X3S028375DK1H

Serial No.: AL190502007-00 H.ELE. Specifications for Approval PRODUCT TYPE Quartz Crystal HSX321S NOMINAL FREQUENCY 28.375000MHz H.ELE. SAMPLE O/N EOS-J40433-7 H.ELE. P/N X3S028375DK1H RELEASE DATE 2019/05/02 VERSION 00 MSL Level 1  Pb free  RoHS Compliant GREEN PRODUCT  HF-Halogen free  REACH Compliant CUSTOMER P/N APPLICATION & MODEL APPROVED BY CUSTOMER (DATE) Harmony Electronics Corp. F. S. TSAI (APPROVE) C. C. HOU (CHECK) KAOHSIUNG Country of Origin: Taiwan Factory Thailand Factory China Factory U. F. CHEN (PREPARE) HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND SHENZHEN DONGGUAN Email: contactus@hele.com.tw REV. No. DATE REASON 0 2019/05/02 New KAOHSIUNG REVISE CONTENTS HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 1 SHENZHEN DONGGUAN Email: contactus@hele.com.tw Contents ITEM PAGE 1. QUARTZ CRYSTAL UNIT SPECIFICATION 3 2. DIMENSIONS 4 3. MARKING 4 4. INSIDE STRUCTURE 5 5. HANDLING SUGGESTIONS 5-6 6. EMBOSS CARRIER TAPE&REEL 6-7 7. PACKAGE 7-8 8. MECHANICAL PERFORMANCE 8-9 9. ENVIRONMENTAL PERFORMANCE 9 10. APPENDIX KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 2 SHENZHEN DONGGUAN Email: contactus@hele.com.tw 1. QUARTZ CRYSTAL UNIT SPECIFICATION Electrical Spec. Items Min Type 1. Frequency (FL) 28.375000 2. Mode of oscillation: Fundamental 3. Frequency tolerance -20 4. Equivalent resistance (RR) Max Unit MHz +20 ppm 60 Ω 5. Storage temperature range -40 +85 ℃ 6. Operable temperature range -10 +60 ℃ 7. Temperature stability -30 +30 ppm 8. Loading capacitance (CL) 20.0 9. Drive level (DL) 10 10. Shunt Capacitance (C0) 11. Insulation resistance 100 μW 2.0 pF MΩ -3 13. Circuit: at 25℃±3℃ SERIES -10℃ ~ +60℃ pF 500 12. Aging: Notes +3 at DC 100V ppm/Year Measured in HP/E5100A,S&A 250B Note: Storage Temperature is only for the product itself. KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 3 SHENZHEN DONGGUAN Email: contactus@hele.com.tw 2. DIMENSION TOP VIEW 3.2±0.1 4 SIDE VIEW 0.7±0.1 3 TOP VIEW Internal Connection 3 4 2.5±0.1 Pin Connections #1 Crystal #2 GND/Lid #3 Crystal #4 GND/Lid #2,#4 GND(connection Cover) 1 2 #1(Index) TOP VIEW Land Pattern Layout BOTTOM VIEW 1.4 1.2 0.9 2 1 2 3 1.2 1.7 0.7 0.8 4 3 4 1 2 2.2 Tolerance: ±0.1 Unit: mm * Note: The Index mark was defined by the BASE suppliers. 3. MARKING Note: 1. Laser marking. 2. Date Code: Y=Year Code 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 0 1 2 3 4 5 6 7 8 9 M=Month Jan. Feb. Mar. Apr. May. Jun. Jul. Aug. Sep. Oct. Nov. Dec. Code A B C D E F G H J K L M KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 4 SHENZHEN DONGGUAN Email: contactus@hele.com.tw 4. INSIDE STRUCTURE Reference drawing No. Component (1) Base Material Ceramic (2) Lid Metal (3) Metal (5) Kovar Crystal Blank Electrode (6) PAD Metal (7) Connective Adhesive Silver Powder (4) Quartz Metal Note Al2O3 Fe- Ni –Co Ni Plating Fe- Ni -Co SiO2 Rectangular At-Cut W Ni Plating Au Plating Ag ※The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included in this item. 5. HANDLING SUGGESTION  Reflow Condition Please stay with our proposed reflow condition and do soldering within 2 times. (1) Preheat 160~180deg.C 120 sec. (2) Primary heat >=220 deg.C 100±20 sec. (3) Peak 260±5 deg.C 10 sec. Max.  Manual Solder iron (Example) Bit temp.: 350℃ max., Time: 3sec max. , Each terminal only should be soldered once.  Mounting Conditions Our products are suitable for most automated SMT processes. However, we strongly advise all our customers to conduct SMT sampling prior to mass production in order to make sure production processes will not affect the properties and specifications of our product. Seal welding and mounting procedures involving the use of ultra-sonic processes are not recommended and will affect and/or damage the internal properties of our product. Excessive shock during the mounting process will also affect the product and we strongly recommend setting SMT conditions to minimize such conditions. If a possibility of the PCB being warped exists we strongly advise to ensure the degree of warping will not affect the product. Please also ensure the operating characteristics and or soldering conditions are all within the specifications of use for our product. Ultimately the worst case scenario of all the above will lead to cases of non-oscillation but other negative effects are also likely should our products be used in an inappropriate way. Please note such cases of misuse and its related quality issues are not included in our product warranty. KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 5 SHENZHEN DONGGUAN Email: contactus@hele.com.tw  Cleansing Conditions General cleaning solutions may be used to clean our products but we always recommend testing to be performed prior to mass production processes. Ultrasonic cleaning procedures are not recommended and we strongly advise other forms of cleansing to be evaluated first. Unsuitable cleansing may lead to a number of negative effects such as damage to the product surface, discoloration of the product, corrosion of the package, package contamination, illegible marking, etc. Please note cases of unadvised treatment and its related quality issues are not included in our product warranty.  Storage Conditions Please ensure our products are preserved appropriately in their original packaging. Irregular environmental instances of moisture will affect our product’s stability and may cause problems such as frequency instability, soldering ability and conditions, package defects, and other problems. It is essential to keep our products in a clean dust-free environment out of direct sunlight. Our products’ storage conditions should at least meet the following condition: Environmental Temperature: + 40 degrees Celsius Maximum Relative Humidity: 80% Maximum Please note storage instances which do not conform to our guidelines and the related quality issues produced as an outcome are not included in our product warranty. 6. EMBOSS CARRIER TAPE AND REEL  Carrier Tape 1.55±0.05 4.0±0.1 8.0±0.2 3.5±0.05 0.25±0.05 1.75±0.1 2.0±0.05 3.4±0.1 4.0±0.1 1.0±0.1 2.7±0.1 User Direction of feed Terminal Empty Sealed Components Empty Sealed Ledder 80mm(Min) 400mm(Min) 40mm(min) Top Cover tape Embossed Carrier tape KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 6 SHENZHEN DONGGUAN Email: contactus@hele.com.tw  Reel 180+0/-3 13.2±0.5 60.5±0.5 12 0° 3.0±0.2 9.3±0.3 Standard Packing Quantity: 3,000PCS / REEL 11.3±1.0  Material of The Tape Tape Carrier tape Top tape Material PS Conductive PET  Joint of tape The carrier-tape and top cover-tape should not be jointed.  Release strength of cover tape The force should be controlled between 0.1N to 0.7N under following condition. Pulling direction: 165° to 180° Other standards shall be based on JIS C 0806-1990. Speed: 300mm/min. Otherwise unless specified. 7. PACKAGE Label Up side(Produce) Under side(Fixing Hole) One reel quantity: [1000pcs]&[3000pcs] KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 7 SHENZHEN DONGGUAN Email: contactus@hele.com.tw 1 Top and bottom with 2.3cm thickness foam-rubber cushion for protection 2 Carton's Q'TY:1~15 pcs. 3 Carton Type=A,B,C use 4 trigon pillar to fasten the Reel. 4 Need to add 3 pages dry agent in each outer box. 8. MECHANICAL PERFORMANCE Item Specifications Code Test Methods 1 Shock Dropping from 120 cm height 3 times on 30 mm Concrete floor. Refer to: JIS C 60068-2-32 A 2 Vibration Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. Refer to: JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 A 3 Leakage Test Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. Refer to: JIS C 60068-2-17 --- 4 Solder ability 5 Bending Strength After applying ROSIN Flux, dipping in solder bath at 245deg.C ±5deg.C for 3 ±0.5 sec. Refer to: JIS C 60068-2-20/ JIS C 60068-2-58 Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 ±1 sec. Pressure speed: 0.5 mm/sec. Refer to: EIAJ ET-7403/ JIS C 60068-2-21 KAOHSIUNG HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 8 SHENZHEN B A DONGGUAN Email: contactus@hele.com.tw 6 7 Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 10±1 sec. Refer to: EIAJ ET-7403 JIS C 60068-2-21 Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 10±1sec Refer to: EIAJ ET-7403 JIS C 60068-2-21 Adhesion Body strength A A 9. ENVIRONMENT PERFORMANCE Item 1 2 3 4 5 Specifications Code Test Methods Resistance of Soldering Heat Performing as the following reflow: Refer to: JIS C 60068-2-58 Humidity Temperature 60℃±2℃, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-3 A Storage in Low Temperature -40deg.C ±2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-1 A Storage in High Temperature +85deg.C ±2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-2 A Thermal shock -55deg.C ±2deg.C (30min) ↔ +125deg.C ±2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time≦3mins. Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 0025 A Specifications code A B KAOHSIUNG A Specifications FREQ. DRIFT: ±5 ppm Max, RESISTANCE DRIFT: ±15% or 2Ω More than 90% of lead shall be covered by new solder. HARMONY ELECTRONICS CORPRATION TAIPEI TEL: 886-2-26588883 THAILAND 9 SHENZHEN DONGGUAN Email: contactus@hele.com.tw FACTORY LOCATION HEAD OFFICE/TAIWAN FACTORY NO.39, HUADONG RD., DALIAO DIST., DAFA INDUSTRIAL PARK, KAOHSIUNG CITY 831. CHINA FACTORY SHEN ZHEN JU YUAN INDUSTRIAL PARK, QIAO TANG ROAD, TANG WEI COMMUNITY, FUYONG, BAOAN DISTRICT, SHEN ZHEN CITY (Post Code:518103). DONGGUAN BUILDING A1, HUAZHI INDUSTRIAL PARK, NO.38, JINGFU EAST ROAD, DALANG TOWN, DONGGUAN CITY. THAILAND FACTORY 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RATCHABURI PROVINCE 70110. SERVICE CENTER TAIPEI OFFICE 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN. TEL: 886-2-26588883 FAX: 886-2-26588683 CONTACT INFORMATION E-MAIL: contactus@hele.com.tw