SFH 4247-QR

2017-01-23 Infrared Emitter (940 nm) Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Features: • Wavelength 950nm • Short switching times • The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. Applications • Infrared Illumination for cameras • IR data transmission • Sensor technology Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code Ie [mW/sr] IF = 70 mA, tp = 20 ms SFH 4247 Note: 12 (≥ 6.3) Q65110A8091 Measured at a solid angle of Ω = 0.01 sr 2017-01-23 1 Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Maximum Ratings (TA = 25 °C) Parameter Symbol Values Operation and storage temperature range Top; Tstg -40 ... 100 °C Reverse voltage VR 5 V Forward current IF 70 mA Surge current (tp ≤ 200 µs, D = 0) IFSM 1 A Power consumption Ptot 140 ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 Thermal resistance junction - ambient 1) page 12 RthJA 390 K/W Thermal resistance junction - soldering point RthJS 220 K/W 2) page 12 Unit mW kV Characteristics (TA = 25 °C) Parameter Symbol Values Unit Peak wavelength (IF = 70 mA, tp = 20 ms) (typ) λpeak 950 nm Centroid wavelength (IF = 70 mA, tp = 20 ms) (typ) λcentroid 940 nm Spectral bandwidth at 50% of Imax (IF = 70 mA, tp = 20 ms) (typ) ∆λ 42 nm Half angle (typ) ϕ ± 65 Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 70 mA, RL = 50 Ω) (typ) tr, tf Forward voltage (IF = 70 mA, tp = 20 ms) Forward voltage (IF = 1 A, tp = 100 µs) 2017-01-23 mm x mm 12 ns (typ (max)) VF 1.5 (≤ 1.9) V (typ (max)) VF 3.6 (≤ 4.6) V Reverse current (VR = 5 V) Total radiant flux (IF = 70 mA, tp = 20 ms) 0.3 x 0.3 ° (typ) 2 IR not designed for reverse operation µA Φe 40 mW Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Parameter Symbol Values Unit Temperature coefficient of Ie or Φe (IF = 70 mA, tp = 20 ms) (typ) TCI -0.3 %/K Temperature coefficient of VF (IF = 70 mA, tp = 20 ms) (typ) TCV -0.8 mV / K Temperature coefficient of wavelength (IF = 70 mA, tp = 20 ms) (typ) TCλ 0.3 nm / K Grouping (TA = 25 °C) Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF = 70 mA, tp = 20 ms IF = 70 mA, tp = 20 ms IF = 500 mA, tp = 25 µs Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH 4247-Q 6.3 12.5 47 SFH 4247-R 10 20 75 SFH 4247-S 16 32 120 Note: measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 3) page 12 Irel = f(λ), TA = 25°C OHF04134 100 I rel Radiant Intensity 3) page 12 Ie / Ie(70 mA) = f(IF), single pulse, tp = 100 µs, TA= 25°C OHF05702 101 % Ιe Ι e (70 mA) 80 100 60 10-1 40 10-2 20 0 800 850 900 950 nm 1025 10-3 0 10 λ 101 102 mA 103 IF 2017-01-23 3 Version 1.5 / acc. to OS-PCN-2016-018-A Forward Current 3) page 12 IF = f(VF), single pulse, tp = 100 µs, TA= 25°C Max. Permissible Forward Current IF = f (TA), RthJA = 390 K/W IF [A] SFH 4247 SFH 4247 80 IF OHF05642 103 mA 60 102 40 101 20 0 0 20 40 60 100 80 100 TA [°C] 0 1 Permissible Pulse Handling Capability IF = f (τ), TA = 85 °C, duty cycle D = parameter SFH 4247 [A] SFH 4247 IF 1,0 0,8 0,6 0,4 2017-01-23 [A] 1,0 0,8 :D=1 : D = 0,5 : D = 0,2 : D = 0,1 : D = 0,05 : D = 0,02 : D = 0,01 : D = 0,005 0,6 0,4 0,2 0,0 -5 10 10-4 10-3 0,01 0,1 V 4 3 VF Permissible Pulse Handling Capability IF = f(tp), TA = 25 °C, duty cycle D = parameter IF 2 :D=1 : D = 0,5 : D =0,2 : D =0,1 : D =0,05 : D =0,02 : D =0,01 : D =0,005 0,2 1 0,0 -5 10 10-4 10-3 0,01 0,1 10 100 tp [s] 4 1 10 100 tp [s] Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Radiation Characteristics 3) page 12 Irel = f(ϕ), TA= 25°C 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL00869 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 1.4 (0.055) 1.2 (0.047) 0.15 (0.006) 0.05 (0.002) 1.0 (0.039) 0.5 (0.020) 0.3 (0.012) 0.8 (0.031) 1.9 (0.075) 1.5 (0.059) 2.3 (0.091) 2.1 (0.083) 2.1 (0.083) 1.2 (0.047) Package Outline Anode marking 0.8 (0.031) +0.05 (0.002) Anode marking 1.0 (0.039) 1.5 (0.059) 1.3 (0.051) GPLY6070 Dimensions in mm (inch). Package Mini TOPLED 2017-01-23 Light emitting area typ. 1.5 (0.059) x 1.0 (0.039) 5 Version 1.5 / acc. to OS-PCN-2016-018-A Approximate Weight: 7.3 mg Recommended Solder Pad Dimensions in mm (inch). 2017-01-23 6 SFH 4247 Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 50 0 100 150 200 250 s 300 t OHA04612 Profile Feature Profil-Charakteristik Symbol Symbol Pb-Free (SnAgCu) Assembly Minimum ) Ramp-up rate to preheat* 25 °C to 150 °C Time tS TSmin to TSmax tS 60 Ramp-up rate to peak*) TSmax to TP Recommendation Maximum 2 3 100 120 2 3 Unit Einheit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 s 3 6 K/s 10 Ramp-down rate* TP to 100 °C 480 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2017-01-23 °C 7 s Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Taping 4 (0.157) Cathode/Collector Side 2 (0.079) 1.55 (0.061) 2.35 (0.093) 8 (0.315) 1.75 (0.069) 3.5 (0.138) 1.5 (0.059) 4 (0.157) OHAY0225 Dimensions in mm (inch). Tape and Reel 8 mm tape with 3000 pcs. on ∅ 180 mm reel, 12000 pcs. on ∅ 330 mm reel W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2017-01-23 8 Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Tape dimensions [mm] Tape dim ensions in m m W P0 P1 P2 D0 E F 8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05 or 4 ± 0.1 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05 Reel dimensions [mm] Reel dim ensions in m m A W Nmin W1 W2max 180 8 60 8.4 + 2 14.4 A W Nmin W1 W2max 330 8 60 8.4 + 2 14.4 Reel dim ensions in m m Barcode-Product-Label (BPL) OSRAM Opto EX AM P BIN1: XX-XX-X-XXX-X LX XXXX Semiconductors RoHS Compliant (6P) BATCH NO: 1234567890 (1T) LOT NO: 1234567890 ML Temp ST X XXX °C X (9D) D/C: 1234 Pack: RXX LE DEMY XXX X_X123_1234.1234 X (X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X OHA04563 Dry Packing Process and Materials Moisture-sensitive label or print L VE el LE . see lab e If ve ati nk, bla cod bar y H) (R . dit mi hu e ed ag RH % /60 Barcode label ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe TIO or d , cte itio U g coSEND an bje ing ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < tor ll pro SE _ < urs ). urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ). 23 tim e at t wi nt˚C or l wi fac Flo tim s at or ca at re. Flo d tha ale el or nth nti Flo uiv du if: rea es l 4 5 Flo lab mo ide ce eq low g, l ve vic is be or de 24 tin en l 5a6 pro ve Le de , e te co , g: ve l un wh Le ke r se da ure ba ed low ba Le ve mo % ba e al d ure Le ist en ref e e 10 tim ure se for ist ale op se for > , Mo se 3 ist ure is or . , is ha se Mo nk be ist nk g rd -03 Mo in n Flo r-p RH g, bla Mo ba TD po If blathi % kin Ca life s (if ar t. wi 10 ba tor J-S thi, va p. elf Ye ar ks _ < e icat me , C 1 Ye ee urs Sh terlow tem ted at ed uir > 1 W Ho un Af Indno uir DE 1. d e 4 8 ref dy reqy is 2. JE bo e Mo ore tim 16 req : C/ e es dit2b a) St tim or mi IP ed or g is tim e vic b) or e Hu Flo en tim or De 2a kin nc te Flo a) op or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a3 ve Le g an ve l Le Ba te ure Le ve ure Le ist Da ure ist Mo ist ure Mo ist Mo Mo MO TO OP M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 AM OSR Desiccant OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative 2017-01-23 9 Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 references like JEDEC. Transportation Packing and Materials Barcode label D/ 8 01 Y M DE R 18 -1 P -1 + Q P: OU GR 00 C: 99 D/ 21 D) 00 (9 21 20 34 : O 12 14 2 5 H (Q )Q TY S S em R ic AM on du O p ct to or H NO s TC 3G BA (6 P) NO : 12 11 00 LO T T) (1 NO : TY : 20 : NO (Q )Q T LO T) (1 M RA OS (X ) PR O D 5 14 2 110 0 Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 352 ± 5 195 ± 5 352 ± 5 30 ± 5 33 ± 5 2017-01-23 OD Y DE M R 18 -1 + Q -1 P : UP RO G ) (G 44 00 C: 01 Muster O D) u d (9 A M n o : ic S R NO O 12 BA TC H 3G H S 8 NO (6 P) : 12 em 2199 34 ct pto o rs M u L lt S iT Y O T P 67 L 6 E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: (X ) PR < 2100 (G ) L el OI M TO OP : E V LE see . lab e H) nk, cod (R bla r If ty ba . idi RH m hu 0% e /6 ive d ˚C re ag lat ra ck re 30 _ < inf pa % k s of to 90 ea ur s d ). < ns (p or ur s d Ho de , cteg itio ur s Ho an bje co ˚C 72 sin nd Ho ur 5 te 48 ˚C su es e Ho co ± 24 6 da e 40 be oc ry tim ˚C e r th ll pr tim cto ). r oo 23 wi nt tim e at l wi fa r Fl oo tim s at at ale ˚C at e. ica Fl th oo r th ur el nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low l oc ve vic is ingen be or de 24 l 5a6 pr ve Le de nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo Le ve tu re m % ba e ba al d Le r en re tu re e re 10 ois tim se fo tu re ale op se fo > , M r se ois 3 is , is ha se M ois tu nk be oo . 03 nk g rd M ois in r-p bla in Fl RH g, DM ba Ca bla th po If % kin life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e 4 8 ou re ed re ty is qu JE 2. bo e M or tim 16 re C/ : e es idi 2b r a) St tim mor is IP ed r oo tim e vic b) g e r Hu Fl en oo tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 2 Fl If al re tim ve l 4. se d l 2a3 ve Le g an ve l Le re Ba te Le ve tu re Le tu Da ois re tu re M ois M ois tu M ois M Nns IVEORS ai IT ntNS CT TIO DU U g EcoSE ON A ba IC UR M CThisSTSE 44 M u L lt S iT Y O T67 P L 6 Muster E Bi D Bi n1 Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label 10 OHA02044 Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2017-01-23 11 Version 1.5 / acc. to OS-PCN-2016-018-A SFH 4247 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each 2) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2017-01-23 12 Version 1.5 / acc. to OS-PCN-2016-018-A Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2017-01-23 13 SFH 4247