FP1208R1-R21-R

Technical Data 10148 Effective June 2017 Supersedes August 2013 FP1208 High frequency, high current power inductors Applications • • • • • • • Multi-phase regulators Voltage Regulator Modules (VRMs) Desktop and server VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules DCR Sensing circuits Environmental data Product features • • • • • • 12.1x8.0x8.0mm maximum surface mount package Ferrite core material Controlled DCR for sensing circuits Inductance range from 150nH to 250nH Current range from 44 to 85 Amps Halogen free, lead free, RoHS compliant • • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 10148 Effective June 2017 Product Specifications Part Number 8 FP1208R1-R15-R FP1208R1-R18-R FP1208R1-R21-R FP1208R1-R23-R FP1208R1-R25-R OCL 1 (nH)±10% 150 180 210 230 250 FLL min. (nH) 114 137 160 176 191 2 Irms 3 (Amps) 50 Isat 1 4 (Amps) 85 72 65 61 55 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc@25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ 25°C Isat 2 5 (Amps) 79 66 57 53 48 Isat 3 6 (Amps) 72 63 55 50 44 DCR (mΩ) @ 20°C 0.29±5% K-factor 283 283 283 283 283 5. Isat2: Peak current for approximately 20% rolloff @ 85°C 6. Isat3: Peak current for approximately 20% rolloff @ 125°C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps). 8. Part Number Definition: FP1208Rx-Rxx-R: - FP1208= Product code and size - Rx= DCR indicator - Rxx= Inductance value in µH - “-R” suffix = RoHS compliant Dimensions- mm DCR measured from point “a” to point “b” Part marking: 1208Rx (Rx= DCR indicator), Rxx = Inductance value in uH (R= decimal point) wwllyy= date code, r= revision level Tolerances are +/- 0.15 millimeters unless stated otherwise. PCB tolerances are +/- 0.10 millimeters unless stated otherwise. All soldering surfaces to be be coplanar within 0.1 millimeters. Packaging information - mm Supplied in tape and reel packaging, 500 parts on a 13” diameter 2 www.eaton.com/electronics reel. 7 FP1208 High frequency, high current power inductor Technical Data 10148 Effective June 2017 Temperature rise vs total loss 50 Temperature Rise (°C) 40 30 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Total Loss (W) Core loss vs Bp-p 10 Core Loss (W) 1 0.1 0.01 0.001 100 1000 10000 Bp-p (Gauss) Inductance characteristics % of OCL vs % of I sat 1 100% % of OCL 80% -40°C 60% +25°C 40% +85°C 20% 0% +125°C 0% 20% 40% 60% 80% 100% 120% 140% % of I sat 1 www.eaton.com/electronics 3 FP1208 High frequency, high current power inductor Technical Data 10148 Effective June 2017 Solder Reflow Profile TP TC -5°C Temperature TL 25°C Preheat A T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10148 BU-SB13927 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.