TMPV0603SV-2R2MN-D

TAI-TECH P1 SMD Power Inductor TMPV0603SV-Series(N)-D 1. Features 1. Low loss realized with low DCR. 2. High performance realized by metal dust core. 3. Ultra low buzz noise, due to composite construction. Halogen 4. 100% Lead(Pb)-Free and RoHS compliant. 5. High reliability -Reliability test complied to AEC-Q200. Halogen-free 2. Applications Automotive applications. 3. Dimensions Series Recommend PC Board Pattern A(mm) A1(mm) B(mm) TMPV0603SV 7.1±0.3 6.6±0.2 6.6±0.2 C(mm) D(mm) D1(mm) E(mm) E1(mm) 2.8±0.2 1.6±0.3 4.3±0.3 1R0 M N D E F 1.8±0.3 3.0±0.2 4. Part Numbering TMPV 0603 SV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F、G: Code - - L(mm) G(mm) H(mm) 8.4 2.7 3.4 Note: 1.PCB layout is referred to standard IPC-7351B 2. The above PCB layout reference only. 3. Recommend solder paste thickness at 0.15mm and above. D G BxC Standard. 1R0=1.0uh K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking direction cannot decide polarity. Marking: Black.1R0 and 2019 (20:YY,19:WW, follow production date). 5. Specification Part Number Inductance L0 A(uH) ±20% TMPV0603SV-R47MN-D 0.47 TMPV0603SV-1R0MN-D 1.00 TMPV0603SV-1R5MN-D Heat Rating Current DC ※ Irms( A ) Saturation Current DC I sat ( A ) DCR (mΩ) Typ DCR (mΩ) Max 19.0 19.0 3.4 3.74 14.0 14.0 6.0 6.6 1.50 11.5 13.0 10.6 11.7 TMPV0603SV-2R2MN-D 2.20 9.0 10.5 15.0 16.5 TMPV0603SV-3R3MN-D 3.30 7.8 9.5 22.0 24.2 TMPV0603SV-4R7MN-D 4.70 6.4 7.2 29.0 32.0 TMPV0603SV-6R8MN-D 6.80 5.2 6.1 42.0 46.2 TMPV0603SV-8R2MN-D 8.20 4.8 5.6 49.0 54.0 TMPV0603SV-100MN-D 10.0 4.2 4.7 63.0 69.3 TMPV0603SV-150MN-D 15.0 3.7 4.0 100.0 110.0 TMPV0603SV-220MN-D 22.0 2.9 3.0 150.0 165.0 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : Agilent 4284A,E4991A,4339B,KEYSIGHT E4980A/AL,chroma3302,3250,16502. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 165℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. ※ 7. Irms Testing : Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. TAI-TECH 6. Typical Performance Curves P2