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CP30C1160005N

CP30C1160005N

  • 厂商:

    SEMICONDUCTORCIRCUITS(半导体电路)

  • 封装:

    DIP6 模块

  • 描述:

    DC DC CONVERTER 5V 30W

  • 数据手册
  • 价格&库存
CP30C1160005N 数据手册
Technical Datasheet CP30_1160005 Cool Power Technologies 30W Isolated DC/DC Converter Features • • • • • • • • • • • • • • • • • • • Wide input voltage range: 4.5 – 9Vin High Efficiency – 88.5% typical @ Full Load Output: 5 V at 6 A, 30W max Tiny 0.94” X 0.94” x 0.35” max ht (Thru-hole) 0.94” X 0.94” x 0.396” Surface Mount 1” x 1” x 0.41” Encapsulated Product RoHS 3 Directive 2015/863/EU No minimum load/capacitance required Withstands 15V input transients Fixed-frequency operation Meets UL94, V-0 flammability rating Full protection (OTP, OCP, OVP, UVLO w/auto-restart) Remote ON/OFF - positive or negative enable logic options Output voltage trim range: ±10% (industry-standard trim equations) Weight: 0.266 oz [7.54 g] (open frame), 0.67 oz [19g] (encapsulated) 2250VDC isolation (open frame), 1600VDC (encapsulated) Complies with UL/CSA60950-1, TUV per IEC/EN60950-1, 2nd edition Compliant to REACH (EC) No 1907/2006, 205 SVHC update Designed to meet Class B conducted emissions per FCC and EN55032 when used with external filter (see EMC Compliance section below.) Description The “Cool Power Technologies” CP30_1160005 DC-DC converter is an open frame isolated 1” X 1” DCDC module that conforms to industry standard pinout and trim equations. The converter operates over an input voltage range of 4.5 to 9 VDC, and provides a tightly regulated output voltage with an output current rating of 6 A. The standard feature set includes remote On/Off (positive or negative enable), input undervoltage lockout, output overvoltage protection, overcurrent and short circuit protections, output voltage trim and overtemperature shutdown with hysteresis. The high efficiency of the CP30_1160005 allows operation over a wide ambient temperature range with minimal derating. www.dcdc.com 603-893-2330 - 1- 1- Technical Datasheet CP30_1160005 TABLE OF CONTENTS SECTION PAGE FEATURES & DESCRIPTION APPLICATION DIAGRAM ELECTRICAL SPECIFICATIONS CHARACTERISTIC PERFORMANCE CURVES CHARACTERISTIC WAVEFORMS 1 2 3 6 7 APPLICATION NOTES • RIPPLE MEASUREMENTS TEST SET-UP • OUTPUT VOLTAGE TRIM EQUATIONS • THERMAL DERATING • EMC COMPLIANCE MECHANICAL OUTLINE & PCB FOOTPRINT 9 9 10 11 13 14 ORDERING INFORMATION 16 APPLICATION DIAGRAM www.dcdc.com 603-893-2330 - 2- 2- Technical Datasheet CP30_1160005 ELECTRICAL SPECIFICATIONS 4.5–9Vin, 5V/6Aout Conditions: TA = 25 ºC, Airflow = 300 LFM, Vin = 5 VDC, Cin = 220 µF, unless otherwise specified. Input Characteristics Parameter Conditions Min Typ Max Unit Operating Input Voltage Range 4.5 5 9 VDC Input Under-Voltage Lock-out Turn-on Threshold Turn-off Threshold 4.3 3.3 4.4 3.5 4.5 3.7 VDC Input Voltage Transient 100ms 15 VDC Maximum Input Current VIN = 4.5VDC; Iout = 6A 8 A Input Standby Current Converter Disabled 5 20 mA Input No-Load Current Converter Enabled 160 240 mA RMS 100 200 mA Input Reflected Ripple Current 5Hz to 50MHz See Fig 14 for setup 50 100 mAPK-PK Input Voltage Ripple Rejection 120Hz 50 Short Circuit Input Current dB All - 0.1 1 A2/s Conditions Min Typ Max Unit 4.925 5.00 5.075 VDC 6 A 8 10 A Inrush Current Output Characteristics Parameter Output Voltage Set point Output Current 0 Output Current Limit Inception 6.5 Peak Short-Circuit Current 10mΩ Short 11 18 A RMS Short-Circuit Current 10mΩ Short 1.1 1.5 ARMS 4700 uF 40 75 mVPK-PK ±0.02 ±0.04 ±0.1 ±0.1 5.15 %Vo %Vo V External Load Capacitance Output Ripple and Noise 20 MHz bandwidth Output Regulation Line: Load: Overall Output Regulation: 0 1 uF Ceramic + 10uF Tantalum See Fig 15 for setup Over line, load & temp. 4.85 www.dcdc.com 603-893-2330 - 3- 3- Technical Datasheet CP30_1160005 ELECTRICAL SPECIFICATIONS (continued) 4.5–9Vin, 5V/6Aout Conditions: TA = 25 ºC, Airflow = 300 LFM, Vin = 5 VDC, Cin = 220 µF, unless otherwise specified. Absolute Maximum Ratings Parameter Input Voltage Operating Temperature Tref , see Thermal Derating section Conditions Min Continuous Operation Max Unit 0 9 VDC Open Frame -40 +123 Encapsulated Module -40 +105 °C -55 +125 °C Max Unit Storage Temperature Typ Feature Characteristics Parameter Conditions Min Switching Frequency 410 Output Voltage Trim Range Output Over-voltage Protection Over-temperature Protection Peak Backdrive Output Current during startup into prebiased output Backdrive Output Current in OFF state Power On to Output Turn-ON Time Enable to Output Turn-ON Time Output Enable ON/OFF Negative Enable Converter ON Converter OFF Positive Enable Converter ON Converter OFF Enable Pin Current Source/Sink Output Voltage Overshoot @ Startup Auto-Restart Period Typ -10 Non-latching 115 130 kHz +10 % 140 % Avg. PCB temp, non-latching 135 Sinking current from external voltage source equal to VOUT – 0.6V and connected to the output via 1Ω resistor. COUT=220µF, Aluminum 350 500 mA Converter disabled 0 5 mA VOUT = 0.9*VOUT_NOM 10 20 mS VOUT = 0.9*VOUT_NOM 10 20 mS -0.7 2.4 0.8 15 VDC VDC 2.4 -0.7 0.25 20 1.2 1 VDC VDC mA 0 2 %Vo All voltages are WRT –Vin. Converter has internal pull-up voltage, thus positive enable is normally on, negative normally off. (OVP, OCP) 100 °C ms www.dcdc.com 603-893-2330 - 4- 4- Technical Datasheet CP30_1160005 ELECTRICAL SPECIFICATIONS (continued) 4.5–9Vin, 5V/6Aout Conditions: Ta = 25 ºC, Airflow = 300 LFM, Vin = 5 VDC, Cin = 220 µF, unless otherwise specified. Efficiency Parameter Conditions Full Load Vin = 5Vin 50% Load Min Typ Max Unit 87.5 88.5 % 88 90 % Min Typ Max Unit 40 100 mV Dynamic Response Parameter Load Change 25%-50% or 50%– 75% of Iout Max, di/dt = 0.1 A/µs Conditions Cout = 1 µF ceramic + 10 µF tantalum See Fig 15 Settling Time to 1% of Vout Load Change 25%-75% or 75%– 25% of Iout Max, di/dt = 0.2 A/µs 50 Cout = 1 µF ceramic + 2000 µF Oscon µS 30 Settling Time to 1% of Vout 50 mV 50 µS 1000 pF Isolation Specifications Isolation Capacitance 10 MΩ Open Frame 2250 VDC Encapsulated 1600 VDC Isolation Resistance Isolation Voltage – Input to Output Reliability Per Telcordia SR-332, Issue 2: Method I, Case 3 (IO=80% of IO_max, TA=40°C, airflow = 200 lfm, 90% confidence) MTFB 4,399,181 Hours FITs (failures in 109 hours) 227 /109 Hours Notes: www.dcdc.com 603-893-2330 - 5- 5- Technical Datasheet CP30_1160005 CHARACTERISTIC CURVES: 5 95% 90% Power Dissipation (W) Efficiency 85% 80% 75% 70% Vin=4.5V 65% Vin=5V 60% Vin=7V 55% Vin=9V 3 2 Vin=4.5V Vin=5V 1 Vin=7V Vin=9V 50% 0 0.6 1.2 1.8 2.4 3 3.6 4.2 Output Current (A) 4.8 5.4 6 0.6 Figure 1. Efficiency vs Output Current, 300lfm airflow, 25°C ambient. 6 6 5 5 N/C ~40LFM (0.2 m/s) 4 100 LFM (0.5 m/s) 3 1.2 1.8 2.4 3 3.6 4.2 Output Current (A) 4.8 5.4 6 Figure 2. Power Dissipation vs. Load Current, 300lfm airflow, 25°C ambient. Output Current (A) Output Current (A) 4 200 LFM (1.0 m/s) 2 1 N/C ~40LFM (0.2 m/s) 4 100 LFM (0.5 m/s) 3 200 LFM (1.0 m/s) 2 1 0 0 25 40 55 70 85 25 40 55 70 85 Ambient Temperature (°C) Ambient Temperature (°C) Figure 3. Output Current Derating vs Ambient Temperature & Airflow (converter mounted vertically with air flowing from Vin to Vout, Vin = 5 V.) Figure 4. Output Current Derating vs Ambient Temperature & Airflow (converter mounted vertically Vin = 5 V - Encapsulated module) Figure 5. Thermal Image of CP30B1160005 Full load, 55C Ambient, 100LFM airflow Tmax = 123C www.dcdc.com 603-893-2330 - 6- 6- Technical Datasheet CP30_1160005 CHARACTERISTIC WAVEFORMS: Figure 6. Input Reflected Ripple Current (100mA/div), time scale – 1uS/div. Vin=Vin_nom, full load (see Fig 14) Figure 7. Output Voltage Ripple (20mV/div), time scale – 1uS/div. Vin=Vin_nom, full load Cout=1.0uF ceramic + 10uF Tantalum (see Fig 15) Figure 8. Startup Waveform via Enable (Neg ENBL), time scale 10mS/div. Vin=Vin_nom, Iout=no load Cout=0, Ch1=Vout (2V/div), Ch2=enable (10V/div) Figure 9. Startup Waveform via Input Voltage, time scale 10mS/div. Vin=Vin_nom, Iout=full load Cout=2200uF, Ch1=Vout (2V/div), Ch2=Vin (5V/div) Figure 10. Startup Waveform via Enable (Neg ENBL), time scale 4mS/div. Vin=Vin_nom, Iout=no load Cout=2200uF, Ch1=Vout (2V/div), Ch2=enable (10V/div) Figure 11. Load Transient Response (50mV/div), di/dt=0.1A/uS, 50%-75%-50% of full load, Cout=Fig15 time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div) www.dcdc.com 603-893-2330 - 7- 7- Technical Datasheet CP30_1160005 Figure 12. Load Transient Response (50mV/div), di/dt=0.1A/uS, 25% - 50% - 25% of full load, Cout=Fig15 time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div) Figure 13. Load Load Transient Response 50mV/div), di/dt=0.2A/uS, 25% - 75% - 25% of full load +2200uF time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div) www.dcdc.com 603-893-2330 - 8- 8- Technical Datasheet CP30_1160005 Application Notes INPUT REFLECTED RIPPLE TEST SETUP: TO OSCILLOSCOPE Current Probe Vin(+) Lsource: 1 uH DC Source Csource: 1000 uF ESR < 0.03 OHM @ 20 ºC, 100 kHz 220 uF ESR < 0.1 OHM Vin(-) Note: Measure input reflected-ripple current with a simulated source inductance (LSOURCE) of 1 uH. Capacitor CSOURCE offsets possible source impedance. Figure 14. Input Reflected-ripple Current Test Setup. OUTPUT RIPPLE TEST SETUP: COPPER STRIP Vout(+) 1.0 uF 10 uF SCOPE RESISTIVE LOAD Vout(-) Use a 1.0µF X7R ceramic capacitor and 10µF @35V low ESR tantalum capacitor. Scope measurement made using a BNC socket. Position the load 3 in. [76mm] from module. Figure 15. Peak-to-Peak Output Noise Measurement Test Setup. www.dcdc.com 603-893-2330 - 9- 9- Technical Datasheet CP30_1160005 Application Notes (cont) OUTPUT VOLTAGE TRIM: Output voltage adjustment is accomplished by connecting an external resistor between the Trim Pin and either the +Vout or –Vout pins. • TRIM UP EQUATION: Rtrim_up ( Ω ) 12750 − 2050 Vdes − 5 Where Rtrim_up is the resistance value in ohms and Vdes is the desired output voltage. E.g. to trim the output up 10%, R trim_up Enable 12750 − 2050 ⋅ Ω 5.5 − 5 or Rtrim_up = 23.45 kOhm. -Vout Rtrim_up -Vin Rload Trim +Vin +Vout Figure 16. Trim UP circuit configuration • TRIM-DOWN EQUATION: Rtrim_down ( Ω ) 5100 ⋅ ( Vdes − 2.5) 5 − Vdes − 2050 Where Rtrim_down is the resistance value in ohms and Vdes is the desired output voltage. Enable -Vout -Vin Rload Trim +Vin Rtrim_down +Vout Figure 17. Trim DOWN circuit configuration www.dcdc.com 603-893-2330 - 10 - 10 - Technical Datasheet CP30_1160005 Application Notes (cont) Thermal Derating • It is preferable that the DC-DC module have an unobstructed flow of air across it for best thermal performance. Components taller than ~ 2mm in front of the module can deflect airflow and possibly create hotspots. • Significant cooling is achieved through conductive flow from the modules I/O pins to the host PCB. Sufficiently large traces connecting the dc-dc converter to the source and load will help ensure thermal derating performance will meet or exceed the derating curves published in this datasheet. • If the module is expected to be operated near the load limits defined in the derating curves, insystem verification of module derating performance should be performed to ensure long-term system reliability. Peak temperatures are to be measured using infrared thermography or by gluing a fine gauge (AWG #40) thermocouple at the Tref location(s) shown below. Temperature at the specified location(s) should be kept below 123ºC for open frame units, 105ºC for encapsulated modules in order to maintain optimum converter reliability. Open Frame Encapsulated Input Undervoltage Lockout • The converter is disabled until the input voltage has exceeded the UVLO turn-on threshold. Once the input voltage exceeds this level (see Input Under-Voltage Lock-out in Electrical Specifications table) the module will commence soft-start. Hysteresis of (typically) 1-3 volts minimizes the likelihood of pulling the input voltage below the turn-off threshold during startup which could create an undesirable on/off cycling condition. The converter will continue to operate until the input voltage subsequently falls below the UVLO turn-off threshold. Enable Pin Function • The module has a remote enable function that allows it to be turned on or off remotely. The Enable pin is referenced to the negative input pin (-Vin) of the converter. Modules can be ordered with either negative or positive enable. • The negative enable option the module will not turn on unless the enable pin is connected to – Vin. The positive enable option allows the converter to turn on as soon as voltage sufficient to exceed the UVLO of the converter has been applied to the input terminals. In this case the module is turned off by connecting the Enable pin to –Vin. On/off thresholds are located in the Electrical Specifications table. www.dcdc.com 603-893-2330 - 11 - 11 - Technical Datasheet CP30_1160005 Application Notes (cont) Output Overvoltage Protection • The module has an independent feedback loop that will disable the output of the converter if a voltage greater than about 125% of the nominal set point is detected. When this threshold is reached, the converter will shut down and remain off for the amount of time specified by the Auto-Restart Period. The converter will attempt a restart once this period of time has elapsed. Output Overtemperature Protection • To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the average PCB temperature exceeds approx. 135ºC, but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart once it has cooled below the shutdown temperature minus hysteresis (typically 20 deg C.) SMT Version Layout Considerations (if applicable) • Copper traces with sufficient cross-section must be provided for all output & input pins. SMT pads tied to internal power/ground planes must have multiple vias around each SMT pad to couple expected current loads from module pins into internal traces/planes. One 0.024” (0.6mm) diameter via for each 4A of expected source or load current must be provided as close to the termination as possible, preferably in the direction of current flow from SMT pad to load. Vias must be at least 0.024” (0.6 mm) away from the SMT pad to prevent solder from flowing into the vias. • SMT pads on the host card are to be 0.075” (1.9mm) diameter. Solder paste screen opening should be 0.070” diameter and the screen should be 0.006” (0.15 mm) thick (other thicknesses are possible; 0.006” provides a good compromise between solder volume and coplanarity compensation.) Paralleling Converters • Modules may be paralleled but it is recommended that the total power draw not exceed the output power rating of a single module. External sharing controllers are recommended for reliability and to ensure equal distribution of the load to the converters. www.dcdc.com 603-893-2330 - 12 - 12 - Technical Datasheet CP30_1160005 Application Notes (cont) EMC Compliance To meet Class B compliance for EN55032 (CISPR 32) or FCC part 15 sub part j, the following input filter is required: Figure 18. EMI Filter L1 = C1 = C2 = C3 = C4,C5 = 0.63 mH Common Mode Inductor (Pulse P0469) 1000uF
CP30C1160005N 价格&库存

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