XKZED8K5GI-112YXC-32.768K

CRYSTAL UNIT 32.768KHZ YSX306GA Applications ‧RTC. Glass Sealed Features ‧Dimensions:8.00 x 3.80 x 2.54 mm. ‧Reflow is possible. ‧Standard Frequency: 32.768KHz ‧Contains Pb in sealing glass exempted by RoHS direc tive. Specifications Standard Frequency Load Capacitance 32.768 KHz 7pF, 9pF, 12.5pF, or specify Frequency Tolerance (at 25 ℃ ) ±10ppm, ±20ppm, or specify Parabolic Coefficient ( - 0.036 ± 0.006 ) * 10-6 / ℃2 -40~+85℃，or specify Operating Temperature Storage Temperature -55~+125℃ Shunt Capacitance 2.0pF Max. 3.0fF Motional Capacitance Level of Drive 1.0μWMax Aging (at 25 ℃) ±5ppm/year Max. Equivalent Series Resistance(ESR) YSX306GA 50KΩMax. Dimensions and Patterns [unit:mm] Package Size – Dimensions (Unit: mm) 8.0 Max. 3.2 Y X C32X X X 3.8 Max. #3 #4 2.38 #3 #1 #2 2.54 Max. #2 #1 (TOP VIEW) #4 0.5 5.5 1.9 (0.9) www.yxcxtal.com CRYSTAL UNIT 32.768KHZ YSX306GA Reflow Soldering Profile Glass Sealed Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-8038 330±2.0 16.0±0.3 8.20±0.1 4.00±0.1 4.0±0.1 2.65±0.1 61.0±1.0 16.0±1.0 3000 pcs per reel www.yxcxtal.com CRYSTAL UNIT 32.768KHZ YSX306GA Glass Sealed Handling Notice for Standard Tuning Fork Crystal (Cylindrical Type) 1. Shock resistance It may deteriorate the characteristics or cause of no oscillation if excess physical shock given. Please be careful not to drop. Please use under condition to minimize the shocks as much as possible. Please review the conditions if it is used by auto mounting or after the conditions are changed. 2. Heat and humidity resistance in storage Storing the crystal products under higher or lower temperature or high humidity for a long period may deteriorate the characteristics of crystal units. Please store and use the crystal products at the normal temperature and humidity. 3. Mounting method to PCB When the crystal products need to be lay down please fix to PCB securely. If the crystal is used with mechanical vibration location, please put cushion in between PCB or fix with elasticity glue (Silicon etc) as 1.9 1.3 1.9 shown in below figure. Please don’t gluing hermetic seal grass. 1.3 4.2 1.3 4. Ultrasonic cleaning and ultrasonic soldering Soldered by ultrasonic cannot be guaranteed, because crystal maybe sympathetic vibrated and may damage. Please study at your side about ultrasonic cleaning. 5. Drive level Applying excessive drive level to the crystal units may cause deterioration of characteristics or damage. Less then 1.0μW is recommended to this products. More than 2.0μW cannot be guaranteed. REVIEW OF SPECIFICATION When something get doubtful with this specifications ， we shall jointly work to get an agreement. www.yxcxtal.com