X1002WVS-02E-LPS

Doc. No. X-A0162-09 Page No. 1/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen XKB Connectivity Product Specification Title：1.00mm Pitch X1002-E Series Connector 1. SCOPE（适用范围） This specification covers the performance, tests and quality requirements for the1.00mm series wire to board connector. （XKB Connectivity 本规范涵盖了盖1.00mm系列线对板连接器性能、测试和质量要求） 2. PRODUCT DESCRIPTION（ 产品描述） DESCRIPTION（描述） Part Number（料号） Terminal 端子 X1002T-PSN-E Housing 胶壳 X1002H-XXE-XXXX X1002WRS-XXE-XXXXXX Wafer 针座 X1002WVS-XXE-XXXXXX 3. APPLICABLE DOCUMENT （适用文件） The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence.（XKB Connectivity 下列文件构成本规范的一部分，在此规定的范围内。本规范要求与产品图纸有冲突时，以产品图 纸为准。如果本规范的要求与参考文件发生冲突，应以本规范为准。） 4. REQUIREMENTS （要求） 4.1. Design and Structure （设计和结构） Product shall be of the design, structure and physical dimensions specified on the applicable product drawing.（XKB Connectivity 产品的设计、结构和物理尺寸参考所适用的产品图纸） 4.2. Materials/ Finish (材料/表面处理) Specification 规格内容 Materials 材质 Terminal 端子 Phosphor Bronze 磷铜 Disposal of Surface 表面处理 Tin Plated: Over 70μ. Nickel: Over 30μ〞 XKB Connectivity Product Specification Doc. No. X-A0162-09 Page No. 2/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Title：1.00mm Pitch X1002-E Series Connector Housing胶壳 PA66 UL 94V-2/UL94V-0 UL 94V-2/UL94V-0 Wafe Base LCP 针座 PIN Brass 黄铜 Over Tin 70μ〞Plated ; Over 30μ〞Nickel Please Refer to the Project drawing for the above Specification. (上述参数请以工程图为准) 4.3. Ratings （额定功率） XKB Connectivity Item（项目） Standard（标准） Rated Voltage (Maximum) 额定电压 125V Rated Current (Maximum) 额定电流 1A Ambient temperature Range 使用温度范围 Applicable wire insulation O.D 适用线径 AC/DC -25℃～+85℃ From -25 to +85 degree centigrade AWG 28#~32# Insulation O.D. 0.80mm(Max.) NOTE备注 : Including terminal temperature rise 升温时含端子 5. TEST STANDARD （测试条件） 5.1 Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows （除另有说明外，用以进行测量和测试的标准 环境条件范围如下） Ambient temperature（环境温度）: 5℃ to 35℃ Normal humidity （正常湿度）: 45% to 85% Air pressure （气压）: 86Kpa to 106Kpa 5.2 However if doubt arises on the decision based on the measured Values under the above-mentioned Conditions.The following conditions shall be employed: （但是在对判定产生疑问时,按下述状态实施） Temperature （温度）：20±2℃ Relative humidity （相对湿度）：65±5% Air pressure （气压）: 86Kpa to 106Kpa 8. PERFORMANCE AND TEST DESCRIPTION （性能和测试类型） 8.1 APPEARANCE （外观） ITEM DESCRIPTION（类型） TEST CONDITION（测试条件） REQUIREMENT（要求） XKB Connectivity Product Specification Doc. No. X-A0162-09 Page No. 3/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Title：1.00mm Pitch X1002-E Series Connector 1 Appearance （外观） Visual.（目视） Should not have any flaw Scratch discoloration and crushed（无任何裂痕、刮伤 、污染和变形） 8.2 ELECTRICAL （电气） ITEM DESCRIPTION（类型） TEST CONDITION （测试条件） REQUIREMENT（要求） Based upon EIA-364-06A. 1 2 contact resistance （接触阻抗） Insulation Resistance （绝缘阻抗） 3 Dielectric strength (耐电压) 4 Contact resistance on crimped portion（铆线后端子接 触阻抗） Mate connectors, measure by dry circuit, 20mV MAX, 10mA.（公母配合,开放电压 20mV 以下,电流 10mA 检测连接器 A~B 区） Based upon EIA-364-21B/MIL-STD-202 Method 302 Cond. B Mate connectors, apply 500V DC between adjacent terminal or ground. Initial（初始）: 10 milliohms Max. After Test（测试后）: 20 milliohms Max. 1000 M min. (公母配合, 在相邻端子, 端子与地片之间, 使用500V 的直流电,检测连接器） Based upon EIA-364-20A/MIL-STD-202 Method 301 Mate connectors, apply 1000V AC for 1 minute between adjacent terminal or ground.（公母配合, 在相邻端子, 端子与地片之间, 使用1000V 的交流电 1 分锺,检测连接器) Crimp the applicable wire on to the terminal measure by dry circuit 20mV MAX, 10mA.（铆线后之端子,开放电压 20mV 以下,电流 10mA检测连接器） There shall be no breakdown. (无击穿、闪烁现象) 10 milliohms 8.3 MECHANICAL （机械） ITEM DESCRIPTION（类型） TEST CONDITION （测试条件） REQUIREMENT（要求） XKB Connectivity Product Specification Doc. No. X-A0162-09 Page No. 4/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Title：1.00mm Pitch X1002-E Series Connector 1 Insert and withdraw Connectors at the speed rate of 25.4±3mm/minute.（以每分锺 25.4±3mm Insertion & Retention 的速率插入和拔出） Force （插拔力） 2 Terminal/ Housing Retention Force （端子保持力） 3 Terminal Insertion Force （端子插入力） Refer to paragraph 6 参照第 10 项 Apply axial pull out force at the speed rate of 25.4±3mm/minute on the terminal assembled in the housing. （以每分 25.4±3mm 的速率, 将端子从 Housing 内轴向拔出的力量.） 24.5N {2.5kgf}Min. Insert the crimped terminal into the housing. （铆线后之端子插入Housing 所需最大力量） 14.7N {1.5kgf} Max. Apply axial push force at the speed rate of 25.4±3mm/minute. (以每分 25.4±3mm 的速率,将 PIN 4 PIN Retention Force （PIN针保持力） 针从Wafer 内轴向拔出的力量 ） Fix the crimped terminal, apply axial pull out force on the wire. (Do not 5 Tensile strength (Crimped connections)（端子压 着强度） crimp insulation part). 13.7N {1.4kgf} min. AWG Spec. kgf. Min. #20 #22 #24 6.0 4.0 2.0 （固定铆线后的端子，使电线与端子分离时 所需的最小力量） Note> As for unspecified wire sizes in this specification define values with clients 6 Repeated Insertion/ Withdrawal （重复插拔） When mated up to 30 cycles repeatedly by the rate of 10 cycles per minute. （以每分锺不超过 10 次的速率,将公母插拔30 次.） Contact Resistance（接触阻抗）：2 0 milliohms Max. XKB Connectivity Product Specification Doc. No. X-A0162-09 Page No. 5/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Title：1.00mm Pitch X1002-E Series Connector Based upon EIA-364-28B/MIL-STD202 Method 213B Cond.A Amplitude （振幅）: 1.5mm P-P 7 Vibration （耐振动性） Sweep time（频率）: 10~55~10 HZ in 1 minute Duration（持续时间）: 2 hours in each X.Y.Z axials.（每轴向 2 小时） Based upon EIA-364-27B/MIL-STD202 8 Shock (耐冲击性) Method 213B Cond.A Pulse width（冲击时间）: 11 msec., Waveform（波形） : half sine, 490m/s2{50G}, 3 strokes in each X.Y.Z. axes. （加速度最大50G，沿3个互相垂直达的方向） Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. Discontinuity瞬断:1 micro- second Max. Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. Discontinuity瞬断:1 micro- second Max. 8.4 ENVIRONMENTAL (环境) ITEM DESCRIPTION（类型） 1 Temperature Rise（温升测试） 2 3 Heat Resistance （耐热性） Cold Resistance （耐寒性） TEST CONDITION（测试条件） Carrying rated current load. (UL 1977)（公母对插后,在通过额定电流下, 所测定的温度） Based upon MIL-STD-202 Method 108A Cond.A 85±2℃,96 hours. Based upon EIA-364-105 -25±5℃,96 hours. REQUIREMENT（要求） 30℃ Max. Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. XKB Connectivity Doc. No. X-A0162-09 Page No. 6/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Product Specification Title：1.00mm Pitch X1002-E Series Connector 4 Humidity （ 耐湿性） Based upon EIA-364-31A/MIL-STD202 Method 103B Cond.B Temperature（温度）: 40±2℃ Relative Humidity（湿度）: 90~95% Duration（持续时间）: 96 hours Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. Insulation Resistance 绝缘阻抗：1000 M min. Based upon EIA-364-32B 5 cycles of: 5 Temperature Cycling （温度变化） a) -55℃ 30 minutes. b) +85℃ 30 minutes. Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. (从-55℃持续 30 分锺升至+85℃持续 30 分锺,循环 5 次) 6 Salt Spray （盐水喷雾） 7 Solder-ability （焊锡附着性） 8 Solder- Resistance （焊锡耐热性） Based upon EIA-364-26A/MIL-STD202 Method 101D Cond.B 24±1 hours exposure to a salt spray from the 5±1% solution at 35±2℃. （在温度 35±2℃,盐水浓度 5±1%下,盐水喷雾24±1 小时） 注：此项测试只针对先冲后镀端 Appearance外观： No Damage无异状 Contact Resistance接触阻抗:20 milliohms Max. Based upon EIA-364-52 Soldering Time焊接时间: 3±0.5second. Solder Temperature焊接温度: 245±5℃. Immersed area must show no voids, pin holes. 浸渍面积需95%以上 Based upon EIA-364-56A Appearance外观： No Damage无异状 Soldering time焊接时间:3~5 sec Solder Temperature焊接温度:250±5℃. XKB Connectivity Product Specification Doc. No. X-A0162-09 Page No. 7/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Title：1.00mm Pitch X1002-E Series Connector 9. PACKAGING 包装 Please refer to the packing drawing. 请参考产品包装图纸 参考附件 10. INSERTION/WITHDRAWAL FORCE 综合插入力及拔出力: 参考附件 11. SOLDERING 焊接： 11.1. Wave soldering（波峰焊）: DIP Suggestions solder temperature at 260℃(500°F) max.5 seconds . DIP型推荐焊接焊锡温度为260℃（500°F) 最多5秒 11.2. Hand soldering（手焊）: Use a soldering iron of 30 watts controlled at 350℃ approximately 5 seconds. while applying solder. 使用30W烙铁控制温度在350℃,焊接时长约5秒 XKB Connectivity Product Specification Doc. No. X-A0162-09 Page No. 8/9 Date Issued 2020-04-06 Prepared by Josephine Date revised 2020-11-23 checked by Jay Rev. No. 01 Approved by Mei Chen Title：1.00mm Pitch X1002-E Series Connector 11.3. Reflow soldering profile（回炉焊）:When the maximum temperature of the reflow furnace is 260 °C and the temperature is 260 °c. 10 seconds MAX. (reference) SMT型回焊炉最高温度为260℃，温度为260℃时，最长时间不超过10秒（如图） Rev. Description Date revised Created/ Revised by 01 New Release 2021/05/20 Josephine Lin