEC 60068-2-58 ③ 焊锡成分 Solder: 96.5wt%Sn/3.0wt%Ag/0.5wt%Cu ④ 助焊剂 Flux: （重量比）25%松香和 75%酒精 25% Rosin and 75% ethanol in weight. ① 无外观损伤； No visible damage. ② 元件端电极的焊锡覆盖率不小于 95%。 Wetting shall exceed coverage. ① 焊接温度 Solder temperature: 260±5 ℃. ② 浸渍时间 Duration: 10±1s. ③ 焊锡成分 Solder: 96.5wt%Sn/3.0wt%Ag/0.5wt%Cu . 耐焊性 Resistance to Soldering Heat IEC 60068-2-58 ④ 助焊剂 Flux: （重量比）25%松香和 75%酒精 25% Rosin and 75% ethanol in weight. ⑤ 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① 无外观损伤； No visible damage. ② ∣∆R25/R25∣≤2% ③ ∣∆B/B∣≤1% 95% ① 无负载于下表所示的环境条件下重复 5 次。 5 cycles of following sequence without loading. 温度周期 Temperature IEC 60068-2-14 cycling 步骤 Step 温度 Temperature 时间 Time 1 -40±5 ℃ 30±3min 2 25±2 ℃ 5±3min 3 125±2 ℃ 30±3min ② ∣∆R25/R25∣≤2% 4 25±2 ℃ 5±3min ③ ∣∆B/B∣≤1% ① 无外观损伤； No visible damage. ② 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① 在 125±5 ℃空气中，无负载放置 1000±24 小时。 Resistance ① 无外观损伤； 125±5 ℃ in air, for 1000±24 hours without loading. 高温存放 IEC 60068-2-2 No visible damage. ② 试验后标准条件下放置 1~2 小时后测量。 to dry heat The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① IEC 60068-2-1 No visible damage. ② 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours to cold ③ ∣∆B/B∣≤1% ① 无外观损伤； -40±3 ℃ in air, for 1000±24 hours without loading. 低温存放 Resistance 在-40±3 ℃空气中，无负载放置 1000±24 小时。 ② ∣∆R25/R25∣≤2% before measuring. ② ∣∆R25/R25∣≤2% ③ ∣∆B/B∣≤1% ① 在 60±2 ℃，相对湿度 90~95%空气中，无负载放置 1000±24 小 时。 湿热存放 Resistance to damp heat IEC 60068-2-78 ① 无外观损伤； 60±2 ℃, 90~95%RH in air, for 1000±24 hours without loading. ② 试验后标准条件下放置 1~2 小时后测量。 No visible damage. ② ∣∆R25/R25∣≤2% The chip shall be stabilized at normal condition for 1~2 hours ③ ∣∆B/B∣≤1% before measuring. 高温负荷 Resistance to high temperature load 7 ① 在 85±2 ℃空气中，施加允许工作电流 1000±48 小时。 IEC 60539-1 5.25.4 85±2 ℃in air with permissive operating current for 1000±48 hours ② 试验后标准条件下放置 1~2 小时后测量。 The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① 无外观损伤； No visible damage. ② ∣∆R25/R25∣≤2% ③ ∣∆B/B∣≤1% 编 带 Taping 类型 Type 0201 X A B 编带厚度 Tape thickness(mm) 0.5±0.15 0.5±0.15 0.8±0.15 0.85±0.2 编带材质 Tape material 每盘数量 Quantity per Reel 纸 带 Paper Tape 15K 10K 4K 4K (1) 编带图 Taping Drawings (2) 纸带尺寸 Paper Tape Dimensions (单位 Unit：mm) CMF0201 系列 CMF0201 series CMFX 系列 CMFX series CMFA 系列 CMFB 系列 CMFB series CMFA series (3) 卷盘尺寸 Reel Dimensions(单位 Unit：mm) 4.3±0.2 4.0±0.1 9.0±1.5 2.45±0.2 5.0±0.1 58±2.0 13.5±0.2 3.0±0.1 178±2.0 8   9  储存 储存条件 8 Storage  Storage Conditions a. 储存温度：-10℃～40℃ a. Storage Temperature: -10℃～40℃ b. 相对湿度：≤75%RH b. Relative Humidity: ≦75%RH c. 避免接触粉尘、腐蚀性气氛和阳光 c. Keep away from corrosive atmosphere and sunlight. 储存期限：产品交付后 6 个月 注意事项 CMF 系列热敏电阻不可在以下条件下工作或储存： (1) 腐蚀性气体或还原性气体 (氯气、硫化氢气体、氨气、硫酸气体、一氧化氮等)。 (2) 挥发性或易燃性气体 (3) 多尘条件  Period of Storage: 6 Months after delivery 9 Notes ＆ Warnings  The CMF series thermistors shall not be operated and stored under the following environmental condition: (1) Corrosive or deoxidized atmospheres (such as chlorine, sulfurated hydrogen, ammonia, sulfuric acid, nitric oxide and so on) (2) Volatile or inflammable atmospheres (4) 高压或低压条件 (3) Dusty condition (5) 潮湿场所 (4) Excessively high or low pressure condition (6) 存在盐水、油、化学液体或有机溶剂的场所 (5) Humid site (7) 强烈振动 (6) Places with brine, oil, chemical liquid or organic solvent (8) 存在类似有害条件的其他场所 (7) Intense vibration (8) Places with analogously deleterious conditions  CMF 系列热敏电阻的陶瓷属于易碎材料，使用时不  The ceramic body of the CMF series thermistors is fragile, no excessive pressure or impact shall be exerted on it.  The CMF series thermistors shall not be operated beyond the specified “Operating Temperature Range” in the catalog.  Choose a proper mounting position that minimize the stress imposed on the chip during flexing or bending of the board. The recommendations are shown in the figure below: 可施加过大压力或冲击。  CMF 系列热敏电阻不可在超过目录规定的温度范围 情况下工作。  应选择适当的贴装位置，使电路板屈曲或弯折时施加 在晶片上的应力最小。相关建议如下： 10 建议焊接条件  回流焊 10 Recommended Soldering Technologies  Re-flowing Profile  温升 1~2℃/sec.  1~2℃/sec. Ramp  预热：150~170℃/90±30 sec.  Pre-heating: 150~170℃/90±30 sec. Insufficient preheating may cause a crack on the ceramic body. The difference between preheating temperature and the highest temperature in the profile shall be 100℃. 预热不足可能会导致陶瓷体破裂。曲线上预热温度 与最高温度之间的差值应为 100℃。  大于 240℃时间：20~40sec  Time above 240℃: 20~40 sec.  峰值温度：最高 260℃/10 sec.  Peak temperature: 260℃Max./10 sec.  焊膏：96.5wt%Sn/3.0wt%Ag/0.5wt%Cu  Solder paste: 96.5wt%Sn/3.0wt%Ag/0.5wt%Cu  助焊剂：焊接时应使用松香助焊剂。  Flux: Use rosin type flux in the soldering process. If strong acidic flux(with halide content exceeding 0.1wt%) or water-soluble flux(non-rosin type flux including wash-type flux and non-wash-type flux) is used, some problems might be caused in the product characteristics and reliability.  Max.2 times for re-flowing. In case of repeated soldering, the total accumulated soldering time at peak temperature is within 30sec (Including the first time and second time).  Cooling: Gradual cooling in air. Rapid cooling by dipping in solvent or by other means is not recommended.  Excessive soldering conditions may cause dissolution of metallization or deterioration of solder-wetting on the external electrode. 若使用强酸性助焊剂（卤化物含量超过 0.1wt%） 或水溶性助焊剂（非树脂型助焊剂，包括水洗型助 焊剂和非水洗型助焊剂），则可能造成产品特性和 可靠性方面问题。  回流焊：最多 2 次。 两次焊接峰值温度累积时间必须控制在 30 秒内。  冷却：在空气逐渐冷却。不建议将元件浸泡溶剂或使 用其他方法来快速冷却。  不符合焊接条件可能会造成金属分解或外部电极上的 焊料湿润程度变差。  手工焊  Iron Soldering Profile  烙铁功率：最大 20W  Iron soldering power: Max.20W  预热：150℃/60sec.  Pre-heating: 150℃/60sec.  烙铁头温度：最高 280℃  Soldering Tip temperature: 280℃Max.  焊接时间：最多 3sec.  Soldering time: 3 sec Max.  焊膏：96.5wt%Sn/3.0wt%Ag/0.5wt%Cu  Solder paste: 96.5wt%Sn/3.0wt%Ag/0.5wt%Cu  手工焊：最多 1 次  Max.1 times for iron soldering [注：不要使烙铁头接触到端头] [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]  焊膏的印刷条件  Printing Conditions of Solder Paste  焊膏用量至关重要。下表列出了焊角的标准高度。  The amount of solder is critical . Standard height of fillet is shown in the table below.   过多焊料会造成机械应力，导致断裂、机械损坏和/或 Too much solder may cause mechanical stress , resulting in cracking , mechanical and / or electronic damage. 电子元件损坏。 类型 Type 焊膏厚度 Solder Paste Thickness H CMF0201 100μm 1/3T≤H≤T CMFX 150μm 1/3T≤H≤T CMFA, CMFB 200μm 0.2mm≤H≤T  焊接完成后  After Soldering  焊接完成后要清除助焊剂时，请遵循以下几点，以免  For removing the flux after soldering, observe the following points in order to avoid deterioration of the 造成特性退化或导致外部电极质量变化。 characteristics or any change of the external electrodes 1） 进行超声清洗时，请防止安装部分与基板发生共振。 quality. 2） 在使用了非水洗型助焊剂时，请勿清洗产品。 1) Please keep mounted parts and a substrate from an occurrence of resonance in ultrasonic cleaning. 2) Please do not clean the products in the case of using a non-wash-type flux 类型 Type CMFA，CMFB 溶剂 Solvent 异丙醇 Isopropyl Alcohol 浸泡清洗 Dipping Cleaning 5 分钟（常温）或者 2 分钟（最高 40℃） Less than 5 min.at room temp. or Less than 2 min. at 40°C max. 超声波清洗 Ultrasonic Cleaning  CMF0201，CMFX 5 分钟以下，20W/L 频率 28kHz 到 40kHz Less than 5 min, 20W/L 1 分钟以下，20W/L 频率 10kHz 到 100kHz Less than 1 min, 20W/L Frequency of several 28kHz to several 40kHz. Frequency of several 10kHzto several 100kHz. 干燥 清洗之后，请迅速将本产品烘干。  Drying After cleaning, promptly dry this product. 11 R-T 表 R-T table CMFB153J3950FB 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) -40 474.896 517.912 563.413 8.79% 1.26 -39 444.270 484.186 526.370 8.71% 1.26 -38 415.829 452.887 492.015 8.64% 1.26 -37 389.402 423.824 460.136 8.57% 1.26 -36 364.834 396.823 430.538 8.50% 1.26 -35 341.982 371.724 403.043 8.43% 1.26 -34 320.715 348.381 377.489 8.35% 1.26 -33 300.912 326.660 353.725 8.29% 1.26 -32 282.465 306.438 331.616 8.22% 1.26 -31 265.270 287.602 311.034 8.15% 1.25 -30 249.236 270.048 291.866 8.08% 1.25 -29 234.276 253.680 274.005 8.01% 1.25 -28 220.313 238.412 257.353 7.94% 1.25 -27 207.272 224.162 241.822 7.88% 1.25 -26 195.088 210.856 227.329 7.81% 1.25 -25 183.699 198.426 213.798 7.75% 1.25 -24 173.025 186.783 201.131 7.68% 1.25 -23 163.041 175.899 189.298 7.62% 1.25 -22 153.697 165.720 178.236 7.55% 1.24 -21 144.949 156.195 167.893 7.49% 1.24 -20 136.754 147.278 158.215 7.43% 1.24 -19 129.076 138.927 149.157 7.36% 1.24 -18 121.877 131.103 140.675 7.30% 1.24 -17 115.125 123.769 132.729 7.24% 1.24 -16 108.790 116.891 125.282 7.18% 1.24 -15 102.843 110.439 118.299 7.12% 1.23 -14 97.258 104.382 111.749 7.06% 1.23 -13 92.011 98.696 105.602 7.00% 1.23 -12 87.080 93.355 99.831 6.94% 1.23 -11 82.444 88.335 94.411 6.88% 1.23 -10 78.083 83.617 89.319 6.82% 1.23 -9 73.979 79.179 84.532 6.76% 1.22 -8 70.116 75.003 80.031 6.70% 1.22 -7 66.478 71.074 75.797 6.65% 1.22 -6 63.050 67.373 71.813 6.59% 1.22 -5 59.820 63.888 68.062 6.53% 1.22 -4 56.771 60.599 64.524 6.48% 1.21 -3 53.896 57.500 61.192 6.42% 1.21 -2 51.183 54.578 58.051 6.36% 1.21 -1 48.624 51.821 55.091 6.31% 1.21 0 46.207 49.221 52.300 6.26% 1.21 1 43.928 46.769 49.669 6.20% 1.20 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 2 41.775 44.454 47.186 6.15% 1.20 3 39.739 42.266 44.842 6.09% 1.20 4 37.815 40.199 42.627 6.04% 1.20 5 35.995 38.245 40.535 5.99% 1.19 6 34.269 36.394 38.554 5.93% 1.19 7 32.637 34.643 36.681 5.88% 1.19 8 31.092 32.987 34.911 5.83% 1.19 9 29.629 31.420 33.236 5.78% 1.18 10 28.244 29.936 31.651 5.73% 1.18 11 26.932 28.532 30.152 5.68% 1.18 12 25.689 27.202 28.733 5.63% 1.18 13 24.510 25.941 27.388 5.58% 1.17 14 23.392 24.746 26.114 5.53% 1.17 15 22.331 23.613 24.906 5.48% 1.17 16 21.324 22.538 23.761 5.43% 1.16 17 20.368 21.517 22.675 5.38% 1.16 18 19.460 20.549 21.644 5.33% 1.16 19 18.598 19.629 20.666 5.28% 1.15 20 17.779 18.756 19.738 5.23% 1.15 21 17.000 17.927 18.857 5.19% 1.15 22 16.260 17.139 18.020 5.14% 1.15 23 15.556 16.390 17.224 5.09% 1.14 24 14.887 15.677 16.468 5.05% 1.14 25 14.250 15.000 15.750 5.00% 1.14 26 13.632 14.356 15.080 5.05% 1.15 27 13.044 13.743 14.442 5.09% 1.17 28 12.485 13.159 13.835 5.14% 1.19 29 11.952 12.603 13.256 5.18% 1.21 30 11.445 12.074 12.705 5.23% 1.22 31 10.963 11.570 12.180 5.27% 1.24 32 10.504 11.090 11.680 5.32% 1.26 33 10.066 10.632 11.202 5.36% 1.28 34 9.649 10.196 10.747 5.41% 1.30 35 9.251 9.780 10.313 5.45% 1.32 36 8.872 9.383 9.899 5.49% 1.34 37 8.511 9.005 9.503 5.54% 1.35 38 8.166 8.643 9.126 5.58% 1.37 39 7.837 8.298 8.765 5.62% 1.39 40 7.523 7.969 8.421 5.67% 1.41 41 7.223 7.655 8.092 5.71% 1.43 42 6.937 7.354 7.777 5.75% 1.45 43 6.663 7.067 7.477 5.79% 1.47 44 6.402 6.793 7.189 5.84% 1.49 45 6.153 6.531 6.914 5.88% 1.51 46 5.914 6.280 6.652 5.92% 1.53 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 47 5.687 6.041 6.401 5.96% 1.55 48 5.469 5.811 6.160 6.00% 1.57 49 5.260 5.592 5.930 6.04% 1.59 50 5.061 5.382 5.710 6.08% 1.61 51 4.870 5.181 5.499 6.12% 1.63 52 4.688 4.989 5.297 6.16% 1.65 53 4.513 4.805 5.103 6.20% 1.67 54 4.346 4.628 4.917 6.24% 1.69 55 4.185 4.459 4.739 6.28% 1.71 56 4.032 4.297 4.569 6.32% 1.73 57 3.885 4.142 4.405 6.36% 1.75 58 3.744 3.993 4.249 6.40% 1.77 59 3.608 3.850 4.098 6.44% 1.79 60 3.479 3.713 3.954 6.48% 1.81 61 3.355 3.582 3.815 6.51% 1.84 62 3.236 3.456 3.683 6.55% 1.86 63 3.121 3.336 3.555 6.59% 1.88 64 3.012 3.220 3.433 6.63% 1.90 65 2.907 3.108 3.315 6.67% 1.92 66 2.805 3.001 3.202 6.70% 1.94 67 2.708 2.898 3.093 6.74% 1.96 68 2.615 2.799 2.989 6.78% 1.99 69 2.525 2.704 2.888 6.81% 2.01 70 2.439 2.613 2.792 6.85% 2.03 71 2.357 2.525 2.699 6.89% 2.05 72 2.278 2.441 2.610 6.92% 2.08 73 2.202 2.361 2.525 6.96% 2.10 74 2.128 2.283 2.443 7.00% 2.12 75 2.058 2.208 2.363 7.03% 2.14 76 1.990 2.136 2.287 7.07% 2.17 77 1.925 2.067 2.213 7.10% 2.19 78 1.862 2.000 2.143 7.14% 2.21 79 1.801 1.935 2.074 7.17% 2.23 80 1.743 1.873 2.008 7.21% 2.26 81 1.687 1.814 1.945 7.24% 2.28 82 1.633 1.757 1.884 7.28% 2.30 83 1.582 1.701 1.826 7.31% 2.33 84 1.532 1.648 1.769 7.34% 2.35 85 1.483 1.597 1.715 7.38% 2.37 86 1.437 1.547 1.662 7.41% 2.40 87 1.392 1.500 1.611 7.45% 2.42 88 1.349 1.454 1.563 7.48% 2.45 89 1.308 1.409 1.515 7.51% 2.47 90 1.268 1.367 1.470 7.55% 2.49 91 1.229 1.325 1.426 7.58% 2.52 温度 R 最小值 R 中心值 R 最大值 阻值公差 温度公差 Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 92 1.192 1.286 1.383 7.61% 2.54 93 1.156 1.247 1.342 7.64% 2.57 94 1.121 1.210 1.303 7.68% 2.59 95 1.087 1.174 1.265 7.71% 2.62 96 1.055 1.140 1.228 7.74% 2.64 97 1.024 1.106 1.192 7.77% 2.67 98 0.994 1.074 1.158 7.81% 2.69 99 0.965 1.043 1.125 7.84% 2.72 100 0.937 1.013 1.093 7.87% 2.74 101 0.910 0.984 1.062 7.90% 2.77 102 0.884 0.956 1.032 7.93% 2.79 103 0.858 0.929 1.003 7.96% 2.82 104 0.834 0.903 0.975 7.99% 2.84 105 0.810 0.878 0.948 8.02% 2.87 106 0.787 0.853 0.922 8.05% 2.89 107 0.765 0.829 0.896 8.08% 2.92 108 0.744 0.806 0.872 8.11% 2.95 109 0.723 0.784 0.848 8.15% 2.97 110 0.703 0.763 0.825 8.18% 3.00 111 0.684 0.742 0.803 8.21% 3.02 112 0.665 0.722 0.781 8.23% 3.05 113 0.647 0.702 0.760 8.26% 3.08 114 0.629 0.683 0.740 8.29% 3.10 115 0.612 0.665 0.720 8.32% 3.13 116 0.596 0.647 0.701 8.35% 3.16 117 0.580 0.630 0.683 8.38% 3.18 118 0.565 0.614 0.665 8.41% 3.21 119 0.550 0.598 0.648 8.44% 3.24 120 0.535 0.582 0.632 8.47% 3.26 121 0.521 0.567 0.615 8.50% 3.29 122 0.508 0.553 0.600 8.52% 3.32 123 0.495 0.538 0.584 8.55% 3.35 124 0.482 0.525 0.570 8.58% 3.37 125 0.470 0.511 0.555 8.61% 3.40