TMPA1265SP-220MN-D

TAI-TECH P1 SMD Power Inductor TMPA1265SP-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . Halogen 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. Halogen-free 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions A A` C E B 100 2019 D leadframe C A A` L H E R47 2019 B Recommend PC Board Pattern D non-leadframe Series A G A` B C D TMPA1265 13.5±0.5 12.6±0.3 12.6±0.2 6.2±0.3 E See Spec table 2.3±0.3 Unit:mm L(mm) 4. Part Numbering TMPA 1265 SP A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 100 MN D E - G(mm) H(mm) 14.5 8.0 5.0 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. D F BxC. Standard. 100=10uH. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.100 and 2019(20 YY, 19 WW,follow production date). TAI-TECH P2 5. Specification Part Number Inductance Heat Rating Saturation L0 A(uH) Current DC Current DC ±20% Irms ( A ) I sat ( A ) DCR (mΩ) Typ DCR (mΩ) Max E(mm) ±0.3 Type TMPA1265SP-R47MN-D 0.47 42 68 0.88 1.02 4.7 non-leadframe TMPA1265SP-R68MN-D 0.68 36.5 55 1.25 1.5 4.0 non-leadframe TMPA1265SP-1R0MN-D 1.00 33 45 1.5 1.8 4.0 non-leadframe TMPA1265SP-1R5MN-D 1.50 29 35 2.2 2.53 4.0 non-leadframe TMPA1265SP-2R2MN-D 2.20 25 28.5 3.7 4.2 4.7 leadframe TMPA1265SP-3R3MN-D 3.30 22 27 5.3 6.2 4.7 leadframe TMPA1265SP-4R7MN-D 4.70 20 25 6.8 8.0 4.7 leadframe TMPA1265SP-5R6MN-D 5.60 18 23 8.3 9.8 4.7 leadframe TMPA1265SP-6R8MN-D 6.80 16.5 21 9.8 11.3 4.7 leadframe TMPA1265SP-8R2MN-D 8.20 15 19 12 13.8 4.7 leadframe TMPA1265SP-100MN-D 10.0 13 17 13 15.8 4.7 leadframe TMPA1265SP-150MN-D 15.0 11 13.5 22 26 4.7 leadframe TMPA1265SP-220MN-D 22.0 10 10 31 35 4.7 leadframe TMPA1265SP-330MN-D 33.0 9.0 9.0 46 55 4.7 leadframe TMPA1265SP-470MN-D 47.0 8.0 7.6 58 67 4.7 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Typical Performance Curves P3