a module solution provider
WS2119-A0
WS2119-F0
Ultralow Power 915MHz and BLE Wireless MCU Module
STM S2-LP with PA & BlueNRG-1 Solution
Datasheet
Draft 0.7
Prepared By
Reviewed By
Approved By
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DOC No: WS2119-A0A-DTS-D07
Index
1. OVERVIEW ....................................................................................................................................... 3
1.1. GENERAL FEATURES ........................................................................................................................ 3
1.2. MODELS FUNCTIONAL BLOCKS .......................................................................................................... 3
2. FUNCTIONAL FEATURES .................................................................................................................. 4
2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 4
2.2. BLOCK FUNCTIONAL FEATURE ........................................................................................................... 5
BlueNRG-1 : Bluetooth low energy wireless SOC ....................................................................... 5
S2-LP Sub-1Ghz transceiver ......................................................................................................... 5
RFX1010 : Sub-1GHz RF Front-End Module................................................................................. 6
STSAFE-A1SX : Secure Element ( WS2119-F0 only ) .................................................................... 6
3. MODULE OUTLINE ........................................................................................................................... 7
3.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................. 7
3.2. PIN DESCRIPTION ........................................................................................................................... 8
4. MODULE SPECIFICATIONS ............................................................................................................. 10
4.1. ABSOLUTE MAXIMUM RATINGS ...................................................................................................... 10
4.2. ESD RATINGS .............................................................................................................................. 10
4.3. RECOMMENDED OPERATING CONDITIONS ......................................................................................... 10
4.4. POWER CONSUMPTION SUMMARY .................................................................................................. 11
4.5. 2.4GHZ GFSK (BLUETOOTH LOW ENERGY) RF CHARACTERISTICS ......................................................... 12
4.6. SUB-1GHZ RF CHARACTERISTICS .................................................................................................... 12
4.7. INTERNAL 16-MHZ CRYSTAL OSCILLATOR ( FOR BLUENRG-1 ) ............................................................. 13
4.8. INTERNAL 32.768-KHZ CRYSTAL OSCILLATOR ( FOR BLUENRG-1 ) ........................................................ 13
4.9. INTERNAL 50MHZ CRYSTAL OSCILLATOR ( FOR S2-LP ) ....................................................................... 14
4.10. BLUENRG-1 DIGITAL I/O SPECIFICATIONS ....................................................................................... 14
4.11. S2-LP DIGITAL INTERFACE SPECIFICATION ........................................................................................ 15
4.12. RFX1010 DIGITAL INTERFACE SPECIFICATION ................................................................................... 15
4.13. RFX1010 GAIN VS. POUT ........................................................................................................... 16
4.14. RFX1010 CW CURRENT VS. POUT ............................................................................................... 16
4.15. RFX1010 VDET VS. POUT ........................................................................................................... 17
4.16. MORE CHARACTERISTICS.............................................................................................................. 17
5. DESIGN RECOMMENDATIONS ....................................................................................................... 18
5.1. GPIO USAGE OF BLUENRG-1 ........................................................................................................ 18
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5.2. POWER VOLTAGE RANGE ............................................................................................................... 18
5.3. DEBUG PORT ............................................................................................................................... 19
5.4. DEBUGGING TIPS.......................................................................................................................... 19
5.5. PRE-PROGRAMMED BOOTLOADER ............................................................................................ 19
5.6. ANTENNA SELECTION GUIDE ........................................................................................................... 20
5.7. REFERENCE SCHEMATIC ................................................................................................................. 21
5.8. MODULE L AYOUT RECOMMENDATIONS ............................................................................................ 21
6. PACKAGE INFORMATION ............................................................................................................... 22
6.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 22
6.2. PACKAGE MARKING ...................................................................................................................... 24
7. SMT AND BAKING RECOMMENDATION ....................................................................................... 25
7.1. BAKING RECOMMENDATION ........................................................................................................... 25
7.2. SMT RECOMMENDATION .............................................................................................................. 25
8. REGULATORY INFORMATION ........................................................................................................ 27
8.1. UNITED STATES ............................................................................................................................ 27
8.2. TAIWAN ...................................................................................................................................... 29
9. HISTORY CHANGE .......................................................................................................................... 30
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1. OVERVIEW
The WS2119-A0 series is a sub-1GHz with PA and Bluetooth® low energy ultralow power wireless
MCU module. This module is built-in STM S2-LP and BlueNRG-1 chip.
The module is a cost-effective, high performance, ultra-low power, sub-1GHz and Bluetooth® low
energy RF devices. Very low active RF and MCU current and low-power mode current consumption
provide excellent battery lifetime and allow for operation on small coin cell batteries and in
energy-harvesting applications.
1.1. General Features
STM BlueNRG-1, S2-LP, sub-1GHz PA, 16MHz, 50MHz & 32.768KHz crystals, DC2DC, and RF
connector on a single module.
Stamp-hole 38pins package.
Dimension 22mm(L) x 24mm(W) x 2.8mm(H)
High performance, ultra-low power Cortex-M0 32-bit Microcontroller
Programmable 160 KB Flash
24 KB RAM with retention (two 12 KB banks)
Up to +8dBm BLE RF output power, up to +27dBm sub-1GHz RF output power (1)
Excellent performance of receiver sensitivity. Up to -88dBm (BLE) and -130dBm (Sub-1GHz).
Low Power and Wide I/O Voltage Range: 1.8 to 3.6V
- Internal DC-DC converter built-in
Operating temperature range: -40 °C to +85 °C
(1) In order to comply with FCC, NCC, Sigfox limits, the maximum RF output power must be reduced. See the
4. MODULE SPECIFICATIONS for details.
1.2. Models Functional Blocks
Model
BLE & Sub-1GHz
Secure Element
WS2119-A0
V
-
WS2119-F0
V
V
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2. FUNCTIONAL FEATURES
2.1. Module Block Diagram
DIO
pins
WS2119-A0
WS2119-F0
WS2119-F0 only
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2.2. Block Functional Feature
BlueNRG-1 : Bluetooth low energy wireless SOC
Bluetooth specification compliant master, slave and multiple roles simultaneously,
single-mode Bluetooth low energy SOC
Integrated linear regulator and DC-DC step-down converter
High performance, ultra-low power Cortex-M0 32-bit based architecture core
Programmable 160 KB Flash
24 KB RAM with retention (two 12 KB banks)
1 x UART interface
1 x SPI interface
1 x I2C interface
15 GPIO
2 x multifunction timer
10-bit ADC
Watchdog & RTC
DMA controller
PDM stream processor
16 MHz crystal oscillator built-in.
32 kHz crystal oscillator built-in.
Battery voltage monitor and temperature sensor
Up to +8 dBm available output power (at antenna connector)
Excellent RF link budget (up to 96 dB)
BALF-NRG-01D3 BALUN built-in.
Accurate RSSI to allow power control
S2-LP Sub-1Ghz transceiver
Narrow band ultra-low power Sub-1GHz transceiver tuned for 860-943 MHz frequency
bands.
Suitable for SigFox applications
Modulation schemes: 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, OOK, and ASK
Air data rate from 0.3 to 500 kbps
Programmable RF output power up to +27 dBm ( with RFX1010 RF front-end chip)
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Excellent performance of receiver sensitivity: down to -130 dBm
Programmable RX digital filter
Programmable channel spacing
Low duty cycle RX/TX operation mode
Integrated linear regulator and DC-DC step-down converter
RFX1010 : Sub-1GHz RF Front-End Module
Integrated PA
Integrated LNA with programmable bypass
STSAFE-A1SX : Secure Element ( WS2119-F0 only )
Data integrity over the Sigfox network:
- Signature of payloads before uplink
- Signature of payloads before uplink
Optional data confidentiality over the Sigfox network:
- Encryption of payloads before uplink
- Decryption of downlink payloads
Advanced symmetric cryptography : AES-128
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3. MODULE OUTLINE
3.1. Signal Layout (Top View)
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3.2. Pin Description
Table 3-1. Pin Description
Pin
No.
Pin Name
Type
1
GND
2
RESETN
Digital Input
3
DIO13
Digital I/O
4
DIO12
Digital I/O
5
TEST
6
DIO11
Digital I/O
General purpose digital I/O of BlueNRG-1
7
DIO10
Digital I/O
General purpose digital I/O of BlueNRG-1
8
DIO9
Digital I/O
General purpose digital I/O of BlueNRG-1
9
DIO8
Digital I/O
General purpose digital I/O of BlueNRG-1
10
GND
GND
11
VBAT
POWER
12
GND
GND
13
DIO7/BOOT
GND
Description
Digital Input
(1)
Digital I/O
14
DIO6
Digital I/O
15
DIO5
Digital I/O
16
DIO4
Digital I/O
17
DIO3
Digital I/O
18
DIO2
Digital I/O
GND
System reset
General purpose digital I/O of BlueNRG-1
Connected internally to GPIO3 of S2-LP for interrupt.
General purpose digital I/O of BlueNRG-1
Test pin put to GND
GND
Power for BlueNRG-1
GND
Bootloader pin/
General purpose digital I/O of BlueNRG-1
General purpose digital I/O of BlueNRG-1
Connected internally to RESET pin of STSAFE-A1SX
General purpose digital I/O of BlueNRG-1
Connected internally to SDA pin of STSAFE-A1SX
General purpose digital I/O of BlueNRG-1
Connected internally to SCL pin of STSAFE-A1SX
General purpose digital I/O of BlueNRG-1 / SPI master
input pin connected internally to SDO pin of S2-LP
General purpose digital I/O of BlueNRG-1 / SPI master
output pin connected internally to SDI pin of S2-LP
General purpose digital I/O of BlueNRG-1 / SPI master
19
DIO1
Digital I/O
CS pin connected internally to CS pin of S2-LP
Built-in pull-up 10K ohm resistor.
20
DIO0
Digital I/O
General purpose digital I/O of BlueNRG-1 / SPI master
CLK pin connected internally to SCLK pin of S2-LP
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General purpose digital I/O of BlueNRG-1 /
21
DIO14
Digital I/O
Connected internally to SDN pin of S2-LP
Built-in pull-down 10K ohm resistor.
22
ANATEST1
Analog Output
23
ADC1
Analog Input
24
GND
GND
25
ADC2
Analog Input
26
GND
GND
27
VCC_S2LP
28
GND
29
GPIO3
POWER
GND
Digital I/O
Analog output
ADC input1
GND
ADC input2
GND
Power for S2-LP
GND
General purpose I/O of S2-LP. Connected internally to
DIO13 pin of BlueNRG-1 for interrupt.
General purpose I/O of S2-LP.
30
GPIO2
Digital I/O
Connected internally to TXEN pin of RFX1010.
Built-in pull-down 10K ohm resistor.
31
GPIO1
Digital I/O
General purpose I/O of S2-LP.
Connected internally to MODE pin of RFX1010.
General purpose I/O of S2-LP.
32
GPIO0
Digital I/O
Connected internally to RXEN pin of RFX1010.
Built-in pull-down 10K ohm resistor.
33
PA_DET
Analog Output
Analog Voltage Proportional to the PA Power Output
34
VCC_PA1
POWER
Power for RFX1010
35
VCC_PA2
POWER
Power for RFX1010
36
GND
GND
ANT1
ANT1
RF I/O
2.4 GHz BLE antenna connector
ANT2
ANT2
RF I/O
Sub-1GHz antenna connector
GND
(1) The pin DIO7/BOOT is monitored by bootloader after power up or hardware Reset and it should be low to prevent
unwanted bootloader activation.
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4. MODULE SPECIFICATIONS
4.1. Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Pin
Parameter
11, 27
Power for BlueNRG-1 and S2-LP
34, 35
Power for RFX1010
3, 4, 5, 6, 7, 8, 9, 13, 14, 15, 16, 17,
DC voltage on digital input/output
18, 19, 20, 21, 29,
pins
22, 23, 25,
DC voltage on analog pins
30, 31, 32
DC voltage on digital control pins of
MIN
MAX
Unit
-0.3
+3.9
V
0
+4.2
V
-0.3
+3.9
V
-0.3
+3.9
V
0
+3.6
V
PA.
ANT1
Input RF level
+11
dBm
ANT2
Input RF level
+5
dBm
+85
°C
Storage temperature range
-40
4.2. ESD Ratings
Parameter
Value
Unit
Electrostatic
VESD+HBM
BlueNRG-1 pins
±2000
V
discharge
VESD+HBM
S2-LP pins
±500
V
VESD+HBM
RF pins
±500
V
MIN
MAX
Unit
-40
85
°C
performance
4.3. Recommended Operating Conditions
Parameter
Conditions
Ambient temperature range
VBAT
For BlueNRG-1
+1.7
+3.6
V
VCC_S2LP
For S2-LP
+1.8
+3.6
V
For RFX1010
+2.7
+3.6
V
VCC_PA1, VCC_PA2
(1)
(1)
The VCC_PA1, VCC_PA2 are limited to +3.3V in Sigfox application
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4.4. Power Consumption Summary
Ta = 25°C, VBAT=3.0 V, VCC_S2LP=3.0 V, VCC_PA = 3.3 V with internal DC-DC converter, unless otherwise noted.
Test Conditions
Parameter
Reset
IBAT
Min
Typ
Max
Units
5
nA
Standby
500
nA
Sleep mode: 32 kHz XO ON (24 KB retention RAM)
0.9
μA
Sleep mode: 32 kHZ RO ON (24 KB retention RAM)
2.1
μA
Active mode: CPU, Flash and RAM on
1.9
mA
RX
7.7
mA
BLE TX +8 dBm
15.1
mA
BlueNRG-1
BLE TX +4 dBm
10.9
mA
Supply current
BLE TX +2 dBm
9
mA
BLE TX -2 dBm
8.3
mA
BLE TX -5 dBm
7.7
mA
BLE TX -8 dBm
7.1
mA
BLE TX -11 dBm
6.8
mA
BLE TX -14 dBm
6.6
mA
Peripheral Current Consumption (Adds to core current for each peripheral unit activated)
GPIO
11.6
μA
BlueNRG-1
Flash controller
6.3
μA
Peripheral
System controller
0.2
μA
current
UART
82.3
μA
SPI
46.5
μA
Watchdog
3.6
μA
ADC
6.3
μA
I2C1
95.9
μA
MFT1
5.4
μA
MFT2
6.2
μA
RTC
7.5
μA
DMA
16.3
μA
RNG
21.7
μA
PKA
23.7
μA
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IVCC_
Shutdown
2.5
nA
S2LP
Standby
350
nA
Sleep
600
nA
S2_LP
Sleep (FIFOs retained)
0.9
μA
Supply current
Ready
350
μA
8
mA
TX CW @ 14 dBm
20.6
mA
TX CW @ 10 dBm
11.7
mA
Shutdown Current
1
μA
RX @ sensitivity level
IVCC_
RFX1010
TX CW @ 24 dBm
260
mA
PA
Supply current
TX CW @ 27 dBm
450
mA
RX, High Gain Mode
16
mA
RX, Low Gain Mode
10
mA
4.5. 2.4GHz GFSK (Bluetooth Low Energy) RF Characteristics
RF performance is specified in a single ended 50 ohm reference plane at the RF connector with Ta = 25°C, VBAT = 3.0 V,
fRF = 2440 MHz, unless otherwise noted. Please see the more detail data in the STM’s BlueNRG-1 datasheet.
Test Conditions
Min
Typ
Max
Units
Frequency range
2400
-
2483.5
MHz
Channel spacing
-
2
-
MHz
2480
MHz
Parameter
Channel center frequency
Receiver sensitivity
Receiver saturation
Maximum Output Power
Minimum Output Power
(1)
2402
BER = 10
–3
-87
dBm
BER = 10
–3
11
dBm
At RF connector
+8
dBm
At RF connector
-15
dBm
(1) The maximum output power in FCC and NCC certification report is 8.66 dBm
4.6. Sub-1GHz RF Characteristics
RF performance is specified in a single ended 50 ohm reference plane at the RF connector with Ta = 25°C, VCC_S2LP =
3.3 V, VCC_PA=3.3V, unless otherwise noted. Please see the more detail data in the STM’s S2_LP and Skyworks’s
RFX1010 datasheet.
Parameter
Frequency range
(1) (2)
Data rate – 2-(G)FSK
Test Conditions
Min
Typ
Max
Units
902
-
928
MHz
0.3
-
250
kbps
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Data rate – 4-(G)FSK
0.6
-
500
kbps
Data rate – OOK/ASK
0.3
-
125
kbps
Frequency deviation FDEV
0.15
-
500
kHz
Sensitivity @ 920MHz,
DR = 0.3 kbps, FDEV = 0.25 kHz, CHF = 1 kHz
-128
dBm
Low Gain Mode,
DR = 1.2 kbps, FDEV = 1.2 kHz, CHF = 4 kHz
-122
dBm
1% BER @ 2-GFSK BT = 0.5
DR = 38.4 kbps, FDEV = 20 kHz, CHF = 100 kHz
-109
dBm
DR = 100 kbps, FDEV = 50 kHz, CHF = 200 kHz
-105
dBm
Sensitivity @ 920MHz,
DR = 4.8 kbps, DEV = 2.4 kHz, CHF = 10 kHz
-114
dBm
Low Gain Mode,
DR = 9.6 kbps, DEV = 4.8 kHz, CHF = 20 kHz
-112
dBm
1% BER @ 4-GFSK BT = 0.5
DR = 19.2 kbps, DEV = 9.6 kHz, CHF = 40 kHz
-108
dBm
Sensitivity @ 920MHz,
DR = 0.3 kbps, CHF = 1 kHz
-121
dBm
Low Gain Mode,
DR = 1.2 kbps, CHF = 4 kHz
-118
dBm
1% BER @ OOK
DR = 38.4 kbps, CHF = 100 kHz
-105
dBm
DR = 125 kbps, CHF = 250 kHz
-100
dBm
At RF connector
+27
dBm
At RF connector
0
dBm
Maximum Output Power
(3)
Minimum Output Power
(1)
The frequency range of Sigfox RC-2 and FCC Part 15.257 is 902.1375MHz to 904.6625MHz
(2)
The frequency range of Sigfox RC-4 and NCC is 920.1375MHz to 922.6625MHz
(3)
The maximum output power in FCC certification report is 25.29 dBm. The maximum output power in NCC
certification report is 24.88 dBm,
4.7. Internal 16-MHz Crystal Oscillator ( for BlueNRG-1 )
over operating free-air temperature range (unless otherwise noted)
Test Conditions
Parameter
Min
Typ
Crystal frequency
Crystal frequency tolerance
Max
16
(1)
-40
Units
MHz
+40
ppm
Max
Units
(1) Includes initial tolerance of the crystal, drift over temperature, aging ( 5 years ).
4.8. Internal 32.768-kHz Crystal Oscillator ( for BlueNRG-1 )
over operating free-air temperature range (unless otherwise noted)
Test Conditions
Parameter
Min
Crystal frequency
Crystal frequency tolerance
(1)
Typ
32.768
(1)
-40
KHz
40
ppm
Includes initial tolerance of the crystal, drift over temperature, aging ( 5 years ).
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4.9. Internal 50MHz Crystal Oscillator ( for S2-LP )
over operating free-air temperature range (unless otherwise noted)
Test Conditions
Parameter
Min
Crystal frequency
Typ
Max
Units
50
MHz
Crystal frequency tolerance
(1)
Without initial frequency calibration
-40
40
ppm
Crystal frequency tolerance
(2)
Initial frequency is calibrated by software
-20
20
ppm
(1)
Includes initial tolerance of the crystal, drift over temperature, aging ( 5 years ).
(2)
Includes only drift over temperature, aging ( 5 years ).
4.10. BlueNRG-1 Digital I/O specifications
Ta = 25°C
Test Conditions
Parameter
Min
Typ
Max
Units
Trise
0.1*VDD to 0.9*VDD, CL=50pF
1.4(TC)
-
19(TC2)
ns
Tfall
0.9*VDD to 0.1*VDD, CL=50pF
1.5(TC)
-
22(TC2)
ns
T(RST)L
-
1.5
-
ms
TC
3
3.3
3.6
V
TC1
2.25
2.5
2.75
V
TC2
1.72
1.8
1.98
V
TC
-0.3
-
0.9
V
TC1
-0.3
-
0.67
V
TC2
-0.3
-
0.54
V
TC
1.95
-
3.6
V
TC1
1.46
-
2.75
V
TC2
1.1
-
1.98
V
TC
-
-
0.4
V
TC1
-
-
0.42
V
TC2
-
-
0.45
V
TC
2.4
-
-
V
TC1
1.72
-
-
V
TC2
1.35
-
-
V
IOL
TC (VOL = 0.4V)
3.4
5.6
7.9
mA
(Low drive strength)
TC1 (VOL= 0.42V)
3.8
6.6
10.1
mA
TC2 (VOL =0.45V)
1.6
3
5
mA
VIL
VIH
VOL
VOH
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IOL
TC (VOL = 0.4V)
6.8
11.2
15.8
mA
(High drive strength)
TC1 (VOL= 0.42V)
7.6
13.2
20.1
mA
TC2 (VOL =0.45V)
3.3
6
9.9
mA
IOH
TC (VOH = 2.4V)
5.5
10.6
17.6
mA
(Low drive strength)
TC1 (VOH= 1.72V)
3.7
7.2
12
mA
TC2 (VOH =1.35V)
1.4
3
5.6
mA
IOH
TC (VOH = 2.4V)
9.9
19.2
31.7
mA
(High drive strength)
TC1 (VOH= 1.72V)
6.7
12.9
21.6
mA
TC2 (VOH =1.35V)
2.4
5.5
10.1
mA
4.11. S2-LP Digital interface specification
Parameter
Test Conditions
Min
Typ
Max
Units
8
10
MHz
SPI clock frequency
VIH
VCC_S2LP/2+0.3
-
-
V
VIL
-
-
VCC_S2LP/8 +0.3
V
0.625*VCC_S2LP+0.1
-
-
V
0.5
V
VOH
IOH = -2.4 mA (-4.2 mA into high
output current mode).
VOL
IOL = +2.0 mA (+4.0 mA into high
output current mode).
4.12. RFX1010 Digital interface specification
Parameter
Test Conditions
Control Voltage High
RXEN, TXEN, and MODE Pins
Control Voltage Low
RXEN, TXEN, and MODE Pins
Min
Typ
Max
Units
1.2
-
VCC_PA
V
0.3
V
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4.13. RFX1010 Gain vs. Pout
Tc = 25°C, VCC_PA = 3.3 V
4.14. RFX1010 CW Current vs. Pout
Tc = 25°C, VCC_PA = 3.3V
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4.15. RFX1010 Vdet vs. Pout
Tc = 25°C, VCC_PA = 3.3 V, Measured with 10kΩ load.
4.16. More Characteristics
If you need more detail characteristics, please visit STM and Skyworks web site.
BlueNRG-1:
http://www.st.com/content/st_com/en/products/wireless-connectivity/bluetooth-bluetooth-low-e
nergy/bluenrg-1.html
S2-LP:
http://www.st.com/content/st_com/en/products/wireless-connectivity/sub-1ghz-rf/s2-lp.html
RFX1010:
http://www.skyworksinc.com/Product/3212/RFX1010
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5. DESIGN RECOMMENDATIONS
5.1. GPIO Usage of BlueNRG-1
Because the function of some pins has been used in the module internally, the other functions of
these pins can not be defined. Please refer the below table.
Pin
Mode “000”
Mode “001”
Type
Signal
Type
Signal
DIO0
I/O
GPIO 0
I
DIO1
I/O
GPIO 1
DIO2
I/O
DIO3
Mode “100”
Mode “101”
Note
Type
Signal
Type
Signal
UART_CTS
I/O
SPI_CLK
-
-
O
UART_RTS
I/O
SPI_CS1
I
PDM_DAT
To CS pin of S2-LP
GPIO 2
O
PWM0
O
SPI_OUT
O
PDM_CLK
To SDI pin of S2-LP
I/O
GPIO 3
O
PWM1
I
SPI_IN
O
-
To SDO pin of S2-LP
DIO4
I/O
GPIO 4
I
UART_RXD
I/O
I2C2_CLK
O
PWM0
To SCL pin of STSAFE-A1SX
DIO5
I/O
GPIO 5
O
UART_TXD
I/O
I2C2_DAT
O
PWM1
To SDA pin of STSAFE-A1SX
DIO6
I/O
GPIO 6
O
UART_RTS
I/O
I2C2_CLK
I
PDM_DAT
To reset pin of STSAFE-A1SX
DIO7
I/O
GPIO 7
I
UART_CTS
I/O
I2C2_DAT
O
PDM_CLK
DIO8
I/O
GPIO 8
O
UART_TXD
I/O
SPI_CLK
I
PDM_DAT
DIO9
I/O
GPIO 9
I
SWCLK
I
SPI_IN
-
-
DIO10
I/O
GPIO 10
I
SWDIO
O
SPI_OUT
-
-
DIO11
I/O
GPIO 11
I
UART_RXD
I/O
SPI_CS1
-
-
DIO12
OD
GPIO 12
I
-
I/O
I2C1_CLK
-
-
DIO13
OD
GPIO 13
I
UART_CTS
I/O
I2C1_DAT
-
-
To GPIO3 pin of S2-LP
DIO14
I/O
GPIO 14
I/O
I2C1_CLK
I/O
SPI_CLK
O
-
To SDN pin of S2-LP
Name
To SCLK pin of S2-LP
5.2. Power Voltage Range
There are 3 key chips in this module, and they have their own separate power pins. In the different
I/O level application, we suggest to refer the below power source design.
Interface I/O level
Power pin in the WS2119-A0
VBAT
VCC_S2LP
VCC_PA
3.3V
3.3V
3.3V
3.3V
2.5V
2.5V
2.5V
3.3V
1.8V
1.8V
1.8V
3.3V
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5.3. Debug Port
The BlueNRG-1 embeds the ARM serial wire debug (SWD) port. It is two pins (clock and single
bi-directional data) debug interface, providing all the debug functionality plus realtime access to
system memory without halting the processor or requiring any target resident code.
Pin functionality
Pin Name
Pin description
SWCLK
DIO9
SWD clock signal
SWDIO
DIO10
SWD data signal
The Cortex-M0 subsystem of the BlueNRG-1 embeds two breakpoints and one watch point.
5.4. Debugging Tips
There are certain situations where debug access is disabled and the chip cannot be accessed,
including:
application that disables debug pins
application that set the device in sleep or standby state, in which the debug port is not
powered.
These cases are common during application development and device can end up in a state where
debug access is no longer possible. To recover this situation, it is recommended to force DIO7 pin
high and hardware reset the device in order to force execution of the updater code. The user can
then connect with SWD interface and erase the device Flash memory.
5.5. Pre-programmed bootloader
BlueNRG-1 device has a pre-programmed bootloader supporting UART protocol with automatic
baudrate detection. Main features of the embedded bootloader are:
Auto baudrate detection up to 460 kbps
Flash mass erase, section erase
Flash programming
Flash readout protection enable/disable
The pre-programmed bootloader is an application which is stored on the BlueNRG-1 internal ROM
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at manufacturing time by STMicroelectronics. This application allows upgrading the device Flash
with a user application using a serial communication channel (UART).
Bootloader is activated by hardware by forcing IO7 high during power-up or hardware Reset,
otherwise, application residing in Flash will be launched.
The customer application must ensure that IO7 is forced low during power up.
5.6. Antenna Selection Guide
There are two RF connectors to connect one 2.4GHz antenna and one 915MHz antenna. There is an
antenna selection guide from STM. You can download it from the below link.
http://www.st.com/content/ccc/resource/technical/document/application_note/82/38/3f/9f/fd/4d/4f
/ab/DM00068254.pdf/files/DM00068254.pdf/jcr:content/translations/en.DM00068254.pdf
For the FCC and NCC certified antenna types/gain please refer to the following table.
BT LE
Sigfox
Antenna Type
PCB
Dipole
PCB
Dipole
Antenna Gain
3.3 dBi
2.6 dBi
2 dBi
3.53 dBi
The maximum antenna gain allowed for use with this device is 3.3 dBi for BT LE and 3.53 dBi for
Sigfox.
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DOC No: WS2119-A0A-DTS-D07
BLE RF
DIO12
JTMS-SWTDIO
JTCK-SWTCK
1
2
3
4
5
6
7
8
9
10
11
12
RESETN
DIO12
DIO11
DIO10
DIO9
DIO8
SWD Interface
VBAT
GND1
RESETN
DIO13
DIO12
TEST
DIO11
DIO10
DIO9
DIO8
GND2
VBAT
GND3
SUB-1G RF
WS2119-A0
GND8
VCC_PA2
VCC_PA1
PADET
GPIO0
GPIO1
GPIO2
GPIO3
GND6
VCC_S2LP
GND5
ADC2
36
35
34
33
32
31
30
29
28
27
26
25
VCC_PA
VCC_S2LP
ADC2
ADC2_Input
DIO7
DIO6
DIO5
DIO4
DIO3
DIO2
DIO1
DIO0
DIO14
TEST1
ADC1
GND4
RESETN
A2
A1
U1
A2
A1
5.7. Reference Schematic
13
14
15
16
17
18
19
20
21
22
23
24
100K
RXD
TXD
ADC1
UART Interface
DIO7
I2C_SDA
I2C_SCL
TEST1
ADC1_Input
1
TEST POINT
DIO7
DIO5
DIO4
I2C Interface
DIO0
DIO2
DIO3
SPI_CLK
SPI_SDO
SPI_SDI
SPI Interface
5.8. Module Layout Recommendations
Power Trace – Power trace for VCC_PA should be 25mil wide. VBAT and VCC_S2LP traces
should be 15mil wide, at least.
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DOC No: WS2119-A0A-DTS-D07
6. PACKAGE INFORMATION
6.1. Module Mechanical Outline
Top View
Side View
Note:
A: Typical: 2.8mm, Maximum: 3.0mm
Unit: mm
Tolerance: +/- 0.2mm
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DOC No: WS2119-A0A-DTS-D07
Bottom View
Note:
1> Pad tolerance as +/-30um
2> Unit: mm
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6.2. Package Marking
Model:WS2119-A0
LTC:YYWWSSFX
FCC ID:WS2-WS2119A0
CCAI18LP0960T9
Marking
Description
Brand name: JORJIN
WS2119-A0 or
WS2119-F0
Model name
YYWWSSFX
Lot Trace Code: YYWWSSFX
YY= Digit of the year, ex: 2017=17
WW= Week (01~52)
SS= Serial number from 01~98 match to MFG’s lot number, or 99
to repair control code
F= Reverse for internal use
X = A for Module version
WS2-WS2119A0
FCC ID
NCC compliance mark, and ID
NCC ID of WS2119-A0 : CCAI18LP0960T9
NCC ID of WS2119-F0 : CCAI18LP096AT1
Sigfox P1 certified logo
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7. SMT AND BAKING RECOMMENDATION
7.1. Baking Recommendation
Baking condition：
-
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
a) Mounted within 72 hours of factory conditions
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