SFH 4771

www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4771   SFH 4771 SYNIOS ® P2720 IR SYNIOS P2720 (850 nm) - 120° Applications ——Access Control (IRIS/Vein Scan, Face Recognition) ——Electronic Equipment ——Eye Tracking ——Safety and Security, CCTV Features: ——Package: clear silicone ——Corrosion Robustness Class: 3B ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——IR lightsource with high efficiency ——Centroid wavelength 850 nm Ordering Information  Type  Total radiant flux 1) IF = 1000 mA; tp = 10 ms Φe 400 ... 800 mW Discontinued SFH 4771 1 Version 1.1 | 2019-07-16 Total radiant flux 1) typ. IF = 1000 mA; tp = 10 ms Φe 660 mW Ordering Code Q65112A1148 SFH 4771   Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Junction temperature Tj max. 145 °C Forward current IF max. 1000 mA Surge current D ≤ 1  IFSM max. 1A Reverse voltage 2) VR max. 12 V Power consumption Ptot max. 2.3 W ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV For the forward current and power consumption please see “maximum permissible forward current” diagram. Discontinued  2 Version 1.1 | 2019-07-16 Values SFH 4771   Characteristics IF = 1000 mA; tp = 10 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 860 nm Centroid wavelength λcentroid typ. 850 nm Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 34 nm Half angle φ typ. 60 ° Dimensions of active chip area LxW typ. 0.75 x 0.75 mm x mm Rise time (10% / 90%) IF = 1000 mA; RL = 50 Ω tr typ. 11 ns Fall time (10% / 90%) IF = 1000 mA; RL = 50 Ω tf typ. 15 ns Forward voltage VF typ. max. 1.75 V 2.3 V Reverse current 2) VR = 5 V IR typ. max. 0.01 µA 10 µA Radiant intensity IF = 1000 mA; tp = 10 ms Ie typ. 210 mW/sr Temperature coefficient of voltage TCV typ. -1 mV / K Temperature coefficient of brightness TCI typ. -0.3 % / K Temperature coefficient of wavelength TCλ typ. 0.3 nm / K Thermal resistance junction solder point real 3) RthJS typ. max. Discontinued  3 Version 1.1 | 2019-07-16 Values 11 K / W 16 K / W SFH 4771   Brightness Groups  IF = 1000 mA; tp = 10 ms Group Total radiant flux 1) IF = 1000 mA; tp = 10 ms min. Φe Total radiant flux 1) IF = 1000 mA; tp = 10 ms max. Φe DA 400 mW 630 mW DB 500 mW 800 mW Relative Spectral Emission 4), 5) Ie,rel = f (λ); IF = 1000 mA; tp = 10 ms OHF04132 100 I rel %  80 60 40 20 Discontinued 0 700 750 800 850 nm 950 λ 4 Version 1.1 | 2019-07-16 SFH 4771   Radiation Characteristics 4), 5) Irel = f (ϕ); TA = 25 °C 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 Forward current 0.8 0.6 OHF05620 100 A 5 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Relative Total Radiant Flux 4), 5) IF = f (VF); single pulse; tp = 100 µs IF 0.4 4), 5) Φe/Φe(1000mA) = f (IF); single pulse; tp = 100 µs OHF05626 100 Φe Φe (1 A)  10-1 5 10 -1 5 10-2 5 Discontinued 10-2 1 1.2 1.4 1.6 1.8 V 2 VF 5 Version 1.1 | 2019-07-16 10-3 -2 10 5 10-1 5 A 10 0 IF SFH 4771   Max. Permissible Forward Current IF,max = f (TS); Rthjs = 16K / Wsingle pulse [ ] 1000 800 600 400 200 0 0 20 40 60 Discontinued  6 Version 1.1 | 2019-07-16 80 100 120 [ ] SFH 4771   Dimensional Drawing 6) Further Information Approximate Weight: 12.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) Discontinued  7 Version 1.1 | 2019-07-16 SFH 4771   Recommended Solder Pad Discontinued  8 Version 1.1 | 2019-07-16 6) SFH 4771   Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature  60 2 3 100 120 2 3 K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 Time 25 °C to TP Discontinued Unit All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version 1.1 | 2019-07-16 °C 480 s K/s s SFH 4771   Taping 6) Discontinued  10 Version 1.1 | 2019-07-16 SFH 4771   Tape and Reel 7) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel Dimensions A 180 mm W Nmin 8 + 0.3 / - 0.1 mm Discontinued  11 Version 1.1 | 2019-07-16 W1 60 mm W2 max 8.4 + 2 mm 14.4 mm Pieces per PU SFH 4771   Barcode-Product-Label (BPL) Dry Packing Process and Materials 6) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Discontinued Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 12 Version 1.1 | 2019-07-16 SFH 4771   Schematic Transportation Box 6) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 200 ± 5 mm 195 ± 5 mm Discontinued  13 Version 1.1 | 2019-07-16 M Y DE -1 +Q -1 R 18 P OHA02044 Dimensions of Transportation Box Width RO UP : M RA OS PR O D 5 14 2 110 0 G 4 01 4 C: D/ (9 D) 20 00 (Q )Q TY : O TC P) (6 T LO (1 T) O D PR D EM Y 18 R -1 : Q + P -1 G R O U P: u L lt S iT Y O T6 P 7 L 6 M 14 4 (G ) E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R ditio 0 C R 07 PA 7 na RT l TE C KV XT AR Muster A o M n O d u p cto to rs R 34 ic N O : O S H 12 G BA TC H (1 T) LO T N O :1 (6 P) 23 em 8 2199 2100 5 14 2 110 0 (X ) O M O PT O M 998 NO : CThISTU SE S 21 2100 BA _ < s ur s ). Ho ururs s de Ho co 72 Ho ur te 48 e Ho 24 6 da 40 be tim e e ˚C or th r pr < ll tim ct ). 23 oo r wi nt tim e at l wi fa r Fl oo tim s at at le ˚C at e. ica l Fl th oo r th va ur nt Fl oo s ui be on if: read w ed l 4 5 Fl la m ide ce eq lo g, oc ve l vi is in en de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo ba Le ve tu re m % ba e al e Le r en re e ed re 10 ois stu ur e tim se fo al op se fo > , M oi r se st ur 3 is is ha se M oi st nk be k, oo . 03 rd g M oi in an in Fl RH g, r-p bla DM ba Ca po If bl th % kinr life is (if . ar ST f p. wi 10 ba to et Jel r th va Ye ar ks s m _ < cat m d, C ed 1 Ye ee ur ire Sh te w, te di at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re qu JE 2. bo ity is M or tim e e 16 re C/ : es id 2b r a) St tim mor is IP ed oo r tim e vic b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l e Le Ba te ur e Le ve Le Da oist stur e ur e M oi st ur M oi st M oi H 12 34 . RH 0% /6 ˚C : L e el selab . , H) nk de co (R bla r S S em R ic AM o n O d u p ct to o H rs NO If 23 G E V E ba ity id m hu e e d tiv re ag NO :1 L la re fra ck 30 Nns IVE RS in pa % k of ai IT TO to 90 ea d ntNS < ns UC or TIO te (p d , g itio ND U g coSE an bjec ˚C sin nd O 5 ˚C su es Ais baRE co IC ± y M oc (G ) M u L lt S iT Y O T6 P 7 L 6 E D Muster Bi Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: Barcode label Height 30 ± 5 mm SFH 4771   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes Discontinued  14 Version 1.1 | 2019-07-16 SFH 4771   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer. Discontinued  15 Version 1.1 | 2019-07-16 SFH 4771   Glossary 1) Total radiant flux: Measured with integrating sphere. 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 4) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 5) Testing temperature: TA = 25°C (unless otherwise specified) 6) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 7) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. Discontinued  16 Version 1.1 | 2019-07-16 SFH 4771   Revision History Version Date Change 1.0 2019-01-23 Initial Version 1.1 2019-07-15 Discontinued Discontinued  17 Version 1.1 | 2019-07-16 SFH 4771   Discontinued  Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 18 Version 1.1 | 2019-07-16