CY74FCT2543ATSOCT

CY74FCT2543T 8-BIT LATCHED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS042C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 D D D D D D D D D D D D Q OR SO PACKAGE (TOP VIEW) Function and Pinout Compatible With FCT and F Logic 25-W Output Series Resistors to Reduce Transmission-Line Reflection Noise Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels 12-mA Output Sink Current 15-mA Output Source Current Separation Controls for Data Flow in Each Direction Back-to-Back Latches for Storage ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 3-State Outputs LEBA OEBA A0 A1 A2 A3 A4 A5 A6 A7 CEAB GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC CEBA B0 B1 B2 B3 B4 B5 B6 B7 LEAB OEAB description The CY74FCT2543T octal latched transceiver contains two sets of eight D-type latches. Separate latch enable (LEAB, LEBA) and output enable (OEAB, OEBA) inputs permit each latch set to have independent control of inputting and outputting in either direction of data flow. For example, for data flow from A to B, the A-to-B enable (CEAB) input must be low to enter data from A or to take data from B, as indicated in the function table. With CEAB low, a low signal on the A-to-B latch enable (LEAB) input makes the A-to-B latches transparent; a subsequent low-to-high transition of LEAB puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB and OEAB both low, the 3-state B output buffers are active and reflect data present at the output of the A latches. Control of data from B to A is similar, but uses CEAB, LEAB, and OEAB inputs. On-chip termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2543T can replace the CY74FCT543T to reduce noise in an existing design. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY74FCT2543T 8-BIT LATCHED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS042C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 PIN DESCRIPTION NAME DESCRIPTION OEAB A-to-B output-enable input (active low) OEBA B-to-A output-enable input (active low) CEAB A-to-B enable input (active low) CEBA B-to-A enable input (active low) LEAB A-to-B latch-enable input (active low) LEBA B-to-A latch-enable input (active low) A A-to-B data inputs or B-to-A 3-state outputs B B-to-A data inputs or A-to-B 3-state outputs ORDERING INFORMATION QSOP – Q SOIC – SO –40°C to 85°C SPEED (ns) PACKAGE† TA QSOP – Q SOIC – SO ORDERABLE PART NUMBER Tape and reel 5.3 CY74FCT2543CTQCT Tube 5.3 CY74FCT2543CTSOC Tape and reel 5.3 CY74FCT2543CTSOCT Tape and reel 6.5 CY74FCT2543ATQCT Tube 6.5 CY74FCT2543ATSOC Tape and reel 6.5 CY74FCT2543ATSOCT TOP-SIDE MARKING FCT2543C FCT2543C FCT2543A FCT2543A QSOP – Q Tape and reel 8.5 CY74FCT2543TQCT FCT2543 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS CEAB LEAB OEAB LATCH A-TO-B‡ OUTPUT B H X X Storing Z X H X Storing X X X H X Z L L L Transparent Current A inputs L H L Storing Previous A inputs ‡ Before LEAB low-to-high transition H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state A-to-B data flow shown; B-to-A is the same, except using CEBA, LEBA, and OEBA. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY74FCT2543T 8-BIT LATCHED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS042C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 functional block diagram Detail A B0 D Q LE A0 Q D LE A1 B1 A2 B2 A3 A4 B3 Detail A x 7 B4 A5 B5 A6 B6 A7 B7 OEBA OEAB CEBA CEAB LEBA LEAB absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65_C to 135_C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65_C to 150_C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current – 15 mA IOL TA Low-level output current 12 mA 85 °C High-level input voltage 2 Operating free-air temperature –40 V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY74FCT2543T 8-BIT LATCHED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS042C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VOH VCC = 4.75 V, VCC = 4.75 V, IIN = –18 mA IOH = –15 mA VOL Rout VCC = 4.75 V, VCC = 4.75 V, IOL = 12 mA IOL = 12 mA Vhys All inputs MIN 2.4 20 TYP† MAX UNIT –0.7 –1.2 V 3.3 V 0.3 0.55 25 40 0.2 IIH VCC = 5 5.25 25 V VIN = VCC VIN = 2.7 V IIL IOZH VCC = 5.25 V, VCC = 5.25 V, VIN = 0.5 V VOUT = 2.7 V IOZL IOS‡ VCC = 5.25 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0 V Ioff ICC VCC = 0 V, VCC = 5.25 V, VOUT = 4.5 V VIN ≤ 0.2V, ∆ICC VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, CEAB and OEAB = LOW, CEBA = HIGH, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V V W V 5 ±1 µA ±1 µA 15 µA –15 µA –120 –225 mA ±1 µA 0.1 0.2 mA 0.5 2 mA 0.06 1.2 mA/ MHz 0.7 1.4 VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 1.2 3.4 2.8 5.6|| VIN = 3.4 V or GND 5.1 14.6|| Ci 5 10 pF Co 9 12 pF ICCD¶ IC# VCC = 5.25 V, f0 = 10 MHz, Outputs open, CEAB and OEAB = LOW LOW, CEBA = HIGH, f0 = LEAB = 10 MHz –60 VIN ≥ VCC – 0.2 V One bit switching at f1 = 5 MHz at 50% duty cycle Eight bits switching at f1 = 5 MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V mA † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY74FCT2543T 8-BIT LATCHED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS042C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) CY74FCT2543T PARAMETER MIN CY74FCT2543AT MAX MIN MAX CY74FCT2543CT MIN MAX UNIT tw tsu Pulse duration, LEBA or LEAB low 5 5 5 ns Setup time, high or low A or B before LEBA↓ or LEAB↓ 2 2 2 ns th Hold time, high or low A or B after LEBA↓ or LEAB↓ 2 2 2 ns switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B tPLH tPHL CY74FCT2543T CY74FCT2543AT CY74FCT2543CT UNIT MIN MAX MIN MAX MIN MAX B or A 25 2.5 85 8.5 25 2.5 65 6.5 25 2.5 55 5.5 ns LEBA or LEAB A or B 25 2.5 12 5 12.5 25 2.5 8 25 2.5 7 ns tPZH tPZL A or B 2 12 2 9 2 8 OEBA or OEAB 2 12 2 9 2 8 tPZH tPZL 2 12 2 9 2 8 CEBA or CEAB A or B 2 12 2 9 2 8 A or B 2 9 2 7.5 2 6.5 OEBA or OEAB 2 9 2 7.5 2 6.5 A or B 2 9 2 7.5 2 6.5 CEBA or CEAB 2 9 2 7.5 2 6.5 tPHZ tPLZ tPHZ tPLZ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ns ns ns ns 5 CY74FCT2543T 8-BIT LATCHED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS042C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 5-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 74FCT2543ATSOCTE4 ACTIVE SOIC DW 24 TBD Call TI Call TI -40 to 85 74FCT2543ATSOCTG4 ACTIVE SOIC DW 24 TBD Call TI Call TI -40 to 85 CY74FCT2543ATQCT ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2543A CY74FCT2543ATSOC ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2543A CY74FCT2543ATSOCT OBSOLETE SOIC DW 24 TBD Call TI Call TI -40 to 85 CY74FCT2543CTQCT ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2543C CY74FCT2543CTSOC ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2543C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Aug-2014 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CY74FCT2543ATQCT SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT2543CTQCT SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT2543ATQCT SSOP DBQ 24 2500 367.0 367.0 38.0 CY74FCT2543CTQCT SSOP DBQ 24 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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