FRS1210F1003TS

FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭ 高功率抗浪涌厚膜晶片电阻（Anti-Surge High Power Thick Film Chip Resistor） 抗浪涌厚膜晶片电阻 Anti-S ￭应用(Application) - Telecommunications - 电信 - Power supplies - 电源供应器 - Car electronics - 汽车电力 ￭特性(Features) - Small size and light weight - 体积小，重量轻 - Reliability, high quality - 可靠性，高质量 - Specialmaterialanddesignforhighworkingvoltagerequire - 对高工作电压要求的特殊材质和设计 ￭料号说明(Parts Number Explanation)： 示例 Example: FPS1206J481 TS F P S 公司名 产品别 功能别 FOJAN 1206 型别 J 481 T S 公差 字码 包装别 端电极 特殊型 R:Resistor C:Normal 0603 D：±0.5% ±5%:E24 T: 7 inch reel S：Sn N: C:Capacitor P:Hi-Power 0805 F:±1% 3-digits+blank Q:10 inch reel C：Cu Normal L:Inductor L:Lowohmic 1206 J:±5% 102=1KΩ R:13 inch reel A：Au D：LED D:Diode A:Array 1210 P：Jumper 1R0=1Ω B:Bulk A:Audion S:Surge 2010 K: ±10% P:High Power H:Hi-Precision 2512 M: ±20% Packaging Termination Special code code code ±1%&Below： V:Hi-Voltage E24+E96： Q:Auto-motive 4-digits R:Anti-sulfur 1001=1KΩ M:Metal 1R00=1Ω D: (LED) Compan y code Type code Functional code Size Tolerance code code Resistance code FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭尺寸 (Dimension) 尺寸 dimension 单位（unit）: mm 型别（Type） L W H T1 T2 0603 1.60±0.10 0.80±0.10 0.45±0.10 0.25±0.15 0.25±0.15 0805 2.00±0.10 1.25±0.10 0.50±0.10 0.35±0.20 0.35±0.20 1206 3.10±0.10 1.60±0.10 0.55±0.10 0.45±0.20 0.40±0.20 1210 3.10±0.10 2.50±0.15 0.55±0.10 0.45±0.15 0.50±0.20 2010 5.00±0.10 2.50±0.15 0.55±0.10 0.45±0.15 0.50±0.20 2512 6.35±0.10 3.10±0.15 0.55±0.10 0.60±0.20 0.90±0.20 ￭电阻结构（Construction） NO. 结构 construction 主要材料 Major material 1 陶瓷基板 Ceramic substrate 三氧化二铝 2 银电极 Conductive layer 银 Ag 3 侧电极 Side conductive layer 镍铬合金 NiCr 4 阻体层 Resistive layer 氧化钌+玻璃 RuO2 + glass 5 内保护层 Inner protective layer 玻璃 Glass 6 外保护层 Outer Protective layer 环氧树脂 Epoxy 7 文字 Marking 环氧树脂 Epoxy 8 镍电极 Ni plating layer 镍 Ni 9 锡电极 Sn plating layer 锡 Matte Tin Al2O3 FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭功率衰减曲线（ Derating Curve） ￭ 阻值范围（Resistance range）: 阻值范围 Resistance Range 型别 Type D (±0.5%) F (±1%) J (±5%) K (±10%) M (±20%) 0603 1Ω~1MΩ 1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ 1Ω~10MΩ 0805 1Ω~1MΩ 1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ 1Ω~10MΩ 1206 1Ω~1MΩ 1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ 1Ω~10MΩ 1210 1Ω~1MΩ 1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ 1Ω~10MΩ 2010 1Ω~1MΩ 1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ 1Ω~10MΩ 2512 1Ω~1MΩ 1Ω~1MΩ 1Ω~10MΩ 1Ω~10MΩ 1Ω~10MΩ 如有非标准品的需求,请联系我们的业务部门 For non-standard parts, please contact our sales dept. ￭电气特性（Electrical characteristics） 型别 Type 绝缘耐压 Dielectric Withstanding Voltage 0603 0805 1206 1210 2010 2512 150V 300V 500V 500V 500V 500V FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭ 电性规格（Standard Electrical Specifications） 型别 额定功率 最高工作电压 最大过负荷电压 Max. RCWV Max. Overload Voltage Type （Power Rating at 70℃） 0603 1/5W 75V 150V 0805 1/4W 150V 300V 1206 0.6W 200V 400V 1210 3/4W 200V 400V 2010 1.5W 200V 400V 2512 2W 200V 400V 阻值范围 T.C.R. (PPM/℃) Resistance Range ±200PPM/℃ 10Ω~10MΩ ￭ 焊盘推荐（Soldering pad size recommend） Dimension（mm） 型别 Type A B C D 0603 0.8±0.05 0.65±0.05 0.8±0.05 2.4±0.05 0805 1.0±0.1 1.0±0.1 1.4±0.1 3.0±0.1 1206 2.0±0.1 1.1±0.1 1.8±0.1 4.2±0.1 1210 2.0±0.1 1.1±0.1 3.0±0.1 4.2±0.1 2010 3.6±0.1 1.4±0.1 3.0±0.1 6.4±0.1 2512 4.9±0.1 1.35±0.1 3.7±0.1 7.6±0.1 FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭ 脉冲曲线（Pulse Load Behavior） 公差 Tolerance: ±0.50%、±1.00%如下: 公差 Tolerance: ±5.00%、±10.00%、±20.00%如下: FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭性能（Performance Specifications） 内容 测试方法 测试条件 规格 Item Test Methods Test Conditions Specification TCR=（R-R0 ）/（t-t0）R0 ×106（ppm） R0 电阻在室温下的阻值(resistance at room temperature) 温度系数 Temperature Coefficient JIS C 5201 4.8 R 电阻在 125℃或-55℃下的阻值 ±200 PPM/℃ (resistance at 125℃ or -55℃) t0 室温(room temperature) t 测试温度（test temperature 125℃ or -55℃） 加载 2.5 倍的额定电压，时间 5 秒后测 量试验前后的阻值变化率。 短时间过负荷 Short-time overload JIS C 5201 4.13 Applied 2.5 times of rated voltage for ±(1.00% +0.05Ω) 5 second. Measure the variation of resistance. 沾助焊剂后浸入锡炉，锡炉温度 245±5℃，时间 3±0.5 秒。 焊锡性 Solderability JIS C 5201 4.17 Dip the terminal in a flux and then dip ＞95%面积上锡 (＞95% coverage) into a soldering bath at 245±5℃ for 3±0.5sec. 沾助焊剂后浸入锡炉，锡炉温度 260±5℃，时间 10±0.5 秒, 测量试验 抗焊锡热 Resist to soldering heat 前后的阻值变化率。 JIS C 5201 4.18 Dip the terminal in a flux and then dip into a soldering bath at 260±5℃ for 10±0.5sec. Measure the variation of resistance. ±(1.00% +0.05Ω) FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 内容 测试方法 测试条件 规格 Item Test Methods Test Conditions Specification 电阻本体上加载绝缘耐压 60±5 秒后， 测量绝缘阻抗。 绝缘电阻 Insulation resistance JIS C 5201 4.6 Applied the dielectric withstanding >10GΩ voltage on the center of body for 60±5seconds. Then measure insulation resistance. 无击穿、飞弧及可见机械性损伤 电阻本体上加载绝缘耐压 60±5 秒。 绝缘耐压 Dielectric withstanding voltage No evidence of flashover, mechanical damage arcing or insulation JIS C 5201 4.7 Applied the dielectric withstanding breakdown voltage on the center of body for60±5seconds. 电阻焊接在测试板上进行弯折,弯折保 持时间 20±1 秒，1206(含) 以下的尺 寸弯曲 5+0.2/0 mm; 1206 以上的尺寸 弯曲 2+0.2/0 mm; 量测试验前后阻值 变化率 Specimen shall be mounted on test board, then bend the board and 端子弯曲 Terminal bending maintained for 20±1s. the distance of JIS C 5201 4.33 ±(1.00% +0.05Ω) bending is 5+0.2/0 mm for resistors which size no larger than 1206 or 2+0.2/0 mm which size larger than 1206. Measure the variation of resistance. FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 内容 测试方法 测试条件 规格 Item Test Methods Test Conditions Specification 电阻放入温度循环机中，温度 155±2℃ 至-55±3℃，共 5 个循环。量测试验前 后阻值变化率. 温度循环 Temperature Cycling JIS C 5201 4.19 Put specimen in a chamber which ±(2.00% +0.05Ω) temperature can be changed to 155±2℃ or -55±3℃, repeated 5 times. Measure the variation of resistance. 电阻放入恒温恒湿箱，温度 40±2℃， 湿度 90~95 %RH;通电额定电压 1.5 小 时，断电 0.5 小时；重复通断电至试验 时间 1000 +48/-0 小时. 量测试验前后 阻值变化率. 耐湿特性 Humidity JIS C 5201 4.24 Put the specimen in a chamber at ±(2.00% +0.05Ω) 40±2℃ temperature and 90~95% relative humidity, then applied rated voltage for1.5H and rested for 0.5H repeatedly till total test time is 1000+48/-0 H. Measure the variation of resistance. 电阻放入恒温箱中，温度 70±2℃，ON TIME:1.5H，OFF TIME:0.5H，通电额 定电压 1000 +24/-0 小时，量测试验前后 负荷寿命 Load life 阻值变化率. JIS C 5201 4.25.1 Put the specimen in a chamber at ±(2.00% +0.05Ω) 70±2℃ temperature, ON TIME:1.5H，OFF TIME:0.5H， and applied rated voltage for 1000 +24/-0H. Measure the variation of resistance. 25°C~65°C,90~100%RH, 2.5 小时; 65°C 90~100%RH, 3 小时; 65°C~25°C,80~100%RH,2.5 小时,10 个循环,试验结束 24±4 小时后进行测 温湿循环 Moisture resistance MIL-STD-202 METHOD 106 试. 25°C~65°C,90~100%RH, 2.5H; 65°C 90~100%RH, 3H; 65°C~25°C 80~100%RH, 2.5H, 10 cycles, Measurement at 24±4 hours after test conclusion. ±(2.00% +0.05Ω) FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭ 包装规格（Tapping Specification） -卷盘尺寸（Reel dimension） Type Size 0603/0805/1206/1210 0603/0805/1206 0603/0805/1206 2010/2512 7” 10 ” 13 ” 7” Unit A B C F W 5K/Reel mm 178±2.0 60.0±1.0 13.5±0.5 11.4±0.1 9.00±0.3 10K/Reel mm 254±2.0 100.0±1.0 13.5±0.5 11.4±0.1 9.00±0.3 20K/Reel mm 330±2.0 100.0±1.0 13.5±0.5 11.4±0.1 9.00±0.3 4K/Reel mm 178±2.0 60.0±1.0 13.5±0.5 15.4±1.0 13.0±0.3 -包装尺寸（packing dimension） Unit: mm Dimensions A B D F P0 P1 P2 W 0603 1.10±0.10 1.90±0.10 1.50± 0.1 0.0 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 0805 1.65±0.20 2.40±0.20 1.50± 0.1 0.0 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 1206 1.90±0.20 3.50±0.20 1.50± 0.1 0.0 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 1210 2.80±0.20 3.50±0.20 1.50± 0.1 0.0 3.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 8.00±0.20 2010 2.90±0.10 5.30±0.10 1.50± 0.1 0.0 5.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 12.0±0.10 2512 3.40±0.10 6.60±0.10 1.50± 0.1 0.0 5.50±0.05 4.00±0.10 4.00±0.10 2.00±0.05 12.0±0.10 ￭ 上胶带剥离力测试（Peel force of top cover tape） 上胶带以 200mm/分钟的速度，沿 165～180 度角的方向进行剥离，如下图所示。纸带的剥离力范围为 10g～70g; 载带的剥离力范围为 30～100g。 The top cover tape is pulled at a speed of 200 mm/min with the angle between the tape during peel and the direction of unreeling maintained at 165 to 180 degree as following picture. The peel force of paper carrier tape shall be 0.1N to 0.7N(10 to 70 g), the peel force of plastic carrier tape shall be 0.3N to 1N (30 to 100 g) FPS-Series Anti-Surge High Power Thick Film Chip Resistor FPS 系列高功率抗浪涌厚膜晶片电阻规格书 ￭ 焊接 （soldering） -建议回流焊曲线（Recommend reflow soldering profile） -建议波峰焊曲线（Recommend wave soldering profile） -手工焊温度（hand soldering temperature） 烙鐵温度 350±10℃ 3 秒之內，避免烙铁接触电阻本体 The iron temperature is 350±10℃, hand soldering time less than 3S. Avoid solder iron tip direct touch the components body