Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
INTEGRATED CIRCUITS
DATA SHEET
74AVCH16244
16-bit buffer/line driver;
3.6 V tolerant; 3-state
Product Specification
File under Integrated Circuits, IC24
2000 Mar 07
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.2 to 3.6 V
The 74AVCH16244 is a 16-bit non-inverting buffer/line
driver with 3-state outputs. The device can be used as four
4-bit buffers, two 8-bit buffers or one 16-bit buffer.
The 3-state outputs are controlled by the output enable
inputs nOE. A HIGH on nOE causes the outputs to assume
a high impedance OFF-state.
• Complies with JEDEC standard no. 8-1A/5/7
• CMOS low power consumption
• Input/output tolerant up to 3.6 V
• Dynamic Controlled Output (DCO) circuit dynamically
changes the output impedance, resulting in noise
reduction without speed degradation
The 74AVCH16244 is designed to have an extremely fast
propagation delay and a minimum amount of power
consumption.
• Low inductance multiple VCC and GND pins to minimize
noise and ground bounce
To ensure the high-impedance output state during
power-up or power-down, nOE should be tied to VCC
through a pull-up resistor (Live Insertion).
• Supports Live Insertion
• All data inputs have bus-hold.
A Dynamic Controlled Output (DCO) circuitry is
implemented to support termination line drive during
transient (see Figs 1 and 2).
The 74AVCH16244 has active bus-hold circuitry to hold
unused or floating data inputs at a valid logic level. This
feature eliminates the need for external pull-up or
pull-down resistors.
MNA506
MNA507
0
300
handbook, halfpage
handbook, halfpage
I OH
(mA)
I OL
(mA)
3.3 V
1.8 V
−100
200
2.5 V
2.5 V
−200
100
1.8 V
3.3 V
−300
Fig.1
0
0
1
2
3
VOH (V)
4
0
Output voltage as a function of the
HIGH-level output current.
2000 Mar 07
Fig.2
2
1
2
3
VOL (V)
Output voltage as a function of the
LOW-level output current.
4
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 2.0 ns.
SYMBOL
PARAMETER
tPHL/tPLH
CONDITIONS
propagation delay nAn to nYn
TYP.
VCC = 1.2 V
5.2
ns
VCC = 1.5 V
2.9
ns
VCC = 1.8 V
2.1
ns
VCC = 2.5 V
1.5
ns
VCC = 3.3 V
1.3
ns
5.0
pF
outputs enabled
34
pF
outputs disabled
1
pF
CI
input capacitance
CPD
power dissipation capacitance per buffer notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
∑ (CL × VCC2 × fo) = sum of outputs.
2. The condition is VI = GND to VCC.
FUNCTION TABLE
See note 1.
INPUTS
nOE
OUTPUTS
nAn
nYn
L
L
L
L
H
H
H
X
Z
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high impedance OFF-state.
2000 Mar 07
3
UNIT
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
ORDERING AND PACKAGE INFORMATION
PACKAGE
TYPE NUMBER
74AVCH16244DGG
TEMPERATURE RANGE
PINS
PACKAGE
MATERIAL
CODE
−40 to +85 °C
48
TSSOP
plastic
SOT362-1
PINNING
PIN
SYMBOL
DESCRIPTION
1
1OE
output enable input (active LOW)
2, 3, 5 and 6
1Y0 to 1Y3
data outputs
4, 10, 15, 21, 28, 34, 39 and 45
GND
ground (0 V)
7, 18, 31 and 42
VCC
positive supply voltage
8, 9, 11 and 12
2Y0 to 2Y3
data outputs
13, 14, 16 and 17
3Y0 to 3Y3
data outputs
19, 20, 22 and 23
4Y0 to 4Y3
data outputs
24
4OE
output enable input (active LOW)
25
3OE
output enable input (active LOW)
26, 27, 29 and 30
4A3 to 4A0
data inputs
32, 33, 35 and 36
3A3 to 3A0
data inputs
37, 38, 40 and 41
2A3 to 2A0
data inputs
43, 44, 46 and 47
1A3 to 1A0
data inputs
48
2OE
output enable input (active LOW)
2000 Mar 07
4
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
handbook, halfpage
handbook, halfpage
1OE 1
48 2OE
1Y0
2
47 1A0
1Y1
3
46 1A1
GND
4
45 GND
1Y2
5
44 1A2
1Y3
6
43 1A3
VCC
7
42 VCC
2Y0
8
41 2A0
2Y1
9
40 2A1
nA0
nY0
nA1
nY1
nA2
nY2
nA3
nY3
nOE
MNA502
GND 10
39 GND
2Y2 11
38 2A2
37 2A3
2Y3 12
3Y0 13
Fig.4 Logic symbol.
16244
36 3A0
3Y1 14
35 3A1
GND 15
34 GND
handbook, halfpage
1
48
25
24
3Y2 16
33 3A2
3Y3 17
32 3A3
47
1EN
2EN
3EN
4EN
1
1
2
46
3
VCC 18
31 VCC
44
5
4Y0 19
30 4A0
43
6
4Y1 20
29 4A1
41
1 2
8
40
9
GND 21
28 GND
38
11
4Y2 22
27 4A2
37
12
4Y3 23
26 4A3
36
4OE 24
25 3OE
35
14
33
16
32
17
1 3
13
MNA501
30
1 4
19
29
20
27
22
26
23
MNA503
Fig.3 Pin configuration.
2000 Mar 07
Fig.5 IEEE/IEC logic symbol.
5
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
DC supply voltage
CONDITIONS
according to JEDEC Low
Voltage Standards
DC input voltage
VO
DC output voltage
MAX.
UNIT
1.4
1.6
V
1.65
1.95
V
2.3
2.7
V
3.0
3.6
V
1.2
3.6
V
0
3.6
V
output 3-state
0
3.6
V
output HIGH or LOW state
0
VCC
V
for low-voltage applications
VI
MIN.
Tamb
operating ambient temperature
in free air
−40
+85
°C
tr, tf
input rise and fall ratios
VCC = 1.4 to 1.6 V
0
40
ns/V
VCC = 1.65 to 2.3 V
0
30
ns/V
VCC = 2.3 to 3.0 V
0
20
ns/V
VCC = 3.0 to 3.6 V
0
10
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
VCC
DC supply voltage
CONDITIONS
MIN.
MAX.
UNIT
−0.5
+4.6
V
IIK
DC input diode current
VI < 0
−
−50
mA
VI
DC input voltage
for inputs; note 1
−0.5
+4.6
V
IOK
DC output clamping diode current
VO < 0
−
−50
mA
VO
DC output voltage
output HIGH or LOW state;
note 1
−0.5
VCC + 0.5 V
output 3-state; note 1
−0.5
+4.6
V
VO = 0 to VCC
−
50
mA
−
±100
mA
−65
+150
°C
−
500
mW
IO
DC output sink current
ICC, IGND
DC VCC or GND current
Tstg
storage temperature
PD
power dissipation per package
for temperature range:
−40 to +85 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 60 °C the value of PD derates linearly with 5.5 mW/K.
2000 Mar 07
6
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
DC CHARACTERISTICS
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Tamb = −40 to +85 °C
TEST CONDITIONS
SYMBOL
PARAMETER
OTHER
VIH
VIL
VOH
VOL
HIGH-level input
voltage
LOW-level
output voltage
TYP.(1)
MIN.
UNIT
MAX.
1.2
VCC
−
−
V
1.4 to 1.6
0.65 × VCC
0.9
−
V
1.65 to 1.95 0.65 × VCC
0.9
−
V
2.3 to 2.7
1.2
−
V
1.7
3.0 to 3.6
2.0
1.5
−
V
1.2
−
−
GND
V
1.4 to 1.6
−
0.9
0.35 × VCC
V
1.65 to 1.95 −
0.9
0.35 × VCC
V
2.3 to 2.7
−
1.2
0.7
V
3.0 to 3.6
−
1.5
0.8
V
IO = −100 µA
1.65 to 3.6
VCC − 0.20
VCC
−
V
IO = −3 mA
1.4
VCC − 0.35
VCC − 0.21
−
V
IO = −4 mA
1.65
VCC − 0.45
VCC − 0.25
−
V
IO = −8 mA
2.3
VCC − 0.55
VCC − 0.37
−
V
IO = −12 mA
3.0
VCC − 0.70
VCC − 0.47
−
V
LOW-level input
voltage
HIGH-level
output voltage
VCC (V)
VI = VIH or VIL
VI = VIH or VIL
IO = 100 µA
1.65 to 3.6
−
GND
0.20
V
IO = 3 mA
1.4
−
0.22
0.35
V
IO = 4 mA
1.65
−
0.24
0.45
V
IO = 8 mA
2.3
−
0.38
0.55
V
IO = 12 mA
3.0
−
0.53
0.70
V
II
input leakage
current per pin
VI = VCC or GND
1.4 to 3.6
−
0.1
2.5
µA
Ioff
power-off
leakage current
VI or VO = 3.6 V
0
−
0.1
±10
µA
IIHZ/IILZ
input current for
common I/O
pins
VI = VCC or GND
1.4 to 3.6
−
0.1
12.5
µA
IOZ
3-state output
OFF-state
current
VI = VIH or VIL;
VO = VCC or GND
1.4 to 2.7
−
0.1
5
µA
3.0 to 3.6
−
0.1
10
µA
quiescent
supply current
VI = VCC or GND; IO = 0 1.4 to 2.7
−
0.1
20
µA
3.0 to 3.6
−
0.2
40
µA
bus-hold LOW
sustaining
current
VI = 0.35 × VCC
1.65
25
−
−
µA
VI = 0.7 V
2.3
45
−
−
µA
VI = 0.8 V
3.0
75
−
−
µA
ICC
IBHL
2000 Mar 07
7
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
Tamb = −40 to +85 °C
TEST CONDITIONS
SYMBOL
PARAMETER
OTHER
IBHH
IBHLO
IBHHO
TYP.(1)
MIN.
UNIT
MAX.
1.65
−25
−
−
µA
2.3
−45
−
−
µA
3.0
−75
−
−
µA
bus-hold LOW
overdrive
current
1.95
200
−
−
µA
2.7
300
−
−
µA
3.6
450
−
−
µA
bus-hold HIGH
overdrive
current
1.95
−200
−
−
µA
2.7
−300
−
−
µA
3.6
−450
−
−
µA
bus-hold HIGH
sustaining
current
VI = 0.65 × VCC
VCC (V)
Note
1. All typical values are measured at Tamb = 25 °C.
AC CHARACTERISTICS
GND = 0 V; tr = tf ≤ 2.0 ns.
Tamb = −40 to +85 °C
TEST CONDITIONS
SYMBOL
PARAMETER
WAVEFORMS
tPHL/tPLH
tPZH/tPZL
tPHZ/tPLZ
propagation
delay;
nAn to nYn
3-state output
enable time;
nOE to nYn
3-state output
disable time;
nOE to nYn
see Figs 6 and 8
see Figs 7 and 8
see Figs 7 and 8
VCC (V)
MIN.
TYP.(1)
UNIT
MAX.
−
5.2
−
ns
1.40 to 1.60 −
2.9
−
ns
1.65 to 1.95 0.8
2.1
3.4
ns
2.3 to 2.7
1.5
2.2
ns
1.2
0.7
3.0 to 3.6
0.6
1.3
2.0
ns
1.2
−
5.7
−
ns
1.40 to 1.60 −
4.0
−
ns
1.65 to 1.95 1.3
3.3
6.8
ns
2.3 to 2.7
0.9
2.2
4.0
ns
3.0 to 3.6
0.7
1.9
3.5
ns
1.2
−
5.9
−
ns
1.40 to 1.60 −
4.2
−
ns
1.65 to 1.95 1.6
3.7
6.2
ns
2.3 to 2.7
1.0
1.9
4.3
ns
3.0 to 3.6
1.1
2.2
3.5
ns
Note
1. All typical values are measured at Tamb = 25 °C and at VCC respectively 1.2, 1.5, 1.8, 2.5 and 3.3 V.
2000 Mar 07
8
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
AC WAVEFORMS
handbook, halfpage VI
nAn input
VM
GND
t PLH
t PHL
VOH
nYn output
VM
VOL
VCC
VM
MNA504
VI
≤2.3 to 2.7 V
0.5 × VCC
VCC
3.0 to 3.6 V
0.5 × VCC
VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.6 The input (nAn) to output (nYn) propagation delay.
VI
handbook, full pagewidth
nOE input
VM
GND
t PLZ
t PZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
t PZH
t PHZ
VOH
VY
output
HIGH-to-OFF
OFF-to-HIGH
GND
VM
outputs
enabled
outputs
disabled
outputs
enabled
MNA478
VCC
VM
VX
VY
VI
≤2.3 to 2.7 V
0.5 × VCC
VOL + 0.15 V
VOH − 0.15 V
VCC
3.0 to 3.6 V
0.5 × VCC
VOL + 0.3 V
VOH − 0.3 V
VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 The 3-state enable and disable times.
2000 Mar 07
9
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
S1
handbook, full pagewidth
VCC
VI
PULSE
GENERATOR
2 × VCC
open
GND
R load
VO
D.U.T.
CL
RT
R load
MNA505
VCC (V)
TEST
S1
VI
Rload
CL
1.2
VCC
2000 Ω
15 pF
1.4 to 1.6
VCC
2000 Ω
15 pF
tPLH/tPHL
open
1.65 to 1.95
VCC
1000 Ω
30 pF
tPLZ/tPZL
2 × VCC
2.3 to 2.7
VCC
500 Ω
30 pF
tPHZ/tPZH
GND
3.0 to 3.6
VCC
500 Ω
30 pF
Fig.8 Load circuitry for switching times.
2000 Mar 07
10
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
PACKAGE OUTLINE
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
E
D
A
X
c
HE
y
v M A
Z
48
25
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
detail X
24
w M
bp
e
2.5
0
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT362-1
2000 Mar 07
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-10
99-12-27
MO-153
11
o
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
SOLDERING
74AVCH16244
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Mar 07
12
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Mar 07
13
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
NOTES
2000 Mar 07
14
74AVCH16244
Philips Semiconductors
Product Specification
16-bit buffer/line driver; 3.6 V tolerant;
3-state
NOTES
2000 Mar 07
15
74AVCH16244
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 69
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp16
Date of release: 2000
Mar 07
Document order number:
9397 750 06759
工商网监
湘ICP备2023018690号
