TMPC1206HP-220MG-D

P1 TAI-TECH SMD Power Inductor TMPC1206HP-Series(MG)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 14/12/12 新發行 楊祥忠 詹偉特 何秦芝 備 註 P2 TAI-TECH SMD Power Inductor TMPC1206HP-Series(MG)-D 1. Features 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. Halogen Pb Halogen-free Pb-free 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter . 3. Dimensions Dr. MOS application Recommend PC Board Pattern C 　330 1349 D L H E B A G Series A(mm) TMPC1206HP 13.5±0.5 B(mm) C(mm) 12.5±0.3 5.7±0.3 D(mm) 2.3±0.3 E(mm) L(mm) G(mm) H(mm) 4.7±0.3 14.2 8.0 5.0 4. Part Numbering TMPC 1206 HP A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: 印 D/C - 330 MG D E - D F BxC HP:H:Carbonyl Powder,P:PAD broaden. 330=33uH M=±20%,Y=±30% 印字:黑色.330 及 D/C 1349 (13 年,49 週期,依實際生產周期而定) P3 TAI-TECH 5. Specification Part Number Inductance L0 (uH)±20% @ 0 A I rms (A) Typ. I sat 1 (A) Typ. I sat 2 (A) Typ. DCR (mΩ) Typ. @25℃ DCR (mΩ) Max. @25℃ TMPC1206HP-1R5MG-D 1.50 26 43 50 2.7 3.2 TMPC1206HP-2R2MG-D 2.20 21 34 43 4.0 4.7 TMPC1206HP-3R3MG-D 3.30 17 28 35 5.8 7.1 TMPC1206HP-4R7MG-D 4.70 16 25 30 9.5 11.5 TMPC1206HP-5R6MG-D 5.60 15.5 22 28 10.8 12.6 TMPC1206HP-6R8MG-D 6.80 15 19 25 12 13.8 TMPC1206HP-100MG-D 10.0 11 15.5 21 18 20.7 TMPC1206HP-120MG-D 12.0 9.5 13.5 18 20 23 TMPC1206HP-150MG-D 15.0 9.0 13 16 25 29 TMPC1206HP-180MG-D 18.0 8.5 12 15 30 35 TMPC1206HP-220MG-D 22.0 8.0 11 14 34 39.5 TMPC1206HP-270MG-D 27.0 7.0 9.0 13 49 56 TMPC1206HP-330MG-D 33.0 6.0 8.0 12.0 65 75 TMPC1206HP-470MG-D 47.0 5.5 7.0 11.0 80 90 TMPC1206HP-560MG-D 56.0 5.3 6.5 10 101 118 .TMPC1206HP-680MG-D 68.0 5.0 6.0 9.0 120 140 .TMPC1206HP-820MG-D 82.0 4.5 5.5 8.5 138 161 TMPC1206HP-101MG-D 100 4.0 5.0 8.0 180 200 TMPC1206HP-121MG-D 120 3.5 4.5 7.0 210 235 TMPC1206HP-151MG-D 150 3.0 4.0 6.0 300 350 Note: 1.Test frequency : L : 100KHz /1.0V; 2.All test data referenced to 25℃ ambient. 3.Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4.Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.). 5.Saturation Current (Isat 1) will cause L0 to drop 20% typical. (keep quickly). 6.Saturation Current (Isat 2) will cause L0 to drop 30% typical. (keep quickly) 7.The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 8. Special inquiries besides the above common used types can be met on your requirement. P4 TAI-TECH 6. Material List NO Items 1 Core Carbonyl Powder. Materials 2 Wire Polyester Wire or equivalent. 3 Solder Plating 100% Pb free solder 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L≦20% typical. Saturation DC Current (Isat) will cause L0 to drop △L(%)(keep quickly). Heat Rated Current (Irms) Approximately △T≦40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature：125±2℃(Bead) Life Test Temperature： 85±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪ R.H, Load Humidity Temperature：85℃±2℃ Thermal shock Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Appearance：No damage. Step2：25±2℃ ≦0.5min Inductance：within±10% of initial value Step3：105±2℃ 30±5min Q：Shall not exceed the specification value. Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs RDC：within ±15% of initial value and shall not exceed the specification value Vibration Shock Bending Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,