BAS70WS

BAS70WS-HAF Small Signal Schottky Barrier Diode PINNING DESCRIPTION PIN Features • Low forward voltage drop • Halogen and Antimony Free(HAF), RoHS compliant 1 Cathode 2 Anode 2 1 Top View Simplified outline SOD-323 and symbol Absolute Maximum Ratings (Ta = 25℃) Parameter Symbol Value Unit Repetitive Peak Reverse Voltage VRRM 70 V Average Rectified Forward Current IF(AV) 70 mA Surge Non-Repetitive Forward Current (tp = 10 ms) IFSM 1 A Total Power Dissipation Ptot 230 mW Junction Temperature TJ 150 ℃ Storage Temperature Range Tstg - 65 to + 150 ℃ Symbol Value Unit RθJA 550 ℃/W Thermal Characteristics Parameter Typical Thermal Resistance from Junction to Ambient 1) 1) Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. Characteristics at Ta = 25℃ Parameter Reverse Breakdown Voltage at IR = 10 μA Forward Voltage at IF = 1 mA Reverse Current at VR = 50 V Diode Capacitance at VR = 0 V, f = 1 MHz 1/3 Symbol Min. Max. Unit V(BR)R 70 - V VF - 410 mV IR - 100 nA Ctot - 2 pF ® Dated : 03/02/2023 Rev : 03 BAS70WS-HAF Electrical Characteristic Curves Fig 1. Reverse Characteristic Curve Reverse Current (µA) Forward Current (mA) Fig 2. Forward Characteristic Curve Reverse Voltage (V) Forward Voltage (V) Fig 3. Junction Capacitance Junction Capacitance (pF) Average Rectified Current (mA) Fig 4. Average Rectified Current Derating Curve 100 80 60 40 20 0 0 25 50 75 100 125 150 Ambient Temperature (℃) Reverse Voltage (V) 2/3 ® Dated : 03/02/2023 Rev : 03 BAS70WS-HAF PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-323 A c HE A D E bp UNIT A bp C D E HE mm 1.10 0.80 0.40 0.25 0.15 0.10 1.80 1.60 1.35 1.15 2.80 2.30 Recommended Soldering Footprint Packing information Package SOD-323 Tape Width (mm) 8 Pitch Reel Size Per Reel Packing Quantity mm inch mm inch 4 ± 0.1 0.157 ± 0.004 178 7 3,000 Marking information " SX " = Part No. " III " = Cathode line " • " = HAF (Halogen and Antimony Free) Font type: Arial . SX 3/3 ® Dated : 03/02/2023 Rev : 03