TMPA1004SV-470MN-D

TAI-TECH P1 SMD Power Inductor TMPA1004SV-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . Halogen 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. Halogen-free 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. High reliability -Reliability test complied to AEC-Q200 8. Operating temperature -55~+155℃(Including self - temperature rise) 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions C 2R2 2019 D E B A A` leadframe C Customer Recommend PC Board D Pattern 1R0 2019 H non-leadframe Series L E B A A` A A` TMPA1004SV 11.0±0.3 G B 10.0±0.3 10.0±0.3 C 3.8±0.2 D E 2.0±0.3 See spec table Unit:mm L(mm) 4. Part Numbering TMPA 1004 SV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 1R0 MN D E - G(mm) H(mm) 12.5 5.4 3.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. D F BxC Standard. V:Vehicle 1R0=1.0uH K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.1R0 and 2019(20YY,19 WW,follow production date). TAI-TECH P2 5. Specification Part Number Inductance L0 A(uH) ±20% Heat Rating Current DC I rms ( A ) Saturation Current DC I sat ( A ) DCR (mΩ)Typ DCR (mΩ)Max TMPA1004SV-R15YN-D 0.15±30% 44.0 82.0 0.5 TMPA1004SV-R22MN-D 0.22 36.0 70.0 TMPA1004SV-R36MN-D 0.36 33.0 51.0 TMPA1004SV-R47MN-D 0.47 32.0 TMPA1004SV-R56MN-D 0.56 25.0 TMPA1004SV-R68MN-D 0.68 TMPA1004SV-1R0MN-D TMPA1004SV-1R5MN-D E(mm) ±0.3 Type 0.6 3.0 non-leadframe 0.72 0.83 3.0 non-leadframe 1.05 1.18 3.0 non-leadframe 46.0 1.3 1.5 3.0 non-leadframe 34.0 1.6 1.8 2.5 non-leadframe 23.0 31.0 1.9 2.2 2.5 non-leadframe 1.00 20.0 29.0 2.9 3.25 2.5 non-leadframe 1.50 17.5 26.0 3.7 4.2 2.5 non-leadframe TMPA1004SV-1R8MN-D 1.80 16.5 23.0 5.1 5.7 3.0 leadframe TMPA1004SV-2R2MN-D 2.20 15.0 20.0 5.8 6.7 3.0 leadframe TMPA1004SV-3R3MN-D 3.30 11.0 17.5 10.5 11.8 3.0 leadframe TMPA1004SV-4R7MN-D 4.70 8.8 15.2 15.8 19 3.0 leadframe TMPA1004SV-5R6MN-D 5.60 8.0 14.1 19 22.8 3.0 leadframe TMPA1004SV-6R8MN-D 6.80 7.8 12.2 22 24.5 3.0 leadframe TMPA1004SV-8R2MN-D 8.20 7.6 9.5 25 28 3.0 leadframe TMPA1004SV-100MN-D 10.0 7.5 8.6 27 30 3.0 leadframe TMPA1004SV-150MN-D 15.0 6.25 7.0 41 45 3.0 leadframe TMPA1004SV-220MN-D 22.0 5.0 6.2 58 66 3.0 leadframe TMPA1004SV-330MN-D 33.0 4.4 5.5 84 91 3.0 leadframe TMPA1004SV-470MN-D 47.0 3.5 4.0 125 143 3.0 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Typical Performance Curves P3 TAI-TECH P4