SPB106-WiFi 802.11b+g SMD WiFi Board
Data Sheet
SPB106
WiFi SMD Board
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Revision History
Revision
Revision date
Description
PA1
2010-02-11
First issue
PA2
2010-02-17
Updated after review
A
2010-02-22
Release after review and updates
PB1
2010-02-26
Info about SDIO interface added.
B
2010-03-17
FCC number corrected
PC1
2010-04-12
RF test switch information added
PC2
2010-04-26
SPIO SPI interface updated. Solder profile updated
PC3
2010-06-18
Table and figure numbering corrected
Disclaimer and copyright notice
Information in this document, including URL references, is subject to change without notice.
THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY
OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for
infringement of any proprietary rights, relating to use of information in this document is disclaimed.
No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein.
The Wi-Fi Alliance Member Logo is a trademark of the Wi-Fi Alliance.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2009 H&D Wireless AB. All rights reserved.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 2 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
DATA SHEET ...................................................................................................................... 1
1
INTRODUCTION ........................................................................................................... 5
1.1
Overview ......................................................................................................................................................... 5
1.2
Key Features .................................................................................................................................................. 5
2
HARDWARE ARCHITECTURE .................................................................................... 6
2.1
Block Diagram ............................................................................................................................................... 6
2.2
Order information ......................................................................................................................................... 6
3
ELECTRICAL DATA..................................................................................................... 7
3.1
Absolute maximum ratings ........................................................................................................................... 7
3.2
ESD ................................................................................................................................................................. 7
3.3
Recommended operating conditions ............................................................................................................ 7
3.4
Power Consumption ...................................................................................................................................... 7
3.5
RF Performance ............................................................................................................................................. 8
3.6
Digital pin characteristics ............................................................................................................................. 9
4
PIN CONFIGURATIONS ............................................................................................. 11
4.1
Pin Configuration ........................................................................................................................................ 11
4.2
Pin assignments ............................................................................................................................................ 11
5
APPLICATION INFORMATION .................................................................................. 12
5.1
Power Supply ............................................................................................................................................... 12
5.2
Reset/Shutdown ........................................................................................................................................... 12
5.3
Power save .................................................................................................................................................... 12
5.4
Interfaces ...................................................................................................................................................... 12
5.5
RF interface .................................................................................................................................................. 14
5.6
General application information ................................................................................................................ 14
6
PACKAGE SPECIFICATIONS ................................................................................... 17
6.1
Mechanical outline of the SPB106 circuit board ....................................................................................... 17
6.2
Markings on the SPB106 ............................................................................................................................. 17
6.3
Package dimensions ..................................................................................................................................... 18
6.4
Mounting information ................................................................................................................................. 18
7
STANDARDS COMPLIANCE ..................................................................................... 20
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 3 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
7.1
IEEE/IETF ................................................................................................................................................... 20
7.2
WiFi .............................................................................................................................................................. 20
7.3
Regulatory .................................................................................................................................................... 20
8
SALES OFFICES ........................................................................................................ 23
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 4 (23)
Data Sheet - Preliminary
1
SPB106 WiFi SMD Board
INTRODUCTION
1.1 Overview
SPB106 is SMD module with the HDG104 WLAN System In Package, SIP module and all
peripheral components required. It is a complete solution designed to be surface mount on any
host system needing a complete WiFi solution.
SPB106 enables a cost efficient ultra low power, high performance and feature rich client solution.
It provides up to 54 Mbit/s data rate when operating in the OFDM mode and up to 11 Mbit/s data
rate when operating in the DSSS/CCK mode.
The host interface supports SPI communication when used in the 10-pin RF-header connection
(WLESS) and SDIO when used in a custom board with the AVR32UC3A3, and software drivers
and a complete application example is included in Atmel AVR32 UC3B Software Framework from
release 1.5.0 and onwards
1.2 Key Features
Data Rates: 1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54Mbps
Modulation: QPSK, 16QAM, 64QAM DBPSK, DQPSK, CCK, OFDM with BPSK
WEP and AES hardware encryption accelerator up to 128 bits
Chip Antenna and connector for external antenna (optional) mounted on the board.
Low power consumption due to efficient class AB PA design
UMA Compliant
Advanced power management for optimum power consumption at varying load.
Bluetooth Coexistence support
Power Supply 3.3 V from EVK board
Small footprint 25.8 X 20.6 mm
RoHS Compliant
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 5 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
2 HARDWARE ARCHITECTURE
2.1 Block Diagram
HDG104
Host
interface
SDIO/
SPI
Chip antenna
and connector
for external
antenna
Clock generation
3.3 V
power
DC/DC for internal power
Figure 2.1: Block diagram.
2.2 Order information
.
Part No.
option
SPB106/1
SPB106/3
SPB106/e/3
Ext antenna connector
not mounted.
Batch size
Shipment package
10/100
Unit in ESD bag
1K/10K/50K
Tray
1K/10K/50K
Tray
Table 2-1: Order information.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 6 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
3 ELECTRICAL DATA
3.1 Absolute maximum ratings
Rating
Min
Max
Unit
Supply voltage
0
4
V
10
dBm
+125
o
Input RF level
Storage temperature
-50
C
Table 3-1: Abolute maximum ratings. Exceeding any of the maximum ratings, even briefly lead to deterioration in
performance or even destruction. Values indicates condition applied one at the time.
3.2 ESD
HDG104 withstands ESD voltages up to 2000 V tested with HBM (Human Body Model)
according to JESD22-A114 and up to 300 V tested with MM (Machine Model) according to
JESD22-A115.
3.3 Recommended operating conditions
Rating
Min
Typ
Max
Unit
Supply Voltage VCC
2.75
3.3
3.6
V
Operating temperature
Operating temperature, reduced spec, no
damage.
-20
+25
+70
o
-30
+25
+85
o
C
C
Table 3-2: Recommended operating conditions
3.4 Power Consumption
3.4.1 Current Consumption
Mode
Conditions
Parameter
Voltage
All modes
VBAT_P+VCC+
VPA+VBAT_32K
All modes
Min
Typ
Max
Unit
3.6 V
250
mA
VPA
3.6 V
150
mA
All modes
VBAT_P+VCC
3.6 V
150
mA
All modes
DVDD
1.2 V
100
mA
All modes
25ºC
VBAT_32K
3.3 V
10
μA
Tx
25ºC
DVDD
1.2 V
15
mA
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Data Sheet 1451-SPB106
Confidential
page 7 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Rx
25ºC
Sleep
25ºC
Sleep
Soft
Shutdown
Soft
Shutdown
25ºC
Shutdown,
25ºC DVDD OFF
25ºC
25ºC
DVDD
VBAT_P+VCC+
VPA+VBAT_32K
1.2 V
60
mA
3.3 V
30
μA
DVDD
VBAT_P+VCC+
VPA+VBAT_32K
1.2 V
110
μA
3.3 V
20
μA
DVDD
VBAT_P+VCC+
VPA+VBAT_32K
1.2V
70
μA
3.3 V
15
μA
Table 3-3: Current consumption in different modes.
3.4.2 Power Consumption
Tamb=25°C, VCC=VBAT_P=VBAT_32K=VPA=3.3 V, DVDD =1.2 V
Mode
OutputPower
Power Consumption
Comments
TX 802.11b
+17 dBm
725 mW
1, 2, 5.5, 11 Mbit/s
TX 802.11g
+14 dBm
590mW
6, 9, 12, 18, 24, 36, 48, 54 Mbit/s
RX 802.11b
N/A
220mW
RX 802.11g
N/A
230mW
Power Save
Sleep
N/A
0,4 mW
N/A
0,2mW
Soft Shutdown
N/A
0,15 mW
Receive only, 2s RX beacons
No receive, FW loaded, only LFC
running
No receive, No FW loaded, only
LFC
running
Shutdown
N/A
0,05 mW
No FW loaded, DVDD OFF,
Table 3-4: Current consumption in different modes.
data
3.5 RF Performance
VCC=VPA= 2.75 – 3.6V, DVDD=1.15 - 1.25V External supply, Tamb= -20 – +70°C
Parameter
Conditions
Min
Frequency range
Typical
2400
RF impedance
Max
Units
2500
MHz
50
ohm
Transmitter performance
Output power
Output power
QPSK, Calibrated.
OFDM 54Mbit/s,
Calibrated.
EVM at +15dBm
QPSK
30
35
%
EVM at +11dBm
OFDM 54MBit/s
3.5
5
%
Rev. PC3 06/2010
+16,5
+17
+17,5
dBm
+13,5
+14
+14,5
dBm
Data Sheet 1451-SPB106
Confidential
page 8 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Receiver performance
Receiver sensitivity
DPSK 1Mbit/s
-96
dBm
Receiver sensitivity
-92
dBm
-91
dBm
Receiver sensitivity
QDPSK 2Mbit/s
CCK/DPSK
5.5Mbit/s
CCK/BPSKK
11Mbit/s
-88
dBm
Receiver sensitivity
OFDM 6Mbit/s
-91
dBm
Receiver sensitivity
OFDM 9Mbit/s
-90
dBm
Receiver sensitivity
OFDM 12Mbit/s
-88
dBm
Receiver sensitivity
OFDM 18Mbit/s
-86
dBm
Receiver sensitivity
OFDM 24Mbit/s
-83
dBm
Receiver sensitivity
OFDM 36Mbit/s
-80
dBm
Receiver sensitivity
OFDM 48Mbit/s
-76
dBm
Receiver sensitivity
OFDM 54Mbit/s
-74
dBm
Receiver sensitivity
Table 3-5: RF performance.
3.6 Digital pin characteristics
3.6.1 SDIO timing characteristics
The SDIO/SPI-interface can run in two different modes, Default mode and High speed mode.
SDIO 1-bit default mode is selected at Power On Reset. The default mode is showed in
Figure 3-1: SDIO/SPI timing diagram (default mode) and table: Table 3-6: SDIO/SPI timing
parameter values (default mode). For the high speed mode see Figure 3-2: SDIO/SPI timing
diagram (high speed mode) and Table 3-7: SDIO/SPI timing parameter values (high speed mode).
Condition:
VDDIO= 1.7 – 3.6 V, TA= -20 – +70°C
Parameter Condition Min Typical Max Units
El
Figure 3-1: SDIO/SPI timing diagram (default mode)
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 9 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Max
ns
Parameter
Symbol
Min
Input set-up time
tISU
5
ns
Input hold time
tIH
5
ns
Clock fall time
tTHL
10
ns
Clock rise time
tTLH
10
ns
Output delay time
tODLY
0
40
ns
Min
Max
ns
Comments
Table 3-6: SDIO/SPI timing parameter values (default mode)
Figure 3-2: SDIO/SPI timing diagram (high speed mode)
Parameter
Symbol
Clock fall time
tTHL
3
ns
Clock rise time
tTLH
3
ns
Output delay time
tODLY
2,5
14
ns
Output hold time
tOH
2.5
Comments
ns
Table 3-7: SDIO/SPI timing parameter values (high speed mode)
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 10 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
4 PIN CONFIGURATIONS
4.1 Pin Configuration
Figure 4-1: Package pin out, top
view
Figure 4.1: Package pin out, top view
4.2 Pin assignments
Pin
Function
Type
Description
1
SDIO_D2
I/O
Databit 2
2
NC
-
Not used
3
SDIO_D1 / SPI_IRQ
I/O
Databit 1 / Interrupt
4
RESET
I
Shutdown
5
SDIO_D3 / SPI_CS
I/O
Databit 3/ SPI Chip Select
6
SDIO_CMD / SPI_MOSI
I/O
SDIO_CMD / SPI_MOSI
7
SDIO_D0 / SPI_MISO
I/O
Databit 0 / SPI_MISO
8
SD_CLK / SPI_CLK
I
SPI Clock
9
GND
S
Ground
10
VCC
S
Power supply, 3.3V
11-23
GND
S
24
DVDD
S
Ground
Power supply to HDG104 (for version without onboard DC-DC converter
25
GND
S
Ground
26
GND
S
Ground
Table 4-1: Pin assignments
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 11 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
5 APPLICATION INFORMATION
5.1 Power Supply
SPB106 should be powered by a 3.3V supply.
5.2 Reset/Shutdown
The RESET pin is connected to HDG104 SHUTDOWN pin, and is active low. It should be set high
in normal operation.
Since it has an internal pull-up, it can be left unconnected. Pulling the SHUTDOWN pin low, set the
SPB106 in Shutdown mode. This turns OFF most parts of the circuit and minimizes the current
consumption. All I/O interface pins are set to predefined states (high, low or high-z) when in
Shutdown mode. To end Shutdown mode set SHUTDOWN pin high and reload FW and MIB.
5.3 Power save
Power save is a energy saving mode where SPB106 is only listening at regular intervals for the
beacons transmitted from an access point and is set in sleep mode in between. During this sleep
mode, FW is kept in RAM but all not needed functions are turned off. Since the receive time is very
short compared to the listening interval the average current consumption is reduced significantly.
The timing of the listening interval is based on the LFC (32 kHz) clock. The LFC is implemented
internally.
For detailed information regarding the power save function see the Application manual.
5.4 Interfaces
To communicate with the SPB106 the SPI or SDIO interface is used.
5.4.1 SPI interface
The SPI interface signals are connected to the host boards SPI bus. It can coexist with other SPI devices on
the same bus. The SPI_CS signal is the Chip Select signal, and it is implemented with a General Purpose
I/O pin.
The SPI bus signals on the Atmel AVR32 family processors use different pins for different parts in the family,
and depending on the application the processors can be configured to use different pins for SPI. As an
example for the UC3A the following configuration can be made:
Pin
Function
Pin on AVR32
Description
1
-
-
Not used
2
-
Not used
3
SPI_IRQ
4
RESET
Any GPIO pin, configured to generate interrupt.
(optional)
Any GPIO pin, put SPB106 in shutdown mode, reset.
(optional)
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
Interrupt
Shutdown
page 12 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
5
SPI_CS
PB09 (SPI1_NPCS[0])
SPI Chip Select
6
SPI_MOSI
PB10 (SPI1 MOSI)
SPI_MOSI
7
SPI_MISO
PB08 (SPI1 MISO)
SPI_MISO
8
9, 11-23,
25,26
SPI_CLK
PB07 (SPI1 SCK)
SPI Clock
GND
-
Ground
10
VCC
-
24
DVDD
-
Power supply, 3.3V
Power supply 1.2V (for
version without on-board
DC-DC converter
UC3A
SPB105
PB10
MISO
MOSI
6
PB07
SCK
8
PB09
CS
5
GPIO
(RESET)
4
GPIO
(IRQ)
3
PB08
7
3.3V
10
9
5.4.2 SDIO interface
For the SDIO interface four GPIO pins are used as data bits, these can be any of the MCI groups
available on the AVR32 processor. The SDIO_CMD should be in the same group. The optional
RESET can be connected to be any GPIO pin. This is an example of pins to can be used:
Pin
Function
Pins on AVR32 family
processor
Description
1
SDIO_D2
PA17 (MCI – DATA10)
Databit 2
2
-
-
Not used
3
SDIO_D1
PA18 (MCI – DATA9)
Databit 1
4
RESET
Any GPIO (optional)
Shutdown
5
SDIO_D3
PA16 (MCI – DATA11)
Databit 3
6
SDIO_CMD
PA15 (MCI – CMD [1])
SDIO_CMD
7
SDIO_D0
PA19 (MCI – DATA8)
Databit 0
8
9, 11-23,
25,26
SD_CLK
PA27 (MCI – CLK)
SDIO Clock
GND
-
Ground
10
VCC
-
24
DVDD
-
Power supply 3.3V
Power supply 1.2V (for version without on-board DCDC converter)
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 13 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
AVR32
SPB106
PA18
D0
D1
3
PA17
D2
1
PA16
D3
5
PA15
CMD
CLK
6
PA19
PA27
GPIO
7
8
(RESET)
3.3V
4
10
9
5.5 RF interface
The SPB106 has a high performance chip antenna as the primary RF interface. To enable RF
measurements a coaxial connector is available. The connector is switching and compatible with
MuRata measurement probe MXHS83QH3000 and similar.
5.6 General application information
5.6.1 Design directions
The design using the SPB106 must be performed according to good RF design considerations. All
the leads shall be as short as possible between the circuit pins and the external components. Keep
the area under the antenna free from all metal including signal or ground wires.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 14 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Figure 5-1: Proposed keep out area
.
5.6.2 Soldering
The SPB106 is a surface mount PCB module. The recommended reflow soldering profile is
pictured in Figure 5-2.
HDG104
Pin I/O SignalSR
Figure 5-2: Reflow Temperature Profile.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 15 (23)
Data Sheet - Preliminary
Type
PSR
SPB106 WiFi SMD Board
Rising Zone
Preheat
Zone
Reflow
Zone
Peak
Zone
Cooldown
Zone
125ºC-Peak
1-3 ºC/s
110190ºC
60-120 s
>220ºC
>30s
230250ºC
Peak-125ºC
No
Comment
Table 5-1: Zone temperatures
5.6.3 Environmental statement
The SPB106 is designed and manufactured to comply with the RoHS and Green directives.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 16 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
6 PACKAGE SPECIFICATIONS
6.1 Mechanical outline of the SPB106 circuit board
25.80 mm
20.60 mm
mm
Figure 6-1: Mechanical drawing (top view)
6.2 Markings on the SPB106
The circuit board are marked with a sticker with the units serial number. The FCC id. X02SHDG104
is printed on the top of the PCB.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 17 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
6.3 Package dimensions
W
A3
11 10 9 8 7 6 5 4 3 2 1
L
A1
12
26
13
25
14
24
15
23
16
22
A2
Symbol
Text
Meas
[mm]
L
Module Length
25.80
W
Module Width
20.60
P1
Pad length
1.2
P2
Pad width
0.6
A1
Pad edge to PCB edge
0.40
A2
Pad edge to pad edge
22.6
A3
Pad edgeto pad edge
min
0.75
P2
P1
17 18192021
SPB106 pads (from top)
6.4 Mounting information
Recommended land pattern on the PCB
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 18 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Figure 6-2: Land pattern for SPB106
Figure 6-2 shows the recommended land pattern for the SPB106. All measurements referred to the
outside corner of the pad outline.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 19 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
7 STANDARDS COMPLIANCE
7.1 IEEE/IETF
Standard
Revision
Description
802.11
802.11 R2003
WLAN MAC& PHY
802.11b
802.11 R2003
High rate DSSS (5,5/11Mbit/s)
802.11d
802.11 R2003
Operation in different regulatory domains
802.11e
D9,0 Aug. 2004
QoS enhancements
802.11g
-2003
Extended rate PHY (ERP-PBCC, DSS-OFDM)
802.11i
-2004
Security enhancements
802.11k
Draft 11.0, 2008
Wireless network management
802.11r
Draft 9.0, 2008
Fast BSS transition
802.11h
1997 edition
Bridge tunneling
RFC1023
Inherent
Frame encapsulation
802.15.2
Bluetooth coexistence
Table 7-1: Applicable IEEE standards
7.2 WiFi
Specification
Description
Revision
Wi-Fi 802.11b with WPA system inter
operability test plan for IEEE 802.11b
devices
WiFi 802.11g with WPA system inter
operability test plan
802.11b devices with WPA
2.1
802.11g devices with WPA
Convergence services over WiFiGAN
2.0
UMA (FMCA)
WMM (including WMM Power Save)
Aug. 2005
Ver 1.1
Table 7-2: Applicable WiFi standards
7.3 Regulatory
Country
Approval
authority
Regulatory
Frequency band
USA
FCC
FCC ID XO2HDG104
2.4 GHz -2.4835 GHz
Canada IC
RSS
2.4 GHz -2.4835 GHz
Europe
ETSI
2.4 GHz -2.4835 GHz
National
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 20 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
Table 7-3: Regulatory Standards
7.3.1 FCC (United States of America)
This equipment complies with Part 15 of the FCC rules and regulations.
To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following
regulations:
1. The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not
visible when the module is installed inside another device, then the outside of the device into which
the module is installed must also display a label referring to the enclosed module. This exterior
label can use wording such as the following:
Example of label required for OEM product containing SPB106 module
Contains FCC ID: XO2HDG104
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (i) this device may not cause harmful interference and (ii) this device must accept any
interference received, including interference that may cause undesired operation.
Any similar wording that expresses the same meaning may be used.
2. To be used with the SPB106 module, the external antennas have been tested and approved
which are specified in here below. The SPB106 Module may be integrated with custom design
antennas which OEM installer must authorize following the FCC 15.21 requirements.
WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular
transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the
outside of the final product enclosure that displays the contents shown below. If the FCC ID is not
visible when the equipment is installed inside another device, then the outside of the device into
which the equipment is installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired operation
(FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation
distance of at least 20 cm from all persons and must not be co-located or operating in conjunction
with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating
conditions for satisfying RF exposure compliance. This device is approved as a mobile device with
respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable
exposure conditions (FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's
authority to operate this equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 21 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
and, if not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his
own expense (FCC section 15.105).
7.3.2 IC (Canada)
Equipment is subject to certification under the applicable RSSs, shall be permanently labeled on
each item, or as an inseparable combination. The label must contain the following information for
full compliance:
Certification Number:
Manufacturer’s Name, Trade Name or Brand Name
Model Name:
IC: 8713A-HDG104
H&D Wireless AB
HDG104
IMPORTANT: This equipment for which a certificate has been issued is not considered certified if it
is not properly labeled. The information on the Canadian label can be combined with the
manufacturer's other labeling requirements
IMPORTANT: Operation is subject to the following two conditions: (1) this device may not cause
harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
IMPORTANT: To reduce potential radio interference to other users, the antenna type and its gain
should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication.
IMPORTANT: The installer of this radio equipment must ensure that the antenna is located or
pointed such that it does not emit RF field in excess of Health Canada limits for the general
population. Consult Safety Code 6, obtainable from Health Canada's website www.hc-sc.gc.ca/rpb.
7.3.3 ETSI (Europe)
The SPB106 module has been certified for use in European union countries according to ETSI EN
300 328 (Electromagnetic compatibility and Radio spectrum matters for equipment operating in the
2,4 GHz ISM band using spread spectrum modulation techniques). This standard is harmonized
within the European Union and covering essential requirements under article 3.2 of the R&TTEdirective.
If the SPB106 module are incorporated into a product, the manufacturer must ensure compliance
of the final end-user product to the European harmonized EMC and low voltage/safety standards.
A declaration of conformity must be issued for the product including compliance references to
these standards. Underlying the declaration of conformity a technical construction file (TCF),
including all relevant test reports and technical documentation, must be issued and kept on file as
described in Annex II of the R&TTE-directive.
Furthermore, the manufacturer must maintain a copy of the SPB106 module documentation and
ensure the final product does not exceed the specified power ratings, antenna specifications,
and/or installation requirements as specified in the user manual. If any of these specifications are
exceeded in the final product, a complete re-test must be made in order to comply with all relevant
standards as basis for CE-marking. A submission to notified body must be used only if deviations
from standards have been found or if non-harmonized standards have been used.
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 22 (23)
Data Sheet - Preliminary
SPB106 WiFi SMD Board
8 SALES OFFICES
Global Sales Office Sweden
H&D Wireless AB
H&D Wireless AB
Norgegatan 1
164 32 Kista
Sweden
E-mail: info@hd-wireless.se
Support: support@hd-wireless.se
Home page: www.hd-wireless.se
Local sales offices and representatives see www.hd-wireless.se
Rev. PC3 06/2010
Data Sheet 1451-SPB106
Confidential
page 23 (23)
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