TSM050

SPSEMI PPTC/TSM(2018) Series     Polyer Positive Temperature Coefficient TSM(2018) Series Features Surface Mount Devices Lead free device Size 5045mm/2018mils Surface Mount packaging for automated assembly Agency Approval:ROHS Applications Almost anywhere there is a low voltage power supply, up to DC60V and a load to be protected, including: Computer mother board, Modem. Telecommunication equipments Dimensions(2018) Recommended Mounting Pad Layout C A 1.5±0.1 1.5±0.1 4.6±0.1 ZZZ B E D 3.4±0.1 Dimensions in millimerters C B A D E Part Number Min. Max. Min. Max. Min. Max. Min. Min. TSM030 4.72 5.44 4.22 4.93 0.60 1.10 0.30 0.25 TSM050 4.72 5.44 4.22 4.93 0.60 1.10 0.30 0.25 TSM100 4.72 5.44 4.22 4.93 0.45 0.80 0.30 0.25 TSM100/33 4.72 5.44 4.22 4.93 0.45 0.80 0.30 0.25 TSM150 4.72 5.44 4.22 4.93 0.45 0.80 0.30 0.25 TSM200 4.72 5.44 4.22 4.93 0.45 0.80 0.30 0.25 REV . 2017 . 05 . 12 www.spsemi.cn Page 1 of 4 SPSEMI PPTC/TSM(2018) Series     Electrical Characteristics (25 ℃ ) Maximum Time To Trip Resistance R1max. Rmin (Ω) (Ω) I hold I trip V max. I max. P d max. (A) (A) (Vdc) (A) (W) Current (A) Time (Sec.) TSM030 0.30 0.6 60 100 0.9 1.5 3.0 0.50 2.30 TSM050 0.55 1.2 60 100 1.0 2.5 3.0 0.20 1.00 TSM100 1.10 2.2 15 100 1.1 8.0 0.4 0.06 0.36 TSM100/33 1.10 2.2 33 100 1.1 8.0 0.4 0.06 0.36 TSM150 1.50 3.0 15 100 1.1 8.0 0.8 0.05 0.17 TSM200 2.00 4.0 10 100 1.1 8.0 2.4 0.03 0.10 Part Number Notes : I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (Vmax). P d = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. R min = Minimum device resistance prior to tripping at 25°C. R 1 max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Thermal Derating Chart-I hold (A) Maximum ambient operating temperature (Tmao)vs.hold current (Ihold) Part Number -40 °C -20 °C 0 °C 25 °C 40 °C 50 °C 60 °C 70 °C 85 °C TSM030 0.48 0.42 0.35 0.30 0.24 0.21 0.17 0.15 0.10 TSM050 0.87 0.77 0.67 0.55 0.46 0.41 0.36 0.31 0.23 TSM100 1.71 1.52 1.32 1.10 0.94 0.84 0.74 0.64 0.50 TSM100/33 1.71 1.52 1.32 1.10 0.94 0.84 0.74 0.64 0.50 TSM150 2.38 2.10 1.82 1.50 1.27 1.13 0.99 0.85 0.64 TSM200 2.95 2.65 2.35 2.00 1.74 1.59 1.44 1.29 1.06 REV . 2017 . 05 . 12 www.spsemi.cn Page 2 of 4 SPSEMI PPTC/TSM(2018) Series     Characteristic Curve Typical Time To Trip At 25 °C Thermal Derating Curve 100 B C A E D A : 0.30A B : 0.55A C : 1.10A D : 1.50A E : 2.00A 140 10 120 Time In Seconds Percent of Derated Current-% 160 100 80 60 40 1 0.1 0.01 20 0 -40 -20 0 20 40 60 0.001 0.1 80 1 10 100 Current In Amperes Temerature-℃ Environmental Specifications Test Conditions Resistance Change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C Termination Pad Characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. REV . 2017 . 05 . 12 www.spsemi.cn Page 3 of 4 SPSEMI PPTC/TSM(2018) Series     Recommended Soldering Conditions Recommended Conditions Reflow Soldering Pb-Free assembly Profile Feature tP TP +150℃ -Temperature Max(T s(max) ) +200℃ -Time(Min to Max)(t s ) 60-180seconds Average ramp up rate (T s(max) to T p ) Time maintained above: Critical Zone T L to T P Ramp-up TL tL Temperature Pre Heat -Temperature Min(T s(min) ) 3℃/second Max. -Temperature(T L ) +217℃ -Time(t L ) 60-150seconds Peak Temp(T P ) +260(+0/-5)℃ Time within 5℃ of actual Peak Temp(t p ) Ramp-down Rate 20-40seconds Time 25℃ to Peak Temp(T P ) 8 minutes Max. T s (max) Ramp-down Preheat T s (min) ts 25 6℃/second Max. time to peak temperature (t 25℃ to peak) Time Recommended reflow methods: I R , vapor phase oven, hot air oven, N 2 environment for lead-free. Devices are not designed to be wave soldered to the bottom side of the board. Recommended maximum paste thickness is 0.25mm (0.010inch). Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Packageing Information Part Number Packaging Option Quantity TSM030-050 Reel 1500pcs/reel TSM100-200 Reel 2500pcs/reel REV . 2017 . 05 . 12 www.spsemi.cn Page 4 of 4