RS1D

RS1A~RS1M Rev.B Jun.-2021 DATA SHEET 描述 / Descriptions 快恢复二极管，反向电压：50V~1000V，正向电流：1.0A，SMA 封装。 Surface Mount Fast Recovery Rectifiers, Reverse Voltage：50 to1000V,Forward Current:1.0A ,SMA package. 特征 / Features 玻璃钝化芯片，无铅符合欧盟 RoHS 指令 2011/65/EU，适用表面贴装。无卤产品。 Glass Passivated Chip Junction, Lead free in comply with EU RoHS 2011/65/EU directives, For surface mounted applications. HF product. 用途 / Applications 一般用途. General purpose. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 印章代码 / Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 RS1A~RS1M Rev.B Jun.-2021 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Typical Junction Capacitance at VR=4V f=1MHz Typical Thermal 1） Resistance Operating and Storage Temperature Range 数值 Rating 单位 Unit RS1A RS1B RS1D RS1G RS1J RS1K RS1M VRRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF（AV） 1.0 A IFSM 30 A Cj 15 pF RθJA 75 ℃/W -55~+150 ℃ Tj,Tstg Note: 1）P.C.B. mounted with 1.0 X 1.0" (2.54 X2.54cm) copper pad areas. 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Maximum Instantaneous Forward Voltage Maximum DC Reverse Current at Rated DC Blocking Voltage Maximum Reverse Recovery Time 符号 Symbol VF 测试条件 Test Conditions 数值 Rating RS1A RS1B RS1D RS1G RS1J RS1K RS1M 单位 Unit IF=1.0A 1.3 V Ta=25℃ 5.0 μA Ta=125℃ 50 μA IR trr http://www.fsbrec.com IF = 0.5 A IR = 1 A Irr = 0.25 A 150 250 500 ns 2/6 RS1A~RS1M Rev.B Jun.-2021 DATA SHEET 电参数曲线图 / Electrical Characteristic Curve http://www.fsbrec.com 3/6 RS1A~RS1M Rev.B Jun.-2021 DATA SHEET 外形尺寸图 / Package Dimensions http://www.fsbrec.com 4/6 RS1A~RS1M Rev.B Jun.-2021 DATA SHEET 印章说明 / Marking Instructions http://www.fsbrec.com 5/6 RS1A~RS1M Rev.B Jun.-2021 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 350 Temperature(℃) 300 245±5℃ 250 5±0.5 sec 200 150 60~90 sec 100 50 0 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 Time(sec) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating:150~180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260±5℃ Time:10±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / REEL Package Type 封装形式 SMA Dimension 包装尺寸 (unit：mm3) Units 包装数量 Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 5000 2 10000 7 70000 13〞×12 336X336X40 380X335X366 使用说明 / Notices http://www.fsbrec.com 6/6