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TMB-E4F2-1L1

TMB-E4F2-1L1

  • 厂商:

    TRI-STAR

  • 封装:

  • 描述:

    2.4mm(APC-2.4,OS-50) 连接器 插孔,母形插口 50 欧姆 板边缘,末端装入式 压缩

  • 数据手册
  • 价格&库存
TMB-E4F2-1L1 数据手册
3 4 2 1 REVISIONS .684 17.38 .180 4.57 .421 10.69 D .276 7.00 .110 2.79 .250 6.35 A .531 13.50 REV. DESCRIPTION DATE APPROVED - INITIL RELEASE 07/03/2018 MM 1 UPDATED PART NUMBER 10/24/2018 DL 2 ADDED SHEET 2 PCB DEFINITION 2/20/2019 PV 3 ADDED SECTION VIEW 3/7/2019 PV 4 ADDED SHEET 3 3/19/2019 PV 5 REVISED MODEL 11/19/2019 PV D .375 9.53 A M7.00x0.75P-6g .094 2.40 .001 0.03 .115 2.93 C C .531 13.50 .025 0.64 .110 2.80 #1-72 UNF-2A .010 0.25 .039 1.00 .012 0.31 .250 6.35 #1-72 UNF-2B .065 1.65 .208 5.28 .033 0.85 SCREW .002 0.06 .014 0.35 .0070±.0004 0.178±0.010 .028 0.71 LOCKING BLOCK B NOTE(S): 1. These characteristics are typical and for reference. 2. DYH: 60-20009-44070 3. See sheets 2 and 3 for PCB definition. SECTION A-A SCALE 20 : 1 MATERIAL(S): ELECTRICAL(S): MECHANICAL(S): ENVIRONMENTAL(S): Body: Stainless Steel Center Conductor: Beryllium Copper Insulator: Insulator 1: PCTFE, white Insulator 2: PTFE, white RoHS Compliant Protective Cap: Soft PVC Color: Blue Impedence: 50 Ohms Nominal Frequency Range: DC to 50 GHz VSWR: 1.3:1 max at 50 GHz Working Voltage: 400 Vrms max @ Sea Level Dielectric Withstand Voltage: 500 Vrms max. Insulation Resistance: 5000 Megaohms min. Contact Resistance: Initial: Center Contact: 1.5 Milliohms max Outer Contact: 0.8 Milliohms max Mating Characteristics: Interface per MIL-STD-348 Force to Engage & Disengage: Torque: 2 inch-pounds max Longitudinal Force: NA Connector Durability: 500 Cycles min. Permeability: Less than 2.0 mu. Center Contact Retention: Axial Force: 6 pounds min. Radial Force: NA Temperature Range: -65 C to +165 C Moisture Resistance: MIL-STD-202, Method 103, Test Condition B Corrosion: MIL-STD-202, Method 101, Test Condition B Vibration: MIL-STD-202, Method 204, Test Condition A Shock: MIL-STD-202, Method 213, Test Condition 1 APPLICABLE CARLISLE IT DOCUMENTS TOLERANCES AND NOTES APPROVAL INITIALS DATE EXCEPT AS NOTED DRAWN ASSY INSTRUC PROD INSTRUC MM 07.03.18 BY NA NA NA THIRD ANGLE PROJECTION CHECKED KM 07.03.18 BY SCALE 5:1 N O T I C E FINISH(ES): A B PROTECTION CAP WORK STANDARD Body: Passivated Center Conductor: Gold Plating ENG-SW REV. E THIS DRAWING EMBODIES A CONFIDENTIAL PROPRIETARY DESIGN ORIGINATED BY CARLISLE INTERCONNECT TECHNOLOGIES & ALL DESIGN, MANUFACTURING, REPRODUCTION, USE & SALE RIGHTS REGARDING THE SAME ARE EXPRESSLY RESERVED. IT IS SUBMITTED UNDER A CONFIDENTIAL RELATIONSHIP FOR A SPECIFIED PURPOSE & THE RECIPIENT AGREES BY ACCEPTING THIS DRAWING NOT SUPPLY OR DISCLOSE ANY INFORMATION REGARDING IT TO ANY UNAUTHORIZED PERSON TO INCORPORATE IN OTHER PROJECTS ANY SPECIAL FEATURES PECULIAR TO THIS DESIGN. ALL PATENT RIGHTS HERETO ARE EXPRESSLY RESERVED BY CARLISLE INTERCONNECT TECHNOLOGIES, CERRITOS, CALIFORNIA 90703. 4 3 DIMENSIONS ARE IN [INCHES] MM ANGLES 2 .XX DECIMALS .063 .XXX DECIMALS .01 2 Dongguan City, Guangdong P.R. China 523533 TITLE DESIGN ENG SCALE APPR BY SIZE 2.40mm STRAIGHT JACK, EDGE MOUNT (SOLDERLESS) 5:1 C SUB-DIRECTORY/ _OUTLINE/ DRAWING NO. SHEET TMB-E4F2-1L1 1 1 OF 3 REV. 5 A 3 4 .117 2.98 2 1 .117 2.98 .010 0.25 (REF) MAY BE LOCATED CLOSER TO EDGE .059 1.50 D .008 0.20 TYP .059 1.50 .022 0.55 .015 0.38 DETAIL B .375 9.53 DETAIL C SCALE 20 : 1 .079 2X 1.99 THRU UNPLATED B .110 2.79 .180 4.57 .008 0.20 .032 0.82 SCALE 20 : 1 .079 2X 1.99 THRU UNPLATED D .018 0.46 TYP .018 0.46 TYP .032 0.82 C .010 0.25 (REF) MAY BE LOCATED CLOSER TO EDGE .375 9.53 C C .110 2.79 .180 4.57 B .539 13.68 CONNECTOR OUTLINE .020 0.50 .539 13.68 CONNECTOR OUTLINE .021 0.53 .020 0.50 PIN .011 0.27 B PIN BODY BODY LAYER 1: Cu (0.036mm [1.4mil]) LAYER 1: Cu (0.036mm [1.4mil]) DIELECTRIC LAYER 2: SUBSTRATE (0.203mm [8.0mil] THICK) DIELECTRIC LAYER 2: SUBSTRATE (0.457mm [18.0mil]) PCB (REF) PCB (REF) A PCB LAYOUT OPTION 1 PCB LAYOUT Standard board stackup (Reference) 0.457mm [18.0mil] THICK SUBSTRATE (LAYER 2) ENG-SW REV. E 4 A PCB LAYOUT OPTION 2 3 0.203mm [8.0mil] THICK SUBSTRATE (LAYER 2) SCALE 10:1 SUB-DIRECTORY/ SHEET SIZE CAGE CODE DRAWING NO. C 2 TMB-E4F2-1L1 1 2 OF 3 REV. 5 3 4 .052 1.32 .010 0.25 TYP D 2 .010 0.25 (REF) MAY BE LOCATED CLOSER TO EDGE F E E .012 0.31 .020 0.50 PIN F .0146 0.371 PCB (REF) SECTION F-F PIN .0250 0.635 .0157 0.399 DIELECTRIC SCALE 25:1 PCB (REF) SECTION J-J .0250 0.635 LAYER 3 (Cu) ROTATED 90 CCW Interface to connector LAYER 1: Cu (0.030mm [1.2mil]) LAYER 2: SUBSTRATE (0.076mm [3.0mil]) LAYER 3: Cu (0.018mm [0.7mil]) LAYER 4: SUBSTRATE (0.152mm [6.0mil]) ROTATED 90 CCW Interface to connector PCB 9mil Option C .010 0.25 (REF) MAY BE LOCATED CLOSER TO EDGE J H 0.246mm [9.7mil] Dielectric SUBSTRATE LAYERS 2 AND 4 .079 2X 1.99 THRU UNPLATED .052 1.32 .010 0.25 TYP SECTION E-E H .018 0.46 TYP See Detail D for 9mil option See Detail G for 15mil option J B .180 4.57 D BODY DETAIL D .0097 0.246 DIELECTRIC .018 0.46 .020 0.50 .018 0.46 TYP BODY C 1 .0195 0.495 .110 2.79 .0299 0.759 B DETAIL G SCALE 25:1 .0300 0.762 LAYER 3 (Cu) LAYER 1: Cu (0.030mm [1.2mil]) LAYER 2: SUBSTRATE (0.076mm [3.0mil]) LAYER 3: Cu (0.018mm [0.7mil]) LAYER 4: SUBSTRATE (0.305mm [12.0mil]) CONNECTOR OUTLINE .375 9.53 SECTION H-H .539 13.68 A PCB 15mil Option MOUNTING PATTERN PCB LAYOUT Non-standard board stackup (Reference) ENG-SW REV. E 4 3 A 0.399mm [15.7mil] Dielectric SUBSTRATE LAYERS 2 AND 4 SCALE 10:1 SUB-DIRECTORY/ SHEET SIZE CAGE CODE DRAWING NO. C 2 TMB-E4F2-1L1 1 3 OF 3 REV. 5
TMB-E4F2-1L1 价格&库存

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