3FTH940

03 EC M U -M M EC I LT PANEL PCB SWITCHES 22 3F Multimec™ 3F High performance tactile switches • robust DISTINCTIVE FEATURES 10 x 10 mm; h=10.4 mm Illuminated RAS option Slip-on cap retention system - great for custom caps ENVIRONMENTAL SPECIFICATIONS • Sealing : IP67 according to IEC 60529 • Working and storage temperature : - non-illuminated : -40 °C/+160 °C (-40 °F to +320 °F) - illuminated : -40 °C /+85 °C (-40 °F to +185 °F) • Soldering : - through-hole : IEC 60068-2-20 8 - surface mount : JEDEC J-STD-020E ELECTRICAL SPECIFICATIONS • Recommended load : - Gold contacts : 0.5µ-50 mA 24 VDC - Silver contacts : 0.5-50 mA 24 VDC • Contact resistance : 10 MΩ • Contact bounce : 10,000,000 cycles • Terminals : SnCu + 2 µNI + 3 µSn100 The company reserves the right to change specifications without notice. All tolerance if not otherwise specified ±0.2 mm. • Max. actuation force : 100 N for 10 sec 1 6,4 10,4 High performance tactile switches • robust 3F - SMD 14 Ø 6,5 10 6,4 10,4 10 7,62 14 0,8 Ø 6,5 6,4 10,4 0,8 7,62 3F - TH Min 10,16 Max 12,5 0,3 Ø 6,5 10 6,4 10,4 10 0,8 0,3 Min 10,16 Max 12,5 7,62 Ø 6,5 0,8 7,62 3F - TH W/LED 10 10 2,54 2,54 3F - RAS 10 7,62 12 5,08 7,62 2 10 7,62 12 PCB SWITCHES Multimec™ 3F 5,08 7,62 PANEL PCB SWITCHES Multimec™ 3F 5,5 6,0 10 12 High performance tactile switches • robust 5,08 2,54 3F - RAS W/LED 7,62 20,1 6,0 10 12 ±0,3 17,8 5,5 7,62 5,08 2,54 2,54 7,62 20,1 ±0,3 17,8 PCB LAYOUT & CIRCUIT DIAGRAM 7,62 2,54 4 2,5 Ø1,0(3x) 3 Ø1,0(3x) 2,54 1 3 Ø1,0(3x) 2,54 7,62 7,62 5,08 Ø1,0(4x) 7,62 5,08 7,62 3 +3 2,5 5,08 + Ø1,0(4x) 7,62 7,62 5,08 7,62 2,54 ø1.0 (4X) RAS bi-color illuminated 7,62 2,54 ø1.0 (4X) 3 2,54 4 7,62 Ø1,0(4x) 3 +3 5,08 7,62 2,54 1 5,08 7,62 3 1,2 3 3 +34 2,5 2,54 Ø 0,9 7,62 [0,300] 4 2,54 [0,100] 4 + 7,62 1 - 7,62 1 1 1 7,62 3 12,50 -2 1 - 5,08 1,2 2,5 1 -2 RAS illuminated 7,62 10,16 2 7,62 2 10,16 [0,400] 2,54 2,54 [0,100] 1 Ø 0,9 RAS TH bi-color illuminated 0 44 33 2,5 Ø 0,9 12,50 10,16 [0,400] 7,62 2 2,54 4 1 7,62 [0,300] 4 3 1 7,62 3 2,5 Ø 0,9 -22 11 2,54 44 3 Ø 0,9 10,16 12,50 2 1,2 7,62 1,2 4 2 7,62 7,62 1 1,2 1 7,62 7,62 7,62 22 2,54 [0,100] 10,16 12,50 10,16 12,50 1 7,62 10,16 2 TH illuminated 1,2 2,54 [0,100] SMD non-ill. 5,08 TH Non-ill. PCB SWITCHES Multimec™ 3F High performance tactile switches • robust BUILD YOUR PART NUMBER ILLUMINATED 3F MOUNTING SERIES TH9 LED through-hole OPTIONAL 06 blue Q quiet contact 20 green G gold contacts 40 yellow RAS 65 white 80 red 2040 green/yellow 8020 red/green 8040 red/yellow 24 high intensity green 46 high intensity yellow 87 high intensity red right angle NON-ILLUMINATED 3F MOUNTING SERIES TH9 through-hole SH9 surface mount OPTIONAL Q quiet contact RAS right angle (with TH only) R tape & reel (with SMD only) G gold contacts ABOUT THIS SERIES Caps and accessories : for the full range of accessories for Multimec™ 3F please see the website. 4 High performance tactile switches • robust OPERATING FORCE TAPE & REEL Tape and reel is available for the parts listed and has the following specifications FORCE 10 • Reel diameter: Ø330 mm 9 • Tape width: 24 mm • Pitch: see list 8 • Tape and reel material: antistatic or better • Quantity per reel: see list 7 ORDERING CODE PITCH QUANTITY PER REEL 3FSH9 3FSH9R 20 250 6 F(N) PART NO. 5 3,5N 3.5 N 4 3 2 1 TRAVEL 0 0 0,2 0,4 0,6 0,8 1 L(mm) 1,2 1,4 1,6 1,8 2 MOUNTING MOUNTING TOOLS FOR MULTIMEC™ THROUGH-HOLE SWITCHES Part No. 9861000 1 2 3 4 5 5 PANEL PCB SWITCHES Multimec™ 3F PCB SWITCHES Multimec™ 3F High performance tactile switches • robust MOUNTING (CONTINUED) SPACE REQUIREMENT - MATRIX MOUNTING Through-hole (TH) Surface mount (SMD) MULTIMEC™ SPACING EXAMPLES 13.6 13.6 12.7 12.7 1V+1T+1V 1N+1N+1N SPACE REQUIREMENT - SWITCH/CAP Cap dimensions Switch spacing Panel cut-out 6 CAP SERIES RECOMMENDED MIN.SWITCH SPACING AxB NOMINAL CAP DIMENSION WxH RECOMMENDED MIN. PANEL CUT-CUT 1D/1E/1F 1GA 12.7x11.3 Ø9.6 Ø10.0 12.7x11.3 Ø11.0 Ø11.4 1GC 15.3x15.3 Ø15.0 Ø15.4 1K/1KB/1KC 14.6x14.6 14.3x14.3 14.7x14.7 1N 13.6x11.3 Ø9.8/ 14.9 Ø10.2/15.1 1P/ 1Q/1R 12.8x10.3 6.5x12.5 7.0x13.0, R max. 1.0 1S 12.7x10.3 Ø6.5 Ø7.0 1T 12.7x12.3 10.6x10.6 11.0x11.0 1U 12.7x12.3 Ø10.6 Ø11.0 1V 15.95x12.1 10.6x13.25 11.0x13.65 1WA 14.2x10.3 12.5x6.5 12.9x6.9 1WD 16.9X10.3 15.2x8.0 15.6x8.4 1X 12.7x10.3 9.4x7.4 9.8x7.9 1ZC 14.6x14.6 Ø14.3 Ø14.7 High performance tactile switches • robust LED COMPONENT SPECIFICATIONS LED COMPONENT SPECIFICATIONS Color B G Y W R G/Y R/G R/Y G Y R Color Codes 06 20 40 65 80 2040 8020 8040 24 46 87 120 120 60 110 100 100/60 100/100 75/75 60 60 60 ABSOLUTE MAXIMUM RATINGS (Ta=25°C) Power mW Current forward mA 30 30 20 30 30 30/20 30/30 30/30 25 25 25 Forward peak current mA 150 90** 80** 100 90** 120/80 120/120 160/140 60 60 60 Voltage reverse V 5 3 5 5 3 5 5 5 5 5 5 Operating temperature °C -40/+85 -55/+100 -40/+85 -55/+100 -55/+100 -55/+100 -40/+85 -40/+85 -40/+85 -40/+85 Storage temperature °C -40/+85 -55/+100 -40/+100 -55/+100 -55/+100 -55/+100 -40/+85 -40/+100 -40/+100 -40/+100 Soldering temperature °C 260 for max 3 sec 260 for max 2 sec 260 for max 5 sec ELECTRICAL-OPTICAL CHARACTERISTICS (Ta=25°C) Voltage forward Typ. V 3.3 2.1 2.1 3.0 2.0 2.1/2.1 2.0/2.1 2/2.1 2.0* 2.0 2.0*** Max. V 4.0 2.6 2.6 4.0 2.6 2.6/2.4 2.6/2.6 2.5/2.5 2.4* 2.4 2.4*** Current reverse (VR=5V) µA Max. 50 100 100 100 100 100 100 2 10 10 10 Wave length nm 460 569 588 NA 625 565 621/569 617/588 573 589 624 25 40 35 NA 40 30/35 40/30 45/35 20 NA 20 Spread angle Spread degree nm 30 60 60 25 60 80/60 200 60 100 40 40 Luminous Intensity Min. mcd 900 5.6 1.7 715 2.5 3.7/2.5 2.2/2.2 6/4 10 630 400 5.6 max 2850 8.7 12.6/8.7 4.8/4.8 14/8 20 1250 800 Typ. mcd Orientation 1600 12.6 The longer pin is the anode, the shorter is the cathode. For bi-color LEDs the anode for the first color (ex. 8020) is the longer pin. */F=20mA, **1/10 duty cycles 0.1ms pulse width, ***/F=50mA, ****Luminous Flux mlm 7 PANEL PCB SWITCHES Multimec™ 3F PCB SWITCHES Multimec™ 3F High performance tactile switches • robust USAGE GUIDELINES HOW TO GET THE BEST RESULTS WITH MEC SWITCHES ? These guidelines are offered to users of MEC Switches as an aid to ensure successful and reliable switch operation. Please see the technical specifications for details on operating and storage temperatures and soldering guidelines to make sure you select the best switch for your application. When reflow soldering is taking place, MEC strongly recommend that the temperature profile is analyzed and compared with the temperature rating of the switch. It is also important to monitor the accumulated heat buildup from both the pre-heat zones and the solder zone. Most standard accessories for multimec™ 3 series switches are made from ABS plastic with a maximum operating temperature of 65 °C. It is strongly recommended that accessories are mounted after soldering of the switch. If this is not possible care must be taken not to overheat the accessories during the soldering process. The 1S and 1GA/1GC caps are, however, made of high temperature materials and will meet the same temperature specifications as the switches. For accessories made from other plastic materials please see multimec™ 3 cap & bezel technical specifications. offers a high level of sealing, however, with aqueous solvent solutions care must be taken to avoid the worst case situation with water jets, complete immersion into a liquid with a temperature below the board or surface tension reducing additives. Recommended cleaning methods are demineralized water. Any surface tension reducing agents, such as soap, must not be used as they risk causing a potential leakage of the switch. SOLDERING - THROUGH HOLE VERSIONS Hand soldering: max. 350 °C for max. 3 sec Wave soldering: heat built up in the switch during pre-heating and soldering must not exceed the maximum operating temperature of the switch. Peak temperature must not exceed 260 °C, and soldering time is max 10 sec. (IEC 60068-2-20 8) SOLDERING - SURFACE MOUNT VERSIONS LEDs have their own temperature specifications. When fitted in a 3F switch the LED will determine the max. operating temperature, i.e. 3FTH924 has an upper temperature limit of 85 °C! For all methods - infrared, convection and vapor phase. The upper limit 240 °C/40 sec must be observed. The soldering temperature profile must have moderate temperature gradients. (JEDEC J-STD020E) MOUNTING AND DISMOUNTING ROHS COMPLIANCE If switches are to be mounted in rows it is essential that the recommendations regarding spacing are followed. PC board thickness should be 1.4 ±0.2 mm and terminal hole diameter should be 0.9 mm. As of 1 July 2006 MEC has completed the conversion to RoHS compliance. For more info please see our homepage www.apem.com All multimec™ caps and bezels are easily slid onto the switch modules and can be changed at a later time . TEMPERATURE LIMITS Care must be taken when inserting the 3FT switch and LED assembly into the PC board. Do not press direct on the LED. This will force the LED down into the actuator and risks to cause the switch contacts to remain in the closed position. To correct the fault, the LED must be raised slightly and centered in the actuator to assure unrestricted movement of the actuator. Switch LEDs Accessories A mounting tool is available for through hole multimec 3 series switches. ™ SOLDERING AND CLEANING MULTIMEC™ 3 SERIES Multimec™ 3 series switches are fully sealed to IP67 specifications to prevent solder flux and aqueous based cleaning solutions from entering the switch and contaminating the contacts. The switches can be placed on the PC board with other components and reflow soldered. Multimec™ 3 series 8 160 °C 80/85/100 °C 65/85/160 °C PACKAGING Multimec™ 3 series switches are packed in rigid tubes of 50 pieces each. A box contains 1.000 pcs. The surface mount versions of multimec™ 3 series switches with a height up to 12.5 mm can also be delivered on tape/reel. Each reel contains 250/500 pcs. Right angle swithces are packed in trays. A tray contains 100 pcs.