DKS-SOLDERPASTE15G

DKS-SOLDERPASTE15G-ND Solder Paste No-Clean Sn63/Pb37 in 5cc Syringe 15g T3 Mesh Product Highlights • • • • • Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding • • • • Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passed BONO test Specifications Alloy: Mesh Size: Micron Range: Flux Type: Flux Classification: Metal Load: Melting Point: Packaging: Shipped with: SN63/Pb37 T3 25-45 Synthetic No-Clean REL0 88% Metal by Weight 183°C (361°F) 5cc/15g syringe Plunger, syringe tip and cap Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): J-STD-005A (Solder Pastes): J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): RoHS 2 Directive 2011/65/EU: Page 1 of 3 www.digikey.com Yes Yes Yes No Test Results Test J-STD-004 or other requirements as stated Copper Mirror Corrosion Quantitative Halides Electrochemical Migration Surface Insulation Resistance 85°C, 85% RH @ 168 Hours Track Value Viscosity - Malcom @ 10RPM/25°C (x10³mPa/s) Visual Conflict Minerals Compliance REACH Compliance Test Requirement Result IPC-TM-650: 2.3.32 IPC-TM-650: 2.6.15 IPC-TM-650: 2.3.28.1 IPC-TM-650: 2.6.14.1 IPC-TM-650: 2.6.3.7 L: No breakthrough L: No corrosion L: 12 months Unrefrigerated: 6 months Guaranteed for 12 months from date of manufacture regardless of refrigeration. Warranty Guaranteed for 12 months from date of manufacture regardless of refrigeration. Please retain original bill of sale and solder paste in original container as we may request its return for internal R&D testing purposes. Transportation This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life. Stencil Life >8 hours @ 20-50% RH 22-28°C (72-82°F) >4 hours @ 50-70% RH 22-28°C (72-82°F) Page 2 of 3 www.digikey.com Process for Soldering Surface Mount Technology (SMT) Devices to Printed Circuit Boards (PCBs): 1. Visually inspect the solder paste before use to ensure it is desired consistency. Do not use if solder paste is dried out or clumpy. 2. Apply solder paste to the PC Board pads using stencil printing machine, foil stencil & squeegee, or dot dispensing. 3. Carefully place SMT device using pick & place machine, tweezers, or vacuum pen. 4. Using machine, pick or tweezers gently press SMT device down into solder paste to ensure good contact. 5. Reflow using reflow oven, bottom heater, or hot air gun. Monitor temperature near PC Board with thermal probe to achieve a good reflow profile. 6. Allow PC Board to cool down. 7. Inspect solder joints for open and short circuits. • If rework is required: apply DKS-FLUXPEN10ML-ND and use soldering iron to reheat joints. Extra flux helps ensure solder will flow where needed and avoid short circuits. 8. If desired, remove excess flux using isopropyl alcohol and lint free wipes or cotton swabs. Printer Operation Print Speed: 25-100mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA) Recommended Profile Reflow profile for Sn63/Pb37 solder assembly, designed as a starting point for process optimization. Page 3 of 3 www.digikey.com