U3500
DATA SHEET
ZHEJIANG UNIU-NE Technology CO.,LTD
浙 江 宇 力 微 新 能 源 科 技 有 限 公 司
U3500 Data Sheet
V 3.0
版权归浙江宇力微新能源科技有限公司
www.uni-semic.com
0575-85087896
U3500
DATA SHEET
120V Input, Switching Current Limit Step-Down Converter
General Description
Key Features
The U3500 is a high-voltage, stepdown, switching regulator that drives
External power MOSFET with a current
limit of 10A, typically. The wide 10V to
120V input range accommodates a
variety of step-down applications, making
it ideal for automotive, industry, and
lighting applications. Hysteretic voltagemode control is employed for very fast
response. UNI’s proprietary feedback
control scheme minimizes the number of
required external components.
The switching frequency is 70KHz,
allowing for small component size.
Thermal shutdown and short-circuit
shutdown (SCS) provide reliable and
fault-tolerant operations. Low quiescent
current allows the U3500 to be used in
battery-powered applications.
The U3500 is available in a ESOP-8
package with an exposed pad.
Wide 10V to 120V Input Range
DC-DC 12V/10A Typical Switching Current
Application
Hysteretic Control: No Compensation
70KHz Switching Frequency
PWM Control Input for step-down
Application
Short-Circuit Shutdown (SCS) with
Integrated IC
Low Quiescent Current
Thermal Shutdown
Available in a ESOP-8 Package with an
Exposed Pad
Applications
Typical Application
Scooters, E-Bike Control Power Supplies
Solar Energy Systems
Automotive System Power
Industrial Power Supplies
High-Power LED Drivers
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U3500
DATA SHEET
Ordering Information
Part Number
Package
Vo
VIN MAX
Load Current
U3500
ESOP-8
>2V
120V
Io<=10A
Pin Description
Pin Functions
SOP-8 EP
SOP-8 EP
Pin #
Name
Description
1
VIN
Input supply. VIN supplies power toallofthe internal control circuitries , both BST regulators ,
and the high -side switch . A decoupling capacitor to ground must be placed close to VIN to
minimizeswitchingspikes.
2
EN
Enable input. Pull EN below the specified threshold to shut down the U3500. Pull EN
above the specified threshold or leave EN floating to enable the U3500.
3
FB
Feedback. FB is the input to the voltage hysteretic comparators. The average FB voltage
is maintained at 200mV by loop regulation.
4
BS
Bootstrap.Connected to a bootstrap diode 1N4148.
5
VB
Boot. BST is the positive power supply for the internal, floating, high-side MOSFET driver.
Connect a bypass capacitor between BST and SW.
6
SW
Switch node. SW is the output,drives External power MOSFET
7
VS
Switch source.Upper drive low potential
8
IS
Current detection. Current Sensing Input
9
EP-GND
Ground. GND should beplaced asclose to the output capacitor aspossible toavoid the highcurrentswitchpaths.ConnecttheexposedpadtoGNDplaneforoptimalthermalperformance.
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U3500
DATA SHEET
Block Diagram
Figure 1:Function Block Diagram
Absolute Maximum Ratings (Note 1)
Parameter
Value
Unit
-0.3 to 120
V
VB Supply Voltage
120+7
V
VB Clamp Current
1
mA
-0.3 to 7
V
Package Thermal Resistance ---Junction to Ambient (ESOP-8)
165
°C/W
Maximum Junction Temperature
160
°C
-65 to 150
°C
260
°C
3
kV
250
V
VIN,SW,VS Pin Voltage Range
FB, IS, EN Voltage Range
Storage Temperature Range
Lead Temperature (Soldering, 10sec.)
ESD Capability, HBM (Human Body Model)
ESD Capability, MM (Machine Model)
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U3500
DATA SHEET
Electrical Characteristics
VIN=60V, TA = +25°C, unless otherwise noted. Specifications over temperature are guaranteed by
design and characterization.
Parameter
Symbol
Condition
Min
Typ
Max
Units
VIN UVLO threshold
—
10.0
—
V
VIN UVLO hysteresis
—
0.4
—
V
Shutdown supply current
VEN = 0V
—
1.8
—
uA
Quiescent supply current
No load, DIM =low,VFB=1.25V
—
2.2
—
mA
—
500
—
mA
—
0.02
1.5
µA
Drive source current
IS(ON)
leakage current
ISWLK
Working frequency
Fsw
—
70
80
KHz
EN -on
VENH
—
2.8
7
V
EN -off
VENL
—
—
1
V
EN threshold hysteresis
VENHY
—
500
—
mV
VEN = 0V, VSW = 0V
EN input current
IENI
VEN = 5V
—
0.01
1.5
µA
EN pull-up current
IENS
VEN = 2V
—
2
3
µA
Feedback voltage threshold
VFBH
1.22
1.25
1.28
V
-800
—
800
nA
IFB
FB input current
FB propagation delay to output
(6)
high
FB propagation delay to output
(6)
high
Thermal shutdown
(7)
VFB = 5V or 0V
TFBDH
Falling edge of VFB from
1.25V to 0V to VSW rising edge
—
100
—
ns
TFBDL
Rising edge of VFB from 0V to
1.25V to VSW falling edge
—
100
—
ns
Trigger thermal shutdown
—
150
—
Hysteresis
—
20
—
℃
NOTES:
Note1:Stresses listed as the above “Maximum Ratings” may cause permanent damage to the device. These are
for stress ratings. Functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to maximum rating
conditions for extended periods may remain possibility to affect device reliability.
Note2:The device is not guaranteed to function outside its operating conditions.
Note3:Guaranteed by design.
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U3500
DATA SHEET
Typical Characteristics
VIN = 60V, TA = +25°C, unless otherwise noted.
Shutdown Current vs. Input Voltage
Quiesvent Current vs. Input Voltage
EN=LOW
EN=HIGH,DIM=LOW,VFB=1.25V
InputVoltage(V)
InputVoltage(V)
Shutdown Current vs. Temperature
Quiescent Current vs. Temperature
Junction Temperature(℃)
Junction Temperature(℃)
UVLO Threshold vs. Temperature
EN Threshold vs. Temperature
Junction Temperature(℃)
Junction Temperature(℃)
VIN=95V, EN=LOW
VIN=95V, DIM=LOW,EN=HIGH,VFB=250mV
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U3500
DATA SHEET
Typical Performance Characteristics
VIN = 60V, VOUT = 12V, IOUT = 1A, L = 47μH, COUT = 100μF, TA = +25°C, unless otherwise noted.
Efficiency vs. Output Current
Load Regulation
Output Current(mA)
Output Current(mA)
Line Regulation
Input Voltage(V)
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U3500
DATA SHEET
Operation
Hysteresis Current Control with Adaptive
Threshold Adjustment
The U3500 operates in a hysteretic voltagecontrol mode to regulate the output voltage. FB
is connected to the tap of a resistor divider,
which determines the output voltage. The
power MOSFET is turned on when the FB
voltage (VFB) rises to FBon and remains on
until VFB rises to FBoff. The power MOSFET is
turned off when VFB drops to FBoff and remains
off until VFB falls to FBon. The two thresholds of
FBon and FBoff are adjusted adaptively to
compensate for all the circuit delays, so the
output voltage is regulated with an average
1.25V value at FB.
Enable (EN) Control
The U3500 has a dedicated enable control pin
(EN) with positive logic. Its falling threshold is
2.5V, and its rising threshold is 2.8V .
When EN is pulled up to about 3V by an
internal current source, so it is enabled.
Floating Driver and Bootstrap Charging
The floating power MOSFET driver is powered
by an external bootstrap capacitor. This
floating driver has its own under-voltage
lockout (UVLO) protection. The UVLO rising
threshold is 10V with a threshold error of 0.2V.
The bootstrap capacitor is charged and
regulated to about 5V by the dedicated internal
bootstrap regulator.
If the internal circuit does not have sufficient
voltage, and the bootstrap capacitor is not
sufficiently charged, extra external circuitry can
be used to ensure that the bootstrap voltage is
in the normal operating region. Refer to the
External Bootstrap Diode section for more
details.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) is implemented to
protect the chip from operating at an insufficient
supply voltage. The UVLO rising threshold is
about 10V, while its falling threshold is a
consistent 9.5V.
Fast charging Function for USB Applications
Because the FB reference of the U3500 is very
flexible, it is recommended to use the U3500 for
USB Fast charging Applications by connecting
the current sense resistor between FB and GND.
Thermal Shutdown
Thermal shutdown is implemented to prevent the
chip from operating at exceedingly high
temperatures. When the silicon die temperature
is higher than its upper threshold, the entire chip
shuts down. When the temperature is lower
than its lower threshold, the chip is enabled
again.
Output Short Shutdown Protection
The output voltage is well-regulated when VFB is
around 1.25V. If the output is pulled Shutdown in
over-current protection (OCSP) or is shorted to
GND directly, VFB is low, Until the power
MOSFET is turned on again. The U3500 regards
the low VFB as a failure. The power MOSFET is
pulled Shutdown if the failure time is longer .
The power MOSFET current is also accurately
sensed via a current sense MOSFET. If the
current is over the current limit, the IC is is pulled
Shutdown. This offers extra protection under
output- short conditions.
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U3500
DATA SHEET
Application Information
recommended that the inductor current be
continuous in each switching period to prevent
reaching the current limit. Calculate the inductor
value with Equation (2):
Setting the Output Voltage
The output voltage (VOUT) is set by a resistor
divider (R1 and R2) (see the Typical Application
on page 1). To achieve good noise immunity
and low power loss, R2 is recommended to be
in the range of 1kΩ to 50kΩ. R1 can then be
determined with Equation (1):
V VFB
R1 OUT
R2
VFB
L
(VIN VOUT ) VOUT
FSW I OUT VIN K
(2)
Where K is a coefficient of about 0. 15 ~ 0.85
Output Rectifier Diode
The output rectifier diode supplies current to the
inductor when the high-side switch is off. To
reduce losses due to the diode forward voltage
and recovery times, use a Schottky diode. The
average current through the diode can be
approximated with Equation (3):
(1)
Where VFB is 1.25V, typically.
Output Capacitor and Frequency Setting
The output capacitor (COUT) is necessary for
achieving a smooth output voltage. The ESR of
the capacitor should be sufficiently large
compared to the capacitance; otherwise, the
system may behave in an unexpected way, and
the current ripple may be very
high.VFB
changes from 1.22V to 1.28V when the power
MOSFET switches on. To charge the capacitor
and generate 1.28V at FB, the system needs
ESR and some inductor current. For example,
for a 5V VOUT, if the forward capacitor is 0.1µF,
the suggested ESR range of the output
capacitor is 100mΩ to 250mΩ. Tantalum or
aluminum electrolytic capacitors with a small
ceramic capacitor are recommended.
A forward capacitor across R1 is recommended
when the output capacitor is tantalum or
aluminum electrolytic, which can set the desired
frequency if the output capacitor and ESR
cannot be changed. The forward capacitor can
reduce the output voltage ripple.
In some application, simply a forward capacitor
may not get proper frequency, then we can add
a forward resistor in series with the forward
capacitor or even more add a ceramic on the
output.
I D I OUT (1
VOUT
)
VIN
(3)
Choose a diode with a maximum reverse voltage
rating greater than the maximum input voltage
and a current rating is greater than the average
diode current.
Input Capacitor (CIN)
The input current to the step-down converter is
discontinuous and therefore requires a capacitor
to supply AC current to the step-down converter
while maintaining the DC input voltage. Use low
ESR capacitors for the best performance,
especially under high switching frequency
applications.
The RMS current through the input capacitor (4):
I IN _ AC I OUT
VOUT
V
(1 OUT ) (4)
VIN
VIN
With low ESR capacitors, the input voltage ripple
can be estimated with Equation (5):
VIN
I OUT VOUT
V
(1 OUT ) (5)
FSW C IN VIN
VIN
Choose an input capacitor with enough RMS
current rating and enough capacitance for small
input voltage ripples.
When electrolytic or tantalum capacitors are
applied, a small, high-quality ceramic capacitor
(i.e.: 0. 1μ F) should be placed as close to the IC
as possible.
Selecting the Inductor
The inductor (L) is required to convert the
switching voltage to a smooth current to the
load. Although the output current is low, it is
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U3500
DATA SHEET
External Bootstrap Diode
PCB Layout Guidelines
An external bootstrap diode may enhance the
efficiency of the converter (see Figure 2). An
external VB diode is recommended from the
BS supply to VB in the following cases:
There is a 5V rail available in the
system
IO is greater than 1A
This diode is also recommended for high duty
cycle operations (when VOUT / VIN > 65%) and
very high frequency applications.
The bootstrap diode can be a low-cost one,
such as FR107.
Efficient PCB layout is critical for stable operation.
For best results, refer to Figure 3 and follow the
guidelines below.
1. Place the input decoupling capacitor, catch
diode, and the U3500 (VIN, SW, and PGND)
as close to each other as possible.
2. Keep the power traces very short and fairly
wide, especially for the SW node.
This can help greatly reduce voltage spikes
on the SW node and lower the EMI noise
level.
3. Run the feedback trace as far from the
inductor and noisy power traces (like the SW
node) as possible.
4. Place thermal vias with 15mil barrel
diameter and 40mil pitch (distance between
the centers) under the exposed pad to
improve thermal conduction.
Figure 2: External Bootstrap Diode
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U3500
DATA SHEET
Typical Application Circuit
APP1: VOUT =12.5V, IOUT = 3A
2
APP2:VOUT =12.5V, IOUT = 10A
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U3500
DATA SHEET
APP3: , VOUT =12.5V, IOUT =10A(Short-Circuit Shutdown and Off-delay Application)
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U3500
DATA SHEET
Package Information
SOP-8 EP
NOTICE:
The information in this document is subject to change without notice. Users should warrant and guarantee that
third party Intellectual Property rights are not infringed upon when integrating UNI products into any application.
UNI will not assume any legal responsibility for any said applications.
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U3500
DATA SHEET
1.版本记录
DATE
REV.
DESCRIPTION
2018/04/ 19
1.0
First Release
2019/05/21
2.0
Package is changed SOP-8
2021/05/21
3.0
Package is changed to ESOP-8
2.免责声明
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3.联系我们
浙江宇力微新能源科技有限公司
总部地址:绍兴市越城区斗门街道袍渎路25号中节能科创园45幢4/5楼
电话:0575-85087896(研发部)
传真:0575-88125157
E-mail: htw@uni-semic.com
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电 话 : 0510-85297939
E-mail: zh@uni-semic.com
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电 话 :0755-84510976
E-mail: htw@uni-semic.com
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