TMPA1004S-R68MN-D

TAI-TECH SMD Power Inductor TMPA1004S-Series(N)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 18/04/17 新發行 羅宜春 梁周虎 卜文娟 備 注 TAI-TECH SMD Power Inductor TMPA1004S-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. Halogen Pb Halogen-free Pb-free 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions C 2R2 1537 D E B A A` T leadframe Pattern D 1R0 1537 H L E B Customer Recommend PC Board C A A` G T non-leadframe Series A A` B C D T E TMPA1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2 2.0±0.3 0~0.2 Inductance 2.5±0.3 0.56~1.50uH among 3.0±0.3 0.47uH and below 1.80uH and above Unit:mm 4. Part Numbering TMPA 1004 S A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 1R0 MN D E - D F BxC Standard. R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.1R0 and 1537(15 YY, 37 WW,follow production date). L(mm) G(mm) H(mm) 12.5 5.4 3.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. TAI-TECH 5. Specification Heat Rating Current DC I rms.(A) Saturation Current DC I sat. (A) Part Number Inductance L0 A(uH) ±20% Typ Max Typ Max TMPA1004S-R15YN-D 0.15±30% 44.0 38.0 82.0 75.0 TMPA1004S-R22MN-D 0.22 36.0 33.0 70.0 60.0 TMPA1004S-R36MN-D 0.36 33.0 29.0 51.0 45.0 TMPA1004S-R42MN-D 0.42 32.5 28.5 50.0 TMPA1004S-R47MN-D 0.47 32.0 28.0 46.0 TMPA1004S-R56MN-D 0.56 25.0 23.0 TMPA1004S-R68MN-D 0.68 23.0 20.0 TMPA1004S-1R0MN-D 1.00 20.0 TMPA1004S-1R5MN-D 1.50 17.5 TMPA1004S-1R8MN-D 1.80 TMPA1004S-2R0MN-D 2.00 TMPA1004S-2R2MN-D TMPA1004S-3R3MN-D DCR (mΩ)Typ DCR (mΩ)Max Type 0.5 0.6 non-leadframe 0.72 0.83 non-leadframe 1.05 1.18 non-leadframe 42.0 1.15 1.3 non-leadframe 40.0 1.3 1.5 non-leadframe 34.0 29.0 1.6 1.8 non-leadframe 31.0 28.0 1.9 2.2 non-leadframe 18.0 29.0 26.0 2.9 3.25 non-leadframe 16.0 26.0 22.0 3.7 4.2 non-leadframe 16.5 15.0 23.0 20.5 5.1 5.7 leadframe 16.0 14.5 21.0 18.0 5.3 6.1 leadframe 2.20 15.0 13.0 20.0 16.0 5.8 6.7 leadframe 3.30 11.0 10.0 17.5 14.0 10.5 11.8 leadframe TMPA1004S-4R7MN-D 4.70 8.8 8.0 15.2 13.0 15.8 19 leadframe TMPA1004S-5R6MN-D 5.60 8.0 7.2 14.1 11.5 19 22.8 leadframe TMPA1004S-6R8MN-D 6.80 7.8 6.8 12.2 11.0 22 24.5 leadframe TMPA1004S-8R2MN-D 8.20 7.6 6.5 9.5 8.5 25 28 leadframe TMPA1004S-100MN-D 10.0 7.5 6.1 8.6 7.5 27 30 leadframe TMPA1004S-150MN-D 15.0 6.25 5.0 7.0 6.0 41 45 leadframe TMPA1004S-220MN-D 22.0 5.0 4.1 6.2 5.5 58 66 leadframe TMPA1004S-330MN-D 33.0 4.4 3.5 5.5 5.0 84 91 leadframe TMPA1004S-470MN-D 47.0 3.5 3.0 4.0 3.7 125 143 leadframe TMPA1004S-680MN-D 68.0 2.6 2.4 3.2 3.0 184 210 leadframe TMPA1004S-820MN-D 82.0 2.3 2.1 3.0 2.8 240 270 leadframe TMPA1004S-101MN-D 100 2.0 1.8 2.7 2.4 270 310 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Material List 4 3 2 1 NO Items NO Items 1 Core Alloy Powder . Materials 1 Core Alloy Powder . Wire Polyester Wire or equivalent. 2 Wire Polyester Wire or equivalent. 2 3 Clip 100% Pb free solder(Ni+Sn---Plating) 3 4 Ink Halogen-free ketone 4 Materials Solder 100% Pb free solder Ink Halogen-free ketone 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1. -10~+40℃,50~60%RH (Product without taping) 2. -40~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs. Life Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs. Load Humidity Moisture Resistance Thermal shock Vibration Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5minNumber of cycles： 500 Measured at room fempraturc after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 TAI-TECH Item Performance Bending Shock Solder ability Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805:1kg ,