TMPA0605SV-8R2MN-D

TAI-TECH P1 SMD Power Inductor TMPA0605SV-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency. Halogen 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. Halogen-free 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. High reliability -Reliability test complied to AEC-Q200 8. Operating temperature -55~+155℃(Including self - temperature rise) 9. 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions Recommend PC Board Pattern C A D H E B 1R0 2019 L G Series A B C D E TMPA0605SV 7.3±0.3 6.6±0.3 4.8±0.2 1.6±0.3 3.0±0.2 Unit:mm 4. Part Numbering TMPA 0605 SV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 1R0 MN D E - L(mm) G(mm) H(mm) 8.0 3.5 3.4 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. D F BxC Standard.V:Vehicle 1R0=1.0uh K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.1R0 and 2019(20YY, 19WW,follow production date). TAI-TECH P2 5. Specification Part Number Inductance L0 A(uH) ±20% Heat Rating Current DC I rms ( A ) Saturation Current DC I sat ( A ) DCR (mΩ)Typ DCR (mΩ)Max TMPA0605SV-R47MN-D 0.47 22 22 2.9 3.3 TMPA0605SV-R68MN-D 0.68 20 20 3.6 4.1 TMPA0605SV-1R0MN-D 1.00 17 16 5.6 6.2 TMPA0605SV-1R5MN-D 1.50 15 13 6.6 7.3 TMPA0605SV-2R2MN-D 2.20 14 10 10 11.5 TMPA0605SV-3R3MN-D 3.30 13 9.5 14 16.2 TMPA0605SV-4R7MN-D 4.70 11 8.8 20.8 24 TMPA0605SV-5R6MN-D 5.60 10 8.0 28 33 TMPA0605SV-6R8MN-D 6.80 9.0 7.6 30 36 TMPA0605SV-8R2MN-D 8.20 7.5 6.5 38.5 45 TMPA0605SV-100MN-D 10.0 7.0 6.0 44 53 TMPA0605SV-150MN-D 15.0 5.0 4.0 73 85 TMPA0605SV-220MN-D 22.0 4.2 3.6 122 142 TMPA0605SV-330MN-D 33.0 3.0 2.3 142 170 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Typical Performance Curves P3