B2141IR--A1C000373U1930

Side View Chip LED B2141IR--A1C000373U1930 Harvatek Surface Mount CHIP LEDs Data Sheet B2141IR--A1C000373U1930 Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 1/14 Side View Chip LED B2141IR--A1C000373U1930 DISCLAIMER............................................................................................................................ 3 LIFE SUPPORT POLICY ............................................................................................................. 3 PRODUCT SPECIFICATIONS ................................................................................................. 4 ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ................................................ 4 LABEL SPECIFICATIONS ....................................................................................................... 5 ELECTRO-OPTICAL CHARACTERISTICS ............................................................................. 6 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW SOLDERING ............................................................................................................................. 7 CHARACTERISTICS OF B2141IR ............................................................................................... 8 PACKAGING .......................................................................................................................... 10 TAPE DIMENSION ................................................................................................................... 10 REEL DIMENSION ................................................................................................................... 11 PACKING ............................................................................................................................... 11 DRY PACK ............................................................................................................................. 12 BAKING................................................................................................................................. 12 PRECAUTIONS ....................................................................................................................... 12 REFLOW SOLDERING .......................................................................................................... 13 REWORKING .......................................................................................................................... 13 CLEANING ............................................................................................................................. 13 CAUTIONS OF PICK AND PLACE .............................................................................................. 14 REVISE HISTORY.................................................................................................................... 14 Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 2/14 Side View Chip LED B2141IR--A1C000373U1930 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 3/14 Side View Chip LED B2141IR--A1C000373U1930 Product Specifications Item Specification Material Quantity Peak Wavelength Typ:940nm λp @100 mA/ TS = 25℃ Radiant Intensity 30-60 mW/sr Ie @100 mA/ TS = 25℃ Forward Voltage 1.2-1.6V VF @100 mA/ TS = 25℃; Tolerance: +0.1V Reverse Current < 10 μA IR @ VR = 5V Resin Clear Epoxy Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λP and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 4/14 Side View Chip LED B2141IR--A1C000373U1930 Label Specifications ■Harvatek P/N: B 214 Product 1 IR-- Dice Q’ty A1C 0003 73 Current 1. PCB 1:Single 100mA 2. Package Color Series Number 3.0(L)x2.0(W)x1.0(H) mm IR : 940nm X001~XZZZ U1930 Taping Customer Code Taping Customer style Product Code Q’ty ■ Lot No.: Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 5/14 Side View Chip LED B2141IR--A1C000373U1930 Absolute Maximum Rating At 25℃ Symbol Parameters Ratings Units 150 mA IF Forward Current IFP Peak Forward Current 1 A VR Reverse Voltage 5 V Topr Operating Temperature -40 ~ +85 ℃ Tstg Storage Temperature -40 ~ +100 ℃ Tsol Soldering Temperature 260 ℃ Notes 1 2 Notes: 1. IFP Conditions--Pulse Width≦100μs and Duty≦1%. 2. Soldering time≦5 seconds. Electro-Optical Characteristics Symbol Parameters Test conditions Min Typ Max Units Notes Ie Radiant Intensity IF=100mA 30 43 60 mW/sr 3 λP Peak Wavelength IF=100mA - 940 - nm 4 Δλ Spectral bandwidth at 50% of Imax IF=100mA 50 - nm VF Forward Voltage IF=100mA 1.2 - 1.6 V IR Reverse Current VR=5V - - 10 μA - 140 - - 120 - 2θ1/2 Angle of Half Intensity (X) Angle of Half Intensity (Y) IF=100mA 5 deg Notes: 3. Radiant Intensity (Ie) Bin: Color Bin Code Spec. Range PRU 30-40 mW/sr PVY 40-50 mW/sr PZC 50-60 mW/sr IR 4. Peak Wavelength (λP) Bin: Color Bin Code Spec. Range IR B 920-960 nm Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 6/14 Side View Chip LED B2141IR--A1C000373U1930 Notes: 5. Forward Voltage (VF) Bin: Color Bin Code Spec. Range D5 1.2-1.4 V D6 1.4-1.6 V IR Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit: mm Tolerance: +/-0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction. Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 7/14 Side View Chip LED B2141IR--A1C000373U1930 Characteristics of B2141IR Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 8/14 Side View Chip LED B2141IR--A1C000373U1930 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 4 weeks after unpacked. Unused products must be 5. 6. repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. The appearance and specifications of the products may be modified for improvement without further notice. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current. Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 9/14 Side View Chip LED B2141IR--A1C000373U1930 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel 3.2±0.10 2.20±0.10 1.20±0.10 3K Unit: mm Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 10/14 Side View Chip LED B2141IR--A1C000373U1930 Reel Dimension Packing 5 or 10 boxes per carton is available depending on shipment quantity. Official Product Tentative Product HT Part No. B2141IR--A1C000373U1930 **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 02/24/2020 Version 1.1 Page 11/14 Side View Chip LED B2141IR--A1C000373U1930 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. A humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 4 weeks. The conditions are as followings: 1. 60±3℃×(12~24hrs)and