FCM2012KF-600T09

TAI-TECH TBM01-151200553 Ferrite Chip Bead(Lead Free) FCM2012-Series ECN HISTORY LIST REV DATE DESCRIPTION P1. APPROVED CHECKED DRAWN 楊祥忠 羅培君 張嘉玲 楊祥忠 羅培君 張嘉玲 1.0 13/06/06 變更可靠度條件 2.0 14/01/24 3.0 14/08/01 變更 Reflow 圖示 楊祥忠 羅培君 張嘉玲 3.1 14/08/01 修正包裝帶尺寸 楊祥忠 羅培君 張嘉玲 變更電鍍錫層厚度 3.0um min.=>3.5um min. 備 註 www.tai-tech.com.tw TAI-TECH TBM01-151200553 Ferrite Chip Bead(Lead Free) FCM2012-Series 1.Features 1. Monolithic inorganic material construction. 2. Closed magnetic circuit avoids crosstalk. 3. S.M.T. type. 4. Suitable for reflow soldering. Halogen Pb Halogen-free Pb-free 5. Shapes and dimensions follow E.I.A. spec. 6. Available in various sizes. 7. Excellent solderability and heat resistance. 8. High reliability. 9. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2.Dimensions Chip Size A B C D 2.00±0.20 1.25±0.20 0.85±0.20 1.25±0.20 0.50±0.30 Units: mm 3.Part Numbering FCM 2012 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 121 T 08 D E F LxW Lead Free Material 121=120Ω T=Taping and Reel, B=Bulk(Bags) 08=800mA 4.Specification Tai-Tech Part Number Test Frequency (MHz) DC Resistance (Ω) max. Thickness C size (mm) Impedance (Ω) FCM2012KF-110T09 0.85±0.2 11±25% 100 0.10 900 FCM2012KF-170T06 0.85±0.2 17±25% 100 0.10 600 FCM2012KF-260T06 0.85±0.2 26±25% Rated Current (mA) max. 100 0.10 600 0.10 600 FCM2012KF-300T06 0.85±0.2 30±25% 100 FCM2012KF-400T06 0.85±0.2 40±25% 100 0.10 600 FCM2012KF-600T09 0.85±0.2 60±25% 100 0.10 900 FCM2012KF-121T08 0.85±0.2 120±25% 100 0.20 800 FCM2012KF-151T08 0.85±0.2 150±25% 100 0.20 800 FCM2012KF-221T07 0.85±0.2 220±25% 100 0.30 750 FCM2012KF-301T07 0.85±0.2 300±25% 100 0.30 700 FCM2012KF-471T07 0.85±0.2 470±25% 100 0.35 700 FCM2012KF-601T05 0.85±0.2 600±25% 100 0.40 500 100 0.45 400 FCM2012KF-102T04 0.85±0.2 1000±25% P2. www.tai-tech.com.tw TAI-TECH Impedance (Ω) Test Frequency (MHz) DC Resistance (Ω) max. Rated Current (mA) max. FCM2012HF-102T04 0.85±0.2 1000±25% 100 0.45 400 FCM2012HF-152T03 0.85±0.2 1500±25% 100 0.50 350 FCM2012HF-202T02 0.85±0.2 2000±25% 100 0.60 250 600 FCM2012NF-070T06 0.85±0.2 7±25% 100 0.10 FCM2012CF-300T07 0.85±0.2 30±25% 100 0.20 700 FCM2012CF-600T07 0.85±0.2 60±25% 100 0.20 700 FCM2012CF-121T06 0.85±0.2 120±25% 100 0.25 600 600 FCM2012CF-151T06 0.85±0.2 150±25% 100 0.25 FCM2012CF-221T04 0.85±0.2 220±25% 100 0.30 400 400 FCM2012CF-301T04 0.85±0.2 300±25% 100 0.35 FCM2012CF-471T04 1.25±0.2 470±25% 100 0.40 400 FCM2012CF-601T03 1.25±0.2 600±25% 100 0.45 300 100 0.50 200 FCM2012CF-102T02 ● P3. Thickness C size (mm) Tai-Tech Part Number ● TBM01-151200553 1.25±0.2 1000±25% Rated current: based on temperature rise test In compliance with EIA 595 www.tai-tech.com.tw TAI-TECH TBM01-151200553 P4. 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCI -- -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -- -40~+125℃ (on board) -40~+105℃ (on board) Transportation Storage Temperature HCB GHB FCA FCI Test Condition FHI FCH For long storage conditions, please see the Application Notice Agilent4291 Impedance (Z) Agilent E4991 Inductance (Ls) Agilent4287 Q Factor Agilent16192 Refer to standard electrical characteristics list DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Rated Current < 1A ∆T 20℃Max Temperature Rise Test 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current ≧ 1A ∆T 40℃Max Number of heat cycles: 1 Resistance to Soldering Heat Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate 260 ±5 (solder temp) 10 ±1 25mm/s ±6 mm/s Depth: completely cover the termination Preheating Dipping Natural cooling More than 95% of the terminal Solderability electrode should be covered 245° C 150° C 60 second with solder. Terminal strength Bending Vibration Test 4±1 second Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. Impedance：within±10% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preheat: 150℃,60sec. Solder: Sn96.5%-Ag3%-Cu0.5% Solder temperature: 245±5℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg =0805:40x100x1.2mm =0805:1.2mm 1GΩ Derating **Derating Curve Derated Current(A) 6 For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 0 85 125 Environment Temperature+△Temperature(°C) 6.Soldering and Mounting 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size 0.6±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0.80 0.30 0.30 1005 1.0±0.10 0.50±0.10 0.50±0.10 0.25±0.10 1.50 0.40 0.55 1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.20 2.60 0.60 0.80 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.30 GHB FCI 2.0±0.20 1.25±0.20 1.25±0.20 0.50±0.30 3.00 1.00 1.00 FHI 3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.30 4.40 2.20 1.40 3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.30 4.40 2.20 FCH 3.40 4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.30 5.70 2.70 HCI 1.40 4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.30 5.90 2.57 4.22 2012 Land Solder Resist 2.8 0.8 0603 HCB FCA3216 A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) 2.2-2.6 FCB FCM Type 0.8 Pitch 0.4 L PC board should be designed so that products can prevent damage from mechanical stress when warping the board. H Series G www.tai-tech.com.tw TAI-TECH P6. TBM01-151200553 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. ‧Preheat circuit and products to 150℃ ‧350℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. R eflow S oldering Iron Soldering PRE-HEATING NATUR AL CO O LING SO LDER IN G within 4~5s TEMPERATURE(° C) TP(260 ℃ / 10s m ax.) TEMPERATURE(° C) tp(245° C / 20~40s.) 217 60~150s 200 150 NATURAL COOLING SOLDERING PRE-HEATING 60~180s 350 150 Gradual cooling Over 60s 480s m ax. 25 TIME(sec.) TIM E( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Upper limit Recommendable Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height t 7.Packaging Information 7-1. Reel Dimension A ±0 . .5 13 C B 0 R1 .5 7"x8mm B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2 R0.5 120° 7"x12mm 7-2.1 Tape Dimension / 8mm ■Material of taping is paper .0 -0 .1 +0 .5 1 D: P P2:2±0.1 05 0. 10. + 56 1. D: P(mm) t(mm) 0.45max 2.0±0.05 0.45max 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.05 0.60±0.03 0.70±0.06 0.40±0.06 100505 t B0 F:3.5±0.1 P Bo(mm) Ao(mm) Ko(mm) 060303 Ko A0 P0:4±0.1 Size A0 W:8.0±0.1 F:3.5±0.05 B0 t W:8.0±0.3 E:1.75±0.1 P0:4±0.1 E:1.75±0.1 D R1 .9 A(mm) 5 Type 2±0.5 Size Bo(mm) Ao(mm) 160808 1.80±0.05 201209 2.10±0.05 Ko www.tai-tech.com.tw Ko(mm) P(mm) t(mm) 0.96+0.05/-0.03 0.95±0.05 4.0±0.10 0.95±0.05 1.30±0.05 0.95±0.05 4.0±0.10 0.95±0.05 TAI-TECH TBM01-151200553 P7. ■Material of taping is plastic Po:4±0.1 1 0. 5+ 1. : D t A P ± :1 D1 F:3.5±0.05 A Bo W:8.0±0.1 E:1.75±0.1 P2:2±0.05 Ko 1 0. Ao Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 201212 2.10±0.10 1.28±0.10 1.28±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321611 3.35±0.10 1.75±0.10 1.25±0.10 4.0±0.10 0.23±0.05 1.0±0.10 322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 SECTION A-A 7-2.2 Tape Dimension / 12mm 1.75±0.1 Po:4±0.1 P2:2.0±0.05 t D1:1.5±0.1 Bo W:12.0±0.1 5.5±0.05 D:1.5+0.1 Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 451616 4.70±0.10 1.75±0.10 1.75±0.10 4.0±0.10 0.24±0.05 1.5±0.10 453215 4.70±0.10 3.45±0.10 1.60±0.10 8.0±0.10 0.24±0.05 1.5±0.10 Ko P Ao 7-3. Packaging Quantity Chip Size 453215 451616 322513 321611 321609 201212 201209 160808 100505 060303 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions(component level) To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw TAI-TECH TBM01-151200553 P8. Impedance Frequency Characteristics(Typical) 30 20 Z 10 X 1 10 30 Z 20 X 10 40 Z 20 X R 0 100 0 1000 1 10 FREQUENCY(MHz) 100 1000 1 150 60 Z 40 R 0 1 X 20 X 100 90 Z 60 30 1 1000 X 10 100 R 0 1000 1 10 FREQUENCY(MHz) FREQUENCY(MHz) FCM2012KF-121T08 400 120 R 0 10 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 20 1000 FCM2012KF-600T09 180 80 Z 100 FREQUENCY(MHz) FCM2012KF-400T06 100 60 40 10 FREQUENCY(MHz) FCM2012KF-300T06 80 FCM2012KF-260T06 60 R R 0 FCM2012KF-170T06 40 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 40 IMPEDANCE(Ohm) FCM2012KF-110T09 FCM2012KF-151T08 400 100 1000 FREQUENCY(MHz) FCM2012KF-221T07 600 Z 100 300 IMPEDANCE(Ohm) 200 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 500 300 200 Z 100 X X R 0 1 100 1 1000 FCM2012KF-301T07 100 10 100 1000 1 X 400 200 100 1000 1 10 800 100 800 R 1000 500 X 10 100 X R 1 1000 10 FCM2012NF-070T06 IMPEDANCE(Ohm) Z 2000 1500 1000 1000 FCM2012CF-300T07 120 30 20 Z X 10 IMPEDANCE(Ohm) 40 100 FREQUENCY(MHz) FREQUENCY(MHz) FCM2012HF-202T02 2500 Z 1500 0 1 FREQUENCY(MHz) 3000 2000 0 1000 1000 FCM2012HF-152T03 3000 Z 400 X 100 2500 1200 R 10 10 FREQUENCY(MHz) IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) Z 1 1 1000 1600 400 IMPEDANCE(Ohm) 100 FCM2012HF-102T04 2000 1600 0 X R 0 FREQUENCY(MHz) FCM2012KF-102T04 1200 400 200 X FREQUENCY(MHz) 2000 Z 600 R 0 10 1000 800 Z 600 R 100 FCM2012KF-601T05 1000 IMPEDANCE(Ohm) IMPEDANCE(Ohm) IMPEDANCE(Ohm) 200 1 10 FREQUENCY(MHz) 800 Z 0 X R 0 FCM2012KF-471T07 1000 400 200 FREQUENCY(MHz) FREQUENCY(MHz) 600 Z 300 R 0 10 400 90 Z 60 30 X 500 X R 0 1 10 R 0 100 FREQUENCY(MHz) 1000 1 10 100 R 0 1000 FREQUENCY(MHz) www.tai-tech.com.tw 1 10 100 FREQUENCY(MHz) 1000 TAI-TECH TBM01-151200553 Impedance Frequency Characteristics(Typical) FCM2012CF-600T07 300 1000 120 X 60 400 Z 300 200 X R 1 10 400 200 0 100 1000 1 10 100 1 1000 1500 Z 600 300 0 1200 Z 900 600 1 1000 FCM2012CF-601T03 10 100 IMPEDANCE(Ohm) Z 1500 1000 500 10 100 FREQUENCY(MHz) Z 2000 1500 1000 500 X R R 0 1000 1 10 1 10 100 FREQUENCY(MHz) 2500 2000 1 1000 FCM2012CF-102T02 3000 0 X R 0 FREQUENCY(MHz) FREQUENCY(MHz) 2500 1000 X R 0 100 Z 1500 500 300 X R 1000 2000 IMPEDANCE(Ohm) IMPEDANCE(Ohm) 900 100 FCM2012CF-471T04 2500 1500 1200 10 10 FREQUENCY(MHz) FCM2012CF-301T04 1800 1 X R 0 FREQUENCY(MHz) FCM2012CF-221T04 1800 Z 600 R FREQUENCY(MHz) IMPEDANCE(Ohm) 800 100 0 IMPEDANCE(Ohm) IMPEDANCE(Ohm) Z IMPEDANCE(Ohm) 180 FCM2012CF-151T06 1200 500 240 IMPEDANCE(Ohm) FCM2012CF-121T06 600 X 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 1000 P9.