TMPV0754SV-150MN-D

Form No: T00271-7-0000-PBM02-220300574 Specification for Approval Date: 2022/03/15 Customer : TMPV0754SV-Series(N)-D TAI-TECH P/N: CUSTOMER P/N: DESCRIPTION: pcs QUANTITY: REMARK: Customer Approval Feedback  西北臺慶科技股份有限公司 TAI-TECH Advanced Electronics Co., Ltd Headquarter: NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http://www.tai-tech.com.tw E-mail: sales@tai-tech.com.tw  臺慶精密電子(昆山)有限公司 TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN, JIANG-SU, CHINA TEL: +86-512-57619396 FAX: +86-512-57619688 E-mail: sales@tai-tech.cn ■ 慶邦電子元器件(泗洪)有限公司 TAIPAQ ELECTRONICS (SIHONG) CO., LTD JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG , JIANGSU , CHINA. TEL: +86-527-88601191 FAX: +86-527-88601190 E-mail: sales@taipaq.cn Sales Dep. APPROVED CHECKED Eric Kuan Zhang mengmeng R&D Center APPROVED CHECKED DRAWN Sky Luo Mr.Liang Cui lingling Downloaded From Oneyac.com TAI-TECH P1 SMD Power Inductor TMPV0754SV-Series(N)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 22/03/15 New lssue Sky Luo Mr.Liang Cui lingling 備 注 Downloaded From Oneyac.com TAI-TECH P2 SMD Power Inductor TMPV0754SV-Series(N)-D TMPV0754 产品与PC 1. Features PCB尺 产品尺寸 1. Low loss realized with low DCR. 7.9 3. Ultra low buzz noise, due to composite construction. Halogen 4. 100% Lead(Pb)-Free and RoHS compliant. 5. High reliability -Reliability test complied to AEC-Q200. Automotive applications. 3 7.3 Halogen-free 2. Applications 9 3 7.3 5.4 2. High performance realized by metal dust core. 2 3. Dimensions Recommend PC Board Pattern H L 1R5 2212 Series G A(mm) A1(mm) B(mm) TMPV0754SV 7.9±0.3 7.3±0.2 7.3±0.2 C(mm) D(mm) D1(mm) E(mm) E1(mm) 5.2±0.2 1.7±0.3 3.0±0.2 5.4±0.2 1R5 M N D E F 2.0±0.3 4. Part Numbering TMPV 0754 SV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F、G: Code - - L(mm) D G BxC Standard. 1R5=1.50uH K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking direction cannot decide polarity. Marking: Black.1R5 and 2212 (22:YY,12:WW, follow production date). Downloaded From Oneyac.com G(mm) H(mm) 9.0 3.0 3.5 Note: 1.PCB layout is referred to standard IPC-7351B 2. The above PCB layout reference only. 3. Recommend solder paste thickness at 0.15mm and above. TAI-TECH P3 5. Specification Heat Rating Current DC Irms( A ) Saturation Current DC I sat ( A ) Part Number Inductance L0 A(uH) ±20% DCR (mΩ) Typ DCR (mΩ) Max Typ Max Typ Max TMPV0754SV-1R0MN-D 1.00 20.0 17.0 23.0 20.0 5.0 6.0 TMPV0754SV-1R5MN-D 1.50 17.0 15.0 TMPV0754SV-2R2MN-D 2.20 14.5 13.0 19.0 17.0 6.3 7.3 16.5 14.5 9.7 11.2 TMPV0754SV-3R3MN-D 3.30 11.5 TMPV0754SV-4R7MN-D 4.70 10.5 10.5 14.0 12.3 13.0 15.0 9.0 13.3 11.3 17.8 20.5 TMPV0754SV-5R6MN-D 5.60 9.3 8.5 11.0 9.5 19.2 22.1 TMPV0754SV-6R8MN-D 6.80 8.7 8.0 10.2 9.0 23.0 26.5 TMPV0754SV-8R2MN-D 8.20 8.0 7.5 9.2 8.1 27.3 31.4 TMPV0754SV-100MN-D 10.0 7.2 6.7 8.0 7.0 33.0 38.0 TMPV0754SV-120MN-D 12.0 6.3 5.8 7.7 6.7 43.0 52.0 TMPV0754SV-150MN-D 15.0 5.5 5.0 7.2 6.2 60.0 66.0 TMPV0754SV-220MN-D 22.0 5.0 4.5 6.3 5.4 85.0 93.5 TMPV0754SV-330MN-D 33.0 4.0 3.5 4.9 4.2 111.0 127.6 TMPV0754SV-470MN-D 47.0 3.2 2.7 4.1 3.5 156.0 171.6 TMPV0754SV-560MN-D 56.0 3.0 2.6 3.4 2.9 188.0 206.8 TMPV0754SV-680MN-D 68.0 2.7 2.4 3.0 2.6 218.0 251.0 TMPV0754SV-101MN-D 100.0 2.2 2.0 2.0 1.6 310.0 357.0 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : Agilent 4284A,E4991A,4339B,KEYSIGHT E4980A/AL,chroma3302,3250,16502. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 165℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Irms Testing : Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 8. Rated DC current: The lower value of Irms and Isat. Downloaded From Oneyac.com TAI-TECH P4 6. Material List 4 NO Items 1 Core Alloy Powder . 2 Wire Polyester Wire or equivalent. 3 Clip 100% Pb free solder(Ni+Sn---Plating) 4 Ink Halogen-free ketone 3 1 Materials 2 7. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x16mm 16.4+2/-0 100±2 13+0.5/-0.2 330 C B D 2.0∮0.5 A EMBOSSED CARRIER (2) Tape Dimension 4.0 Blank portions Chip cavity Blank portions T B0 W F D K0 P 200mm or more 400mm or more Direction of tape Series Bo(mm) Ao(mm) Ko(mm) P(mm) TMPV0754 9.0±0.1 7.7±0.1 5.7±0.1 12.0±0.1 A0 W(mm) F(mm) T(mm) D(mm) 16±0.3 7.5±0.1 0.40±0.05 1.5±0.1 (3) Packaging Quantity Series Reel TMPV0754 800 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-D-2008 standard). 165° to180° Base tape Tearing Speed mm Room Temp. (℃) Room Humidity (%) Room atm (hPa) 300±10% 5~35 45~85 860~1060 Downloaded From Oneyac.com TAI-TECH P5 8. Reliability and Test Condition Item Performance Test Condition Operating temperature -55~+165℃(Including self - temperature rise) N/A Storage temperature and Humidity range 1. Less than40℃,85%RH (Product with taping) 2. -55~+165℃(on board) N/A Electrical Performance Test Inductance Agilent 4284A,E4991A,KEYSIGHT E4980A/AL,chroma 3302,3205 Refer to standard electrical characteristics list. DCR Agilent 4339B,chrom16502 Saturation Current (Isat) Approximately △L30% Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △ T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test High Temperature Exposure(Storage) AEC-Q200 Temperature Cycling AEC-Q200 Biased Humidity (AEC-Q200) Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles Temperature：165±2℃(Inductor) Duration ：1000hrs Min. With 100% rated current. Measured at room temperature after placing for24±2hrs High Temperature Operational Life (AEC-Q200) External Visual Physical Dimension Resistance to Solvents Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Temperature：165±2℃(Inductor) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Step2：165±2℃ transition time 1min MAX. Step3：165±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min Measured at room temperature after placing for24±2hrs Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Test condition Mechanical Shock Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Type Peak value Normal (g’s) duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 100 6 Half-sine 12.3 Lead 100 6 Half-sine 12.3 3 shocks in each direction along 3 perpendicular axes(18 shocks). Downloaded From Oneyac.com TAI-TECH P6 Item Performance Vibration Resistance to Soldering Heat Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value (AEC-Q200) ESD Temperature(℃) Time(s) 260±5 (solder temp) Temperature ramp/immersion and emersion rate 10±5 25mm/s±6 mm/s Depth: completely cover the termination Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：165±2℃ within 20Sec. Step3：165±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Thermal shock HBM＞=2KV Test Condition Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Oscillation Frequency: 10Hz～2KHz～10Hz for 20 minute Equipment： Vibration checker Total Amplitude: 5g Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Test condition:(MIL-STD-202 Condition B) Number of heat cycles:1 Appearance：No damage. Direct Contact and Air Discharge PASSIVE COMPONENT HBM ESD Discharge Waveform to a Coaxial Target Test method: AEC-Q200-002 Test mode：Contact Discharge Discharge level：4 KV (Level: 2 ) Solderability Electrical Characterization Flammability More than 95% of the terminal electrode should be covered with solder。 a. Method B1, 4 hrs @155°C dry heat @255°C±5°C Test time:5 +0/-0.5 seconds. b. Method D category 3. (steam aging 8hours ± 15 min)@ 260°C±5°C Test time: 30 +0/-0.5 seconds. Refer Specification for Approval Summary to show Min, Max, Mean and Standard deviation . Electrical Test not required. V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. Downloaded From Oneyac.com TAI-TECH P7 9. Soldering Specifications (1) Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) IR Soldering Reflow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. Table 1.1&1.2 (J-STD-020E) (3) Iron Reflow: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended.(Fig. 2) ‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧355℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5sec. Fig.1 IR Soldering Reflow Fig.2 Iron soldering temperature profiles Soldering iron Method : 350± 5℃ max Reflow times: 3 times max Table (1.1): Reflow Profiles Profile Type: Pb-Free Assembly Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(ts)from(Tsmin to Tsmax) 150℃ 200℃ 60-120seconds Ramp-up rate(TLto Tp) 3℃/second max. Liquidus temperature(TL) Time(tL)maintained above TL 217℃ 60-150 seconds Classification temperature(Tc) See Table (1.2) Time(tp) at Tc- 5℃ (Tp should be equal to or less than Tc.) *< 30 seconds Ramp-down rate(Tp to TL) 6℃ /second max. Time 25℃ to peak temperature 8 minutes max. Tp: maximum peak package body temperature, Tc: the classification temperature. For user (customer) Tp should be equal to or less than Tc. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Table (1.2) Package Thickness/Volume and Classification Temperature (Tc) PB-Free Assembly Package Thickness Volume mm3 >TAI-TECH(台庆) Downloaded From Oneyac.com